专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20060219167A1 Apparatus and method of vacuum metallic sintering for a semiconductor 审中-公开
标题翻译：用于半导体的真空金属烧结的装置和方法
公开(公告)号：US20060219167A1
公开(公告)日：2006-10-05
申请号：US11094279
申请日：2005-03-31
申请人： Hung-Lung Cheng , Hui-Chung Wu , Chi-Chen Lee
发明人： Hung-Lung Cheng , Hui-Chung Wu , Chi-Chen Lee
IPC分类号： H01L21/22
CPC分类号： H01L21/324 , H01L21/67017 , H01L21/67109 , H01L21/67754
摘要： An apparatus and method of vacuum metallic sintering for a semiconductor uses a quartz tube, a vacuum air-extracting apparatus, a furnace and a gas injection pipe. The metal sintered does not produce metal oxide in a vacuum established by the vacuum air-extracting apparatus. After sintering, a movable furnace can withdraw from the quartz tube immediately to decrease cooling time.
摘要翻译：用于半导体的真空金属烧结的装置和方法使用石英管，真空抽气装置，炉和气体注入管。烧结的金属在由真空抽气装置建立的真空中不产生金属氧化物。烧结后，立即从石英管退出可移动炉，减少冷却时间。

2. 发明申请

US20100035300A1 Producing a Target Protein Using Intramolecular Cleavage by TEV Protease 审中-公开
标题翻译：通过TEV蛋白酶分子内切割产生靶蛋白
公开(公告)号：US20100035300A1
公开(公告)日：2010-02-11
申请号：US11364716
申请日：2006-02-27
申请人： Andrew H.-J. Wang , Ting-Fang Wang , Yan-Ping Shih , Hui-Chung Wu , Su-Ming Hu
发明人： Andrew H.-J. Wang , Ting-Fang Wang , Yan-Ping Shih , Hui-Chung Wu , Su-Ming Hu
IPC分类号： C12P21/00 , C12N1/20
CPC分类号： C12P21/06 , C07K2319/50 , C12N9/503
摘要： A cis-TEVP fusion protein including a TEVP protease, a TEVP cleavage site and a target protein provide a platform for expression of the target protein. A trans-TEVP fusion protein including a TEVP cleavage site and a target protein, the amino-terminal portion of the target protein adjacent to the C-terminal portion of the TEVP cleavage site, the amino acidic residue in position P2 of the TEVP cleavage site being a Valine also produces the target protein by the same process. A cis-TEVP fusion protein system comprising the first fusion protein and a suitable host cell; a trans-TEVP fusion protein system comprising the second fusion protein and a suitable host cell; associated methods to produce target proteins, and kits of parts are also disclosed herein.
摘要翻译：包含TEVP蛋白酶，TEVP切割位点和靶蛋白的顺式TEVP融合蛋白提供靶蛋白表达的平台。包含TEVP切割位点和靶蛋白的TETEP融合蛋白，与TEVP切割位点的C末端部分相邻的靶蛋白的氨基末端部分，TEVP切割位点P2位置的氨基酸残基作为缬氨酸也通过相同的过程产生靶蛋白。包含第一融合蛋白和合适宿主细胞的顺-TEVP融合蛋白系统; 包含第二融合蛋白和合适的宿主细胞的反TEVP融合蛋白系统; 本文还公开了产生靶蛋白的相关方法和成分的试剂盒。

3. 发明申请

US20080271837A1 Adhesive tape adhering device for wafers and method of adhering adhesive tape on wafers 审中-公开
标题翻译：用于晶片的胶带粘合装置以及将粘合带粘附在晶片上的方法
公开(公告)号：US20080271837A1
公开(公告)日：2008-11-06
申请号：US11797307
申请日：2007-05-02
申请人： Hui-Chung Wu , Hsun-Min Lee
发明人： Hui-Chung Wu , Hsun-Min Lee
IPC分类号： B65B11/02
CPC分类号： H01L21/6836 , B29C63/02 , B29C2793/00 , H01L21/67132 , H01L2221/68327
摘要： An adhesive tape adhering device includes a table unit, a wafer bearing unit, an adhesive tape pull-tight unit, an adhesive tape clipping unit, and a rolling unit. The wafer bearing unit movably disposes on the table unit upwardly and downwardly for bearing a wafer. The adhesive tape pull-tight unit has a bundle of adhesive tape, and the adhesive tape pull-tight unit disposes on the table unit and next to one side of the wafer bearing unit. The adhesive tape clipping unit disposes on the table unit and next to the other side of the wafer bearing unit for tightly clipping an end side of a tape of the bundle of adhesive tape. The rolling unit slidably disposes on the table unit and next to the other side of the wafer bearing unit for uniformly rolling, pressing and adhering the adhesive tape on the at least one wafer
摘要翻译：胶带粘合装置包括台单元，晶片轴承单元，胶带拉紧单元，胶带夹紧单元和滚动单元。晶片承载单元可移动地向上和向下配置在桌子单元上用于承载晶片。胶带拉紧单元具有一束胶带，并且胶带拉紧单元配置在桌子单元上并且靠近晶片轴承单元的一侧。胶带夹单元配置在桌面单元上，并且紧邻晶片轴承单元的另一侧，用于紧密地夹住胶带束的带的端侧。滚动单元可滑动地布置在桌子单元上并且紧邻晶片轴承单元的另一侧，用于均匀地滚动，压合和粘合至少一个晶片上的胶带

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式