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1. 发明申请

US20070087467A1 CMOS image sensor 有权
标题翻译： CMOS图像传感器
公开(公告)号：US20070087467A1
公开(公告)日：2007-04-19
申请号：US11253956
申请日：2005-10-19
申请人： Hung-Jen Hsu , Fu-Tien Wong
发明人： Hung-Jen Hsu , Fu-Tien Wong
IPC分类号： H01L21/00 , H01L23/02
CPC分类号： H01L27/14632 , H01L27/14627 , H01L27/14645 , H01L27/14685 , H01L27/14687 , H01L27/14689 , Y10S438/975
摘要： A method for forming an image sensor device. An alignment mark is formed on or in a substrate with distance from the alignment mark to the substrate edge less than about 3 mm. An array of active photosensing pixels is formed on the substrate. At least one dielectric layer is formed covering the substrate and the array. A color filter photoresist is formed on the least one dielectric layer. Subsequent to removal of the color filter photoresist from the alignment mark, the color filter photoresist is exposed with alignment to the alignment mark.
摘要翻译：一种用于形成图像传感器装置的方法。在距离对准标记至基板边缘的距离小于约3mm的基板上或基板上形成对准标记。在衬底上形成有活性感光像素阵列。形成覆盖基板和阵列的至少一个电介质层。在至少一个电介质层上形成滤色器光致抗蚀剂。在从对准标记移除滤色器光致抗蚀剂之后，将滤色器光致抗蚀剂与对准标记对齐地曝光。

2. 发明申请

US20050001281A1 Process to improve image sensor sensitivity 审中-公开
标题翻译：提高图像传感器灵敏度的过程
公开(公告)号：US20050001281A1
公开(公告)日：2005-01-06
申请号：US10858443
申请日：2004-06-01
申请人： Hung-Jen Hsu , Chiu-Kung Chang , Fu-Tien Wong , Te-Fu Tseng
发明人： Hung-Jen Hsu , Chiu-Kung Chang , Fu-Tien Wong , Te-Fu Tseng
IPC分类号： G02B3/00 , G02B27/09 , H01L27/146 , H01L27/148 , H04N5/335 , G02B9/00
CPC分类号： G02B3/0012 , G02B3/0056 , G02B27/09
摘要： A packaged image sensing device of improved sensitivity is formed by providing a mechanism for enhancing the focusing of embedded microlenses on the photosensitive elements of the image sensor. Normally, the bonding material interposed between the packaging layers and the microlenses defocuses the microlenses. In one embodiment of the present invention, the focus is restored by interposing an intermediate optically refractive layer between the bonding material and the lenses. In another embodiment, a bonding material with a lower index of refraction is used. In a final embodiment, the microlenses are formed in a material of a higher index of refraction.
摘要翻译：通过提供用于增强嵌入式微透镜在图像传感器的感光元件上的聚焦的机构来形成具有改进的灵敏度的封装图像感测装置。通常，插入在包装层和微透镜之间的接合材料使微透镜散焦。在本发明的一个实施例中，通过在接合材料和透镜之间插入中间光学折射层来恢复焦点。在另一个实施例中，使用具有较低折射率的接合材料。在最终实施例中，微透镜形成为具有较高折射率的材料。

3. 发明授权

US07126099B2 Image sensor with improved uniformity of effective incident light 有权
标题翻译：具有改善有效入射光均匀性的图像传感器
公开(公告)号：US07126099B2
公开(公告)日：2006-10-24
申请号：US10649436
申请日：2003-08-26
申请人： Hung-Jen Hsu , Chiu-Kung Chang , Chung-Sheng Hsiung , Fu-Tien Wong
发明人： Hung-Jen Hsu , Chiu-Kung Chang , Chung-Sheng Hsiung , Fu-Tien Wong
IPC分类号： H01L27/00 , H01L31/0232 , H04N3/14 , G02B27/10
CPC分类号： H01L27/14643 , H01L27/14621 , H01L27/14627
摘要： An image sensor improving the uniformity of effective incident light. In one example, the size of microlenses disposed in different regions of the image sensor is changed to balance the brightness in different regions, in which the size of each microlens is a function of the distance between the microlens to the chip center In another example, the distance between the center of the microlens and the center of the corresponding sensing area is changed to balance the brightness in different regions and the corresponding color filters are shifted such that the microlens is overlying a corresponding color filter unit without overlying adjacent regions thereof, in which the distance between the center of the microlens and the center of the corresponding sensing area is a function of the distance between the corresponding sensing area to the chip center.
摘要翻译：一种改善有效入射光均匀性的图像传感器。在一个示例中，设置在图像传感器的不同区域中的微透镜的尺寸被改变以平衡不同区域中的亮度，其中每个微透镜的尺寸是微透镜与芯片中心之间的距离的函数。在另一示例中，改变微透镜的中心与相应感测区域的中心之间的距离，以平衡不同区域中的亮度，并且相应的滤色器被移位，使得微透镜覆盖相应的滤色器单元而不覆盖其相邻区域，其中微透镜的中心与相应感测区域的中心之间的距离是与芯片中心的相应感测区域之间的距离的函数。

4. 发明申请

US20050045803A1 Image sensor with improved uniformity of effective incident light 有权
标题翻译：具有改善有效入射光均匀性的图像传感器
公开(公告)号：US20050045803A1
公开(公告)日：2005-03-03
申请号：US10649436
申请日：2003-08-26
申请人： Hung-Jen Hsu , Chiu-Kung Chang , Chung-Sheng Hsiung , Fu-Tien Wong
发明人： Hung-Jen Hsu , Chiu-Kung Chang , Chung-Sheng Hsiung , Fu-Tien Wong
IPC分类号： G02B3/00 , H01L27/00 , H01L27/14 , H01L27/146 , H04N5/335
CPC分类号： H01L27/14643 , H01L27/14621 , H01L27/14627
摘要： An image sensor improving the uniformity of effective incident light. In one example, the size of microlenses disposed in different regions of the image sensor is changed to balance the brightness in different regions, in which the size of each microlens is a function of the distance between the microlens to the chip center In another example, the distance between the center of the microlens and the center of the corresponding sensing area is changed to balance the brightness in different regions and the corresponding color filters are shifted such that the microlens is overlying a corresponding color filter unit without overlying adjacent regions thereof, in which the distance between the center of the microlens and the center of the corresponding sensing area is a function of the distance between the corresponding sensing area to the chip center.
摘要翻译：一种改善有效入射光均匀性的图像传感器。在一个示例中，设置在图像传感器的不同区域中的微透镜的尺寸被改变以平衡不同区域中的亮度，其中每个微透镜的尺寸是微透镜与芯片中心之间的距离的函数。在另一示例中，改变微透镜的中心与相应感测区域的中心之间的距离，以平衡不同区域中的亮度，并且相应的滤色器被移位，使得微透镜覆盖相应的滤色器单元而不覆盖其相邻区域，其中微透镜的中心与相应感测区域的中心之间的距离是与芯片中心的相应感测区域之间的距离的函数。

5. 发明授权

US07508084B2 CMOS image sensor 有权
标题翻译： CMOS图像传感器
公开(公告)号：US07508084B2
公开(公告)日：2009-03-24
申请号：US11253956
申请日：2005-10-19
申请人： Hung-Jen Hsu , Fu-Tien Wong
发明人： Hung-Jen Hsu , Fu-Tien Wong
IPC分类号： H01L23/544 , H01L21/76 , H01L21/00
CPC分类号： H01L27/14632 , H01L27/14627 , H01L27/14645 , H01L27/14685 , H01L27/14687 , H01L27/14689 , Y10S438/975
摘要： A method for forming an image sensor device. An alignment mark is formed on or in a substrate with distance from the alignment mark to the substrate edge less than about 3 mm. An array of active photosensing pixels is formed on the substrate. At least one dielectric layer is formed covering the substrate and the array. A color filter photoresist is formed on the least one dielectric layer. Subsequent to removal of the color filter photoresist from the alignment mark, the color filter photoresist is exposed with alignment to the alignment mark.
摘要翻译：一种用于形成图像传感器装置的方法。在距离对准标记至基板边缘的距离小于约3mm的基板上或基板上形成对准标记。在衬底上形成有活性感光像素阵列。形成覆盖基板和阵列的至少一个电介质层。在至少一个电介质层上形成滤色器光致抗蚀剂。在从对准标记移除滤色器光致抗蚀剂之后，将滤色器光致抗蚀剂与对准标记对齐地曝光。

6. 发明授权

US06849533B2 Method for fabricating microelectronic product with attenuated bond pad corrosion 有权
标题翻译：用于制造具有减弱的焊盘腐蚀的微电子产品的方法
公开(公告)号：US06849533B2
公开(公告)日：2005-02-01
申请号：US10354697
申请日：2003-01-29
申请人： Chih-Kung Chang , Yu-Kung Hsiao , Sheng-Liang Pan , Fu-Tien Wong , Chin-Chen Kuo , Chung-Sheng Hsiung , Hung-Jen Hsu , Yi-Ming Dai , Po-Wen Lin , Te-Fu Tseng
发明人： Chih-Kung Chang , Yu-Kung Hsiao , Sheng-Liang Pan , Fu-Tien Wong , Chin-Chen Kuo , Chung-Sheng Hsiung , Hung-Jen Hsu , Yi-Ming Dai , Po-Wen Lin , Te-Fu Tseng
IPC分类号： H01L21/44 , H01L21/60
CPC分类号： H01L24/11 , H01L27/14621 , H01L27/14627 , H01L27/14685 , H01L2224/13099 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/12043 , H01L2924/14 , H01L2924/15787 , H01L2924/19042 , H01L2924/00
摘要： A method for fabricating a microelectronic product provides for forming a planarizing layer upon a bond pad and a topographic feature, both formed laterally separated over a substrate. The planarizing layer is formed with a diminished thickness upon the bond pad such that it may be readily etched to expose the bond pad while employing as a mask an additional layer formed over the topographic feature but not over the bond pad. The method is particularly useful for forming color filter sensor image array optoelectronic products with attenuated bond pad corrosion.
摘要翻译：用于制造微电子产品的方法提供了在接合焊盘和地形特征上形成平坦化层，两者均形成在衬底上横向分离。平坦化层在接合焊盘上形成为具有减小的厚度，使得其可以容易地蚀刻以暴露接合焊盘，同时使用形成在地形特征上但不在接合焊盘上的附加层作为掩模。该方法对于形成具有减弱的键合垫腐蚀的滤色器传感器图像阵列光电产品特别有用。

7. 发明授权

US07553689B2 Semiconductor device with micro-lens and method of making the same 有权
标题翻译：具有微透镜的半导体器件及其制造方法
公开(公告)号：US07553689B2
公开(公告)日：2009-06-30
申请号：US11181189
申请日：2005-07-13
申请人： Jeng-Shyan Lin , Chien-Hsien Tseng , Shou-Gwo Wuu , Ho-Ching Chien , Dun-Nian Yaung , Hung-Jen Hsu
发明人： Jeng-Shyan Lin , Chien-Hsien Tseng , Shou-Gwo Wuu , Ho-Ching Chien , Dun-Nian Yaung , Hung-Jen Hsu
IPC分类号： H01L21/00
CPC分类号： H01L27/14685 , H01L27/14623 , H01L27/14627 , H01L27/14632
摘要： A semiconductor device including a semiconductor substrate having a photosensor formed therein; a first layer overlying the substrate, the first layer includes a portion having a generally concave shaped surface being the negative shaped of a micro-lens to be formed there over; a second layer overlying the first layer, the second layer including a generally convex shaped portion vertically aligned with and mating with the generally concave shaped surface, the generally convex shaped portion being constructed and arranged to define a micro-lens positioned to cause parallel light passing through the micro-lens to converge on and strike the photosensor.
摘要翻译：一种半导体器件，包括其中形成有光电传感器的半导体衬底; 覆盖衬底的第一层，第一层包括具有大致凹形形状的表面的部分，其为在其上形成的微透镜的负形状; 覆盖第一层的第二层，第二层包括垂直对准并与大致凹形的表面配合的大致凸形的部分，大体上凸形的部分被构造和布置以限定微透镜，定位成使得平行光通过通过微透镜收敛并撞击光电传感器。

8. 发明申请

US20090104547A1 IMAGE SENSOR 有权
标题翻译：图像传感器
公开(公告)号：US20090104547A1
公开(公告)日：2009-04-23
申请号：US12347427
申请日：2008-12-31
申请人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
发明人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
IPC分类号： G03F3/00
CPC分类号： H01L27/14625 , H01L23/544 , H01L27/14621 , H01L27/14627 , H01L27/14685 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
摘要翻译：提供了一种处理衬底的方法。衬底具有至少一个滤波器区域，多个接合焊盘以及围绕滤波器区域和接合焊盘布置的多个划线。在衬底上形成第一平坦化层。平坦化层具有覆盖过滤器区域，接合焊盘和划线的基本平坦的顶表面。在第一平坦化层和滤波器区域内形成至少一个抗蚀剂层，同时第一平坦化层覆盖接合焊盘和划线。

9. 发明申请

US20060019424A1 Image sensor fabrication method and structure 有权
公开(公告)号：US20060019424A1
公开(公告)日：2006-01-26
申请号：US11156794
申请日：2005-06-20
申请人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
发明人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
IPC分类号： H01L21/00
CPC分类号： H01L27/14625 , H01L23/544 , H01L27/14621 , H01L27/14627 , H01L27/14685 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.

10. 发明授权

US08129762B2 Image sensor 有权
标题翻译：图像传感器
公开(公告)号：US08129762B2
公开(公告)日：2012-03-06
申请号：US12347427
申请日：2008-12-31
申请人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
发明人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
IPC分类号： H01L27/148
CPC分类号： H01L27/14625 , H01L23/544 , H01L27/14621 , H01L27/14627 , H01L27/14685 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
摘要翻译：提供了一种处理衬底的方法。衬底具有至少一个滤波器区域，多个接合焊盘以及围绕滤波器区域和接合焊盘布置的多个划线。在衬底上形成第一平坦化层。平坦化层具有覆盖过滤器区域，接合焊盘和划线的基本平坦的顶表面。在第一平坦化层和滤波器区域内形成至少一个抗蚀剂层，同时第一平坦化层覆盖接合焊盘和划线。

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