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    • 7. 发明申请
    • Wafer guides for processing semiconductor substrates
    • 用于处理半导体衬底的晶片导板
    • US20060027513A1
    • 2006-02-09
    • US11234033
    • 2005-09-24
    • Pil-Kwon JunSang-oh ParkYong-Kyun KoHun-Jung Yi
    • Pil-Kwon JunSang-oh ParkYong-Kyun KoHun-Jung Yi
    • A47G19/08
    • H01L21/67326B65D25/103H01L21/67057Y10S134/902
    • A wafer guide used in cleaning and/or drying processes of semiconductor wafers is provided. The wafer guide includes a horizontal support panel and at least three vertical panels attached on one surface of the support panel. Each of the vertical panels has a vertical body panel and a plurality of protrusions upwardly extended from a top surface of the vertical body panel. Gap regions between the protrusions act as slots for holding wafers. Sidewalls of the slots have a convex shaped profile when viewed from a top view, and bottom surfaces of the slots also have a convex shaped profile when viewed from a cross sectional view that crosses the vertical panels. Accordingly, contact areas between the wafers and the wafer guide are reduced to improve a drying efficiency of the wafers.
    • 提供了用于半导体晶片的清洁和/或干燥处理的晶片引导件。 晶片引导件包括水平支撑面板和至少三个垂直面板,其附接在支撑面板的一个表面上。 每个垂直面板具有垂直的主体面板和从垂直主体面板的顶面向上延伸的多个突起。 突起之间的间隙区域用作保持晶片的槽。 当从顶视图观察时,槽的侧壁具有凸形的轮廓,并且当从横切垂直板的横截面视图观察时,槽的底表面也具有凸形轮廓。 因此,晶片和晶片引导件之间的接触面积减小,以提高晶片的干燥效率。