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1. 发明公开

EP4358667A1 ELECTRONIC ASSEMBLY AND ELECTRONIC DEVICE 审中-实审
公开(公告)号：EP4358667A1
公开(公告)日：2024-04-24
申请号：EP23205148.2
申请日：2023-10-23
申请人： Huawei Digital Power Technologies Co., Ltd.
发明人： GAO, Qiang , WEI, Longhe , QIU, Yongqi , LIU, Jihui , HUANG, Xinquan
IPC分类号： H05K7/20 , H01L23/473
CPC分类号： Y02T10/7072 , Y02T10/70 , Y02T90/12 , H05K7/20927 , H01L23/473 , H01L23/3672
摘要： This application provides an electronic assembly and an electronic device. The electronic assembly includes a circuit board assembly and a liquid cold plate. The circuit board assembly includes a board, a first heat-generating component, and a second heat-generating component, where the first heat-generating component and the second heat-generating component are disposed on the board. The liquid cold plate includes a liquid inlet and a liquid outlet. A cooling working medium flows into the liquid cold plate from the liquid inlet, and flows out of the liquid cold plate from the liquid outlet. The liquid cold plate includes a first cooling region and a second cooling region, where the second cooling region is closer to the liquid outlet than the first cooling region. The cooling working medium first flows through the first cooling region from the liquid inlet, and then flows to the second cooling region. A heat dissipation capability of the first cooling region is stronger than that of the second cooling region. A heat-generating density of the first heat-generating component is greater than that of the second heat-generating component, the first heat-generating component is thermally connected to the first cooling region, and the second heat-generating component is thermally connected to the second cooling region. In this way, a heat dissipation capability of the liquid cold plate is appropriately utilized to improve effects of dissipating heat for the first heat-generating component and the second heat-generating component and also reduce energy consumption.

2. 发明公开

EP4271154A1 POWER HOST AND POWER SUPPLY SYSTEM 审中-实审
公开(公告)号：EP4271154A1
公开(公告)日：2023-11-01
申请号：EP23164511.0
申请日：2023-03-28
申请人： Huawei Digital Power Technologies Co., Ltd.
发明人： LIU, Jihui , WEI, Longhe , LIAN, Zhisheng
IPC分类号： H05K7/20
摘要： This application discloses a power host and a power supply system. In the power host, a first heat exchange fin (204a) and a second heat exchange fin (204b) of a first heat exchanger are disposed on a same outer surface of a housing (201) and each are disposed obliquely relative to the housing, the first heat exchange fin (204a) includes a first side edge (208a) and a second side edge (208b), the second heat exchange fin (204b) includes a third side edge and a fourth side edge, the first side edge and the third side edge are fastened on a surface of the housing (201), and a first spacing between the second side edge (208b) and the fourth side edge is greater than a second spacing between the first side edge (208a) and the third side edge; the first heat exchanger is connected to a power apparatus, and the first heat exchanger is configured to exchange heat with the power apparatus; and one or more first fans (203a, 203b) are configured to dissipate heat for a thermally conductive medium in the first heat exchanger. In this application, air intake on the two heat exchange fins (204a, 204b) of the first heat exchanger is even, and the two heat exchange fins (204a, 204b) are disposed obliquely relative to a housing (201) of the power apparatus, so that a heat dissipation area is increased, and overall heat dissipation efficiency of the power host is improved.

3. 发明公开

EP4023997A1 HEAT EXCHANGE PLATE AND HEAT EXCHANGER CONTAINING SAME 有权
公开(公告)号：EP4023997A1
公开(公告)日：2022-07-06
申请号：EP20885438.0
申请日：2020-11-05
申请人： Huawei Digital Power Technologies Co., Ltd.
发明人： YANG, Zonghao , LI, Malin , LIU, Jihui
IPC分类号： F28F3/06 , F28D9/00
摘要： Embodiments of this application provide a heat exchange plate and a heat exchanger including the heat exchange plate. The heat exchange plate includes: a base board, where the base board includes a first edge along a first direction and a second edge along a second direction, and the first direction and the second direction are different directions; first flow guiders, where the first flow guiders are disposed on the base board, and are configured to guide flowing of air flows, where a plurality of the first flow guiders are arranged along the first direction at intervals into one column, and a plurality of columns of the first flow guiders are arranged along the second direction at intervals; and supporting structures, where the supporting structures are disposed on the base board, the supporting structures extend along the first direction, and the supporting structures and each column of the first flow guiders are arranged alternately along the second direction at intervals. The heat exchange plate provided in this application can guide air passing through the heat exchanger, to enable air flows to flow along a flow guide direction, thereby improving heat exchange efficiency of the heat exchanger for the air flows.

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