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    • 4. 发明公开
    • HEAT EXCHANGE MODULE AND CABINET
    • EP4181641A1
    • 2023-05-17
    • EP20945299.4
    • 2020-07-15
    • Huawei Digital Power Technologies Co., Ltd.
    • LIAN, ZhishengZHANG, XuechaoLI, HengquWANG, Hongbing
    • H05K7/20F24F7/06
    • This application provides a heat exchange module and a cabinet. The heat exchange module is used in the cabinet. The cabinet further includes a cabinet body. The cabinet body has a first space and a second space. A temperature of the first space is higher than a temperature of the second space. The heat exchange module has a first air circulation system and a second air circulation system, and heat exchange may be performed between the first air circulation system and the second air circulation system. Both an air intake vent and an air exhaust vent of the first air circulation system are configured to be connected to the first space. An air exhaust vent of the second air circulation system is connected to an external space, and an air intake vent of the second air circulation system can be configured to be selectively connected to the external space and/or the second space. The air intake vent of the second air circulation system may be selected to obtain air from the external space and/or the second space according to heat dissipation requirements of the first space and the second space. Heat dissipation of the first space and/or the second space can be implemented by using one heat exchange module. Therefore, flexibility is high.
    • 5. 发明公开
    • POWER HOST AND POWER SUPPLY SYSTEM
    • EP4271154A1
    • 2023-11-01
    • EP23164511.0
    • 2023-03-28
    • Huawei Digital Power Technologies Co., Ltd.
    • LIU, JihuiWEI, LongheLIAN, Zhisheng
    • H05K7/20
    • This application discloses a power host and a power supply system. In the power host, a first heat exchange fin (204a) and a second heat exchange fin (204b) of a first heat exchanger are disposed on a same outer surface of a housing (201) and each are disposed obliquely relative to the housing, the first heat exchange fin (204a) includes a first side edge (208a) and a second side edge (208b), the second heat exchange fin (204b) includes a third side edge and a fourth side edge, the first side edge and the third side edge are fastened on a surface of the housing (201), and a first spacing between the second side edge (208b) and the fourth side edge is greater than a second spacing between the first side edge (208a) and the third side edge; the first heat exchanger is connected to a power apparatus, and the first heat exchanger is configured to exchange heat with the power apparatus; and one or more first fans (203a, 203b) are configured to dissipate heat for a thermally conductive medium in the first heat exchanger. In this application, air intake on the two heat exchange fins (204a, 204b) of the first heat exchanger is even, and the two heat exchange fins (204a, 204b) are disposed obliquely relative to a housing (201) of the power apparatus, so that a heat dissipation area is increased, and overall heat dissipation efficiency of the power host is improved.
    • 7. 发明公开
    • HEAT DISSIPATING CABINET AND COMMUNICATION DEVICE
    • EP4138528A1
    • 2023-02-22
    • EP20934736.8
    • 2020-05-06
    • Huawei Digital Power Technologies Co., Ltd.
    • LIAN, ZhishengFENG, TaoXU, Shulong
    • H05K7/20
    • Embodiments of this application provide a heat dissipation cabinet and a communication device. The heat dissipation cabinet includes a cabinet body, a cabinet door, and a baffle. The cabinet body includes a top wall and a bottom wall that are oppositely disposed, and a side wall connected between the top wall and the bottom wall. The cabinet door is installed at a position of the side wall in the cabinet body, and an air outlet passage is disposed in the cabinet body that is close to a position of the top wall. An air inlet component and an air outlet component are disposed in the cabinet door, and the air outlet component is located between the air inlet component and the top wall, and is located at one end of the air outlet passage. An electronic apparatus placement area is disposed in the cabinet body, and the baffle is disposed between the electronic apparatus placement area and the cabinet door. The baffle includes a first opening, so that air that enters through the air inlet component directly enters the electronic apparatus placement area through the first opening. The heat dissipation cabinet provided in this embodiment of this application improves a heat dissipation effect of the heat dissipation cabinet, and ensures a heat dissipation effect of an electronic apparatus in the heat dissipation cabinet.
    • 8. 发明公开
    • HEAT EXCHANGER, CABINET, AND COMMUNICATIONS BASE STATION
    • EP4067799A1
    • 2022-10-05
    • EP22163741.6
    • 2022-03-23
    • Huawei Digital Power Technologies Co., Ltd.
    • CHEN, JunHUI, XiaoweiLIAN, Zhisheng
    • F28D1/047F28D1/053F28D1/04F28D15/02H05K7/20F28D1/02
    • This application belongs to the field of heat exchange device technologies, and in particular, to a heat exchanger, a cabinet, and a communications base station. The heat exchanger includes a vapor collection pipe, a liquid collection pipe, and an exchange pipeline. The exchange pipeline includes a condensing section, an evaporation section, and a transition section. An upper end of the condensing section is connected to the vapor collection pipe. A lower end of the condensing section is connected to a first end of the transition section. An upper end of the evaporation section is connected to a second end of the transition section. A lower end of the evaporation section is connected to the liquid collection pipe. The evaporation section and the condensing section respectively extend in directions opposite to each other. An included angle between an axis of the evaporation section and an axis of the transition section is greater than or equal to 60° and less than 180°. An included angle between an axis of the condensing section and the axis of the transition section is greater than or equal to 60° and less than 180°. For the heat exchanger, heat exchange efficiency of the heat exchanger is improved, and structure simplification and volume optimization of the heat exchanger are also implemented, to reduce the manufacturing costs of the heat exchanger and improve manufacturing efficiency of the heat exchanger.