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    • 1. 发明授权
    • Index guided vertical cavity surface emitting lasers
    • 索引引导垂直腔表面发射激光器
    • US06822993B2
    • 2004-11-23
    • US10338137
    • 2003-01-08
    • Hsing-Chung LeeLiew-Chuang Chui
    • Hsing-Chung LeeLiew-Chuang Chui
    • H01S500
    • H01S5/18316H01S5/18333H01S5/2063
    • Planar index guided vertical cavity surface emitting laser (PIG VCSEL) utilizes index guiding to provide improved optical confinement and proton implantation to improve current confinement. Index guiding is achieved by etching index guide openings (holes or partial ridges) around the optical confinement region and may be adjusted by varying the etched volume of the index guide openings (holes and partial ridges). The top contact surface area is increased in the PIG VCSEL thereby lowering contact and device resistance to improve VCSEL performance further. The PIG VCSEL is a substantially planarized device for ease of manufacture.
    • 平面折射率引导垂直腔面发射激光器(PIG VCSEL)利用指数引导提供改进的光限制和质子注入,以改善电流限制。 通过在光学限制区域周围蚀刻引导引导开口(孔或部分脊)来实现引导引导,并且可以通过改变引导引导开口(孔和部分脊)的蚀刻体积来调整引导引导。 在PIG VCSEL中,顶部接触表面积增加,从而降低接触和器件电阻,从而进一步提高VCSEL性能。 PIG VCSEL是一种基本上平面化的器件,易于制造。
    • 4. 发明申请
    • LASER ANNEALING OF METAL OXIDE SEMICONDUCTOR ON TEMPERATURE SENSITIVE SUBSTRATE FORMATIONS
    • 金属氧化物半导体在温度敏感基板上的激光退火
    • US20110062431A1
    • 2011-03-17
    • US12874145
    • 2010-09-01
    • Chan-Long ShiehHsing-Chung Lee
    • Chan-Long ShiehHsing-Chung Lee
    • H01L29/786H01L21/34
    • H01L21/268H01L29/66969H01L29/78603H01L29/78693
    • A method of annealing a metal oxide on a temperature sensitive substrate formation includes the steps of providing a temperature sensitive substrate formation and forming a spacer layer on a surface of the substrate formation. A metal oxide semiconductor device is formed on the spacer layer, the device includes at least a layer of amorphous metal oxide semiconductor material, an interface of the amorphous metal oxide layer with a dielectric layer, and a gate metal layer adjacent the layer of amorphous metal oxide semiconductor material and the interface. The method then includes the step of at least partially annealing the layer of metal oxide semiconductor material by heating the adjacent gate metal layer with pulses of infra red radiation to improve the mobility and operating stability of the amorphous metal oxide semiconductor material while retaining at least the amorphous metal oxide semiconductor material adjacent the gate metal layer amorphous.
    • 在温度敏感的基板形成上退火金属氧化物的方法包括以下步骤:在基板结构的表面上形成温度敏感的基板并形成间隔层。 金属氧化物半导体器件形成在间隔层上,该器件至少包括一层非晶金属氧化物半导体材料,非晶金属氧化物层与电介质层的界面,以及与非晶金属层相邻的栅极金属层 氧化物半导体材料和界面。 该方法然后包括通过用红外辐射脉冲加热相邻栅极金属层来至少部分地退火金属氧化物半导体材料层的步骤,以提高非晶金属氧化物半导体材料的迁移率和操作稳定性,同时至少保留 非晶态金属氧化物半导体材料与栅极金属层相邻无定形。
    • 7. 发明授权
    • Systems with integrated optically pumped vertical cavity surface emitting lasers
    • 具有集成光泵浦垂直腔表面发射激光器的系统
    • US06580741B2
    • 2003-06-17
    • US10175338
    • 2002-06-18
    • Wenbin JiangHsing-Chung LeeYong Cheng
    • Wenbin JiangHsing-Chung LeeYong Cheng
    • H01S500
    • H01S5/041H01S5/0215H01S5/0216H01S5/026H01S5/0265H01S5/0608H01S5/06216H01S5/06226H01S5/1085H01S5/18H01S5/18311
    • An integrated optically pumped vertical cavity surface emitting laser (VCSEL) is formed by integrating an electrically pumped in-plane semiconductor laser and a vertical cavity surface emitting laser together with a beam steering element formed with the in-plane semiconductor laser. The in-plane semiconductor laser can be a number of different types of in-plane lasers including an edge emitting laser, an in-plane surface emitting laser, or a folded cavity surface emitting laser. The in-plane semiconductor laser optically pumps the VCSEL to cause it to lase. The in-plane semiconductor laser is designed to emit photons of relatively short wavelengths while the VCSEL is designed to emit photons of relatively long wavelengths. The in-plane semiconductor laser and the VCSEL can be coupled together in a number of ways including atomic bonding, wafer bonding, metal bonding, epoxy glue or other well know semiconductor bonding techniques. The beam steering element can be an optical grating or a mirrored surface.
    • 通过将电泵浦的平面内半导体激光器和垂直腔表面发射激光器与形成有平面内半导体激光器的光束操纵元件一体化而形成集成的光泵浦垂直腔表面发射激光器(VCSEL)。 面内半导体激光器可以是许多不同类型的平面内激光器,包括边缘发射激光器,面内表面发射激光器或折叠空腔表面发射激光器。 平面内半导体激光器对VCSEL进行光泵浦使其发光。 面内半导体激光器被设计成发射相对较短波长的光子,而VCSEL被设计成发射相对较长波长的光子。 面内半导体激光器和VCSEL可以以多种方式耦合在一起,包括原子接合,晶片接合,金属接合,环氧胶或其他众所周知的半导体接合技术。 光束操纵元件可以是光栅或镜面。
    • 9. 发明授权
    • LED display packaging with substrate removal and method of fabrication
    • LED显示包装与基板去除及其制造方法
    • US5780321A
    • 1998-07-14
    • US699263
    • 1996-08-19
    • Chan-Long ShiehHsing-Chung LeePaige M. Holm
    • Chan-Long ShiehHsing-Chung LeePaige M. Holm
    • H01L21/60G09F9/33H01L25/16H01L27/15H01L33/00H01L21/00
    • H01L27/156H01L25/162H01L25/167H01L2924/0002
    • A light emitting diode display package and method of fabricating a light emitting diode (LED) display package including a light emitting diode array on a substrate, having row and column connection pads routed to display connection pads positioned on an uppermost surface of the LED array device, a separate silicon driver device having connection pads routed to an uppermost surface, positioned to cooperatively meet those of the LED device when properly registered, the LED device flip chip bump bonded to the driver device using standard C5 DCA, an underfill layer positioned between the space defined by the LED device and the driver device. The LED display and driver device package subsequently having selectively removed the substrate onto which the LED array was initially formed. The light emitted from the LED display device, being emitted through the remaining indium-gallium-aluminum-phosphide (InGaAlP) epilayer of the LED device.
    • 一种发光二极管显示器封装以及制造在衬底上包括发光二极管阵列的发光二极管(LED)显示器封装的方法,所述发光二极管阵列具有布置成显示位于所述LED阵列器件的最上表面上的连接焊盘的行和列连接焊盘 ,具有连接到最上表面的连接焊盘的单独的硅驱动器装置,其被定位成在正确地注册时协同地与LED器件的那些耦合,使用标准C5 DCA将LED装置倒装芯片凸块结合到驱动器装置,底部填充层位于 LED设备和驱动器设备定义的空间。 LED显示器和驱动器件封装件随后选择性地去除了最初形成LED阵列的衬底。 从LED显示装置发射的光通过LED装置的剩余的铟 - 镓 - 铝 - 磷化物(InGaAlP)外延层发射。