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1. 发明授权

US07565925B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07565925B2
公开(公告)日：2009-07-28
申请号：US11166966
申请日：2005-06-24
申请人： Hsieh-Kun Lee , Cheng-Tien Lai , Zhi-Bin Tan
发明人： Hsieh-Kun Lee , Cheng-Tien Lai , Zhi-Bin Tan
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat sink (10) and at least a serpent heat pipe (22). The heat sink (10) comprises a base (12) contacting with an electrical component, a heat dissipation fins group (14) secured to the base (12) and a cover (16) attached to a top of the heat dissipation fins group (14). The heat dissipating fins group (14) defines a notch (148) at one side thereof. Two end portions of the heat pipe (22) are respectively connected to the base (12) and the cover (16), and a middle portion of the heat pipe (22) is accommodated in the notch (148).
摘要翻译：散热装置包括散热器（10）和至少一个蛇形热管（22）。散热器（10）包括与电气部件接触的基座（12），固定到基座（12）的散热翅片组（14）和附接到散热翅片组的顶部的盖（16） 14）。散热翅片组（14）在其一侧限定了凹口（148）。热管（22）的两个端部分别连接到基座（12）和盖（16）上，并且热管（22）的中间部分容纳在凹口（148）中。

2. 发明授权

US07110259B2 Heat dissipating device incorporating heat pipe 失效
标题翻译：散热装置结合热管
公开(公告)号：US07110259B2
公开(公告)日：2006-09-19
申请号：US10946664
申请日：2004-09-21
申请人： Hsieh Kun Lee , Cheng-Tien Lai , Zhi-Bin Tan
发明人： Hsieh Kun Lee , Cheng-Tien Lai , Zhi-Bin Tan
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device incorporating heat pipes includes a heat sink (10), a first heat pipe (50) and a second heat pipe (70). The heat sink has a first base (11), a second base (21) and a plurality of fins sandwiched between the first and second bases. Each of the heat pipes has a heat-absorption end (51, 71) and a heat-dissipation end (52, 72). The heat-absorption ends of the first and second heat pipes contact the first base of the heat sink. The heat-dissipation end of the first heat pipe is inserted in the substantial middle portion of the fins, and the heat-dissipation end of the second heat pipe is inserted between the second base and the fins.
摘要翻译：包括热管的散热装置包括散热器（10），第一热管（50）和第二热管（70）。散热器具有第一基座（11），第二基座（21）和夹在第一和第二基座之间的多个翅片。每个热管具有吸热端（51,71）和散热端（52,72）。第一和第二热管的吸热端与散热器的第一基座接触。第一热管的散热端插入散热片的大致中间部分，第二热管的散热端插入第二基座和散热片之间。

3. 发明授权

US07597133B2 Heat dissipation device with heat pipes 失效
标题翻译：带热管的散热装置
公开(公告)号：US07597133B2
公开(公告)日：2009-10-06
申请号：US11306359
申请日：2005-12-25
申请人： Hsieh-Kun Lee , Cheng-Tien Lai , Zhi-Bin Tan , Zhi-Yong Zhou , Jiang-Jian Wen
发明人： Hsieh-Kun Lee , Cheng-Tien Lai , Zhi-Bin Tan , Zhi-Yong Zhou , Jiang-Jian Wen
IPC分类号： F28F7/00
CPC分类号： H01L23/467 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a fin set, first and second base plates and first and second heat pipes. The first base plate has a face for contacting a heat generating electronic device. The first heat pipe includes first and second sections sandwiching the fin set between the first and second sections and engaging with the fin set. The first and second base plates sandwich the first heat pipe and the fin set between the first and second base plates and engage with the first heat pipe and the fin set. The second heat pipe includes first and second sections sandwiching the first heat pipe, the fin set, the first and second base plates between the first and second sections of the second heat pipe and engaging with the first and second base plates.
摘要翻译：散热装置包括翅片组，第一和第二基板以及第一和第二热管。第一基板具有用于接触发热电子装置的面。第一热管包括将翅片组夹在第一和第二部分之间并与翅片组接合的第一和第二部分。第一和第二基板将第一热管和翅片组夹在第一和第二基板之间并与第一热管和翅片组接合。第二热管包括将第一热管，翅片组，第一和第二基板夹在第二热管的第一和第二部分之间并与第一和第二基板接合的第一和第二部分。

4. 发明申请

US20070144709A1 HEAT DISSIPATION DEVICE WITH HEAT PIPES 失效
标题翻译：带热管的散热装置
公开(公告)号：US20070144709A1
公开(公告)日：2007-06-28
申请号：US11306359
申请日：2005-12-25
申请人： Hsieh-Kun Lee , Cheng-Tien Lai , Zhi-Bin Tan , Zhi-Yong Zhou , Jiang-Jian Wen
发明人： Hsieh-Kun Lee , Cheng-Tien Lai , Zhi-Bin Tan , Zhi-Yong Zhou , Jiang-Jian Wen
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a fin set, first and second base plates and first and second heat pipes. The first base plate has a face for contacting to a heat generating electronic device. The first heat pipe includes first and second sections sandwiching the fin set therebetween and thermally engaging with the fin set. The first and second base plates sandwich the first heat pipe and the fin set therebetween and thermally engaging with the first heat pipe and the fin set. The second heat pipe includes first and second sections sandwiching the first heat pipe, the fin set, the first and second base plates therebetween and thermally engaging with the first and second base plates.
摘要翻译：散热装置包括翅片组，第一和第二基板以及第一和第二热管。第一底板具有用于与发热电子装置接触的面。第一热管包括夹在其间的翅片组并与散热片组热接合的第一和第二部分。第一和第二基板将第一热管和翅片组夹在中间，并与第一热管和翅片组热接合。第二热管包括夹在第一热管，翅片组，第一和第二基板之间并与第一和第二基板热接合的第一和第二部分。

5. 发明申请

US20070095509A1 Heat dissipation having a heat pipe 审中-公开
标题翻译：具有热管的散热
公开(公告)号：US20070095509A1
公开(公告)日：2007-05-03
申请号：US11265639
申请日：2005-11-02
申请人： Hsieh-Kun Lee , Cheng-Tien Lai , Zhi-Bin Tan , Zhi-Yong Zhou , Jiang-Jian Wen
发明人： Hsieh-Kun Lee , Cheng-Tien Lai , Zhi-Bin Tan , Zhi-Yong Zhou , Jiang-Jian Wen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat sink (10) and a heat pipe (20). The heat sink includes a base (12), a fins group (16) extending from the base, and a cover (14) contacting with the fins group. The heat pipe surrounds top and bottom and two opposite sides of the fins group and thermally connects with the base and the cover.
摘要翻译：散热装置包括散热片（10）和热管（20）。散热器包括基座（12），从基座延伸的翅片组（16）和与翅片组接触的盖子（14）。热管围绕翅片组的顶部和底部以及两个相对的两侧，并与底座和盖子热连接。

6. 发明申请

US20060289150A1 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US20060289150A1
公开(公告)日：2006-12-28
申请号：US11166966
申请日：2005-06-24
申请人： Hsieh-Kun Lee , Cheng-Tien Lai , Zhi-Bin Tan
发明人： Hsieh-Kun Lee , Cheng-Tien Lai , Zhi-Bin Tan
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat sink (10) and at least a serpent heat pipe (22). The heat sink (10) comprises a base (12) contacting with an electrical component, a heat dissipation fins group (14) secured to the base (12) and a cover (16) attached to a top of the heat dissipation fins group (14). The heat dissipating fins group (14) defines a notch (148) at one side thereof. Two end portions of the heat pipe (22) are respectively connected to the base (12) and the cover (16), and a middle portion of the heat pipe (22) is accommodated in the notch (148).
摘要翻译：散热装置包括散热器（10）和至少一个蛇形热管（22）。散热器（10）包括与电气部件接触的基座（12），固定到基座（12）的散热翅片组（14）和附接到散热翅片组的顶部的盖（16） 14）。散热翅片组（14）在其一侧限定了凹口（148）。热管（22）的两个端部分别连接到基座（12）和盖（16）上，并且热管（22）的中间部分容纳在凹口（148）中。

7. 发明申请

US20050141198A1 Heat dissipating device incorporating heat pipe 失效
标题翻译：散热装置结合热管
公开(公告)号：US20050141198A1
公开(公告)日：2005-06-30
申请号：US10946664
申请日：2004-09-21
申请人： Hsieh Lee , Cheng-Tien Lai , Zhi-Bin Tan
发明人： Hsieh Lee , Cheng-Tien Lai , Zhi-Bin Tan
IPC分类号： H01L23/427 , H05K7/00 , H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device incorporating heat pipes includes a heat sink (10), a first heat pipe (50) and a second heat pipe (70). The heat sink has a first base (11), a second base (21) and a plurality of fins sandwiched between the first and second bases. Each of the heat pipes has a heat-absorption end (51, 71) and a heat-dissipation end (52, 72). The heat-absorption ends of the first and second heat pipes contact the first base of the heat sink. The heat-dissipation end of the first heat pipe is inserted in the substantial middle portion of the fins, and the heat-dissipation end of the second heat pipe is inserted between the second base and the fins.
摘要翻译：包括热管的散热装置包括散热器（10），第一热管（50）和第二热管（70）。散热器具有第一基座（11），第二基座（21）和夹在第一和第二基座之间的多个翅片。每个热管具有吸热端（51,71）和散热端（52,72）。第一和第二热管的吸热端与散热器的第一基座接触。第一热管的散热端插入散热片的大致中间部分，第二热管的散热端插入第二基座和散热片之间。

8. 发明授权

US07301774B2 Universal locking device for heat sink 失效
标题翻译：通用散热器锁紧装置
公开(公告)号：US07301774B2
公开(公告)日：2007-11-27
申请号：US11210130
申请日：2005-08-23
申请人： Hsieh-Kun Lee , Cheng-Tien Lai , Shao-Long Zhai , Zhi-Yong Zhou
发明人： Hsieh-Kun Lee , Cheng-Tien Lai , Shao-Long Zhai , Zhi-Yong Zhou
IPC分类号： H05K7/20 , H01L23/34 , F28F7/00
CPC分类号： H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A locking device for securing a heat sink to a heat generating component includes a locking plate, a plurality of locking feet each pivotably attached to the locking plate and a plurality of locking members attached to the locking feet. Adjacent two of the plurality of locking feet are capable of rotating towards each other from a first position at which the locking feet are located apart from each other with the locking members defining a first mounting position to a second position at which the locking feet are stacked together with the locking members defining a second mounting position.
摘要翻译：用于将散热器固定到发热部件的锁定装置包括锁定板，多个锁定脚，每个锁定脚可枢转地附接到锁定板，以及多个锁定构件，其连接到锁定脚。多个锁定脚中的相邻的两个能够从锁定脚彼此分开的第一位置朝向彼此旋转，锁定构件将第一安装位置限定到锁定脚堆叠的第二位置以及限定第二安装位置的锁定构件。

9. 发明授权

US07147043B2 Integratied liquid cooling system for electrical components 失效
标题翻译：电气元件集成液体冷却系统
公开(公告)号：US07147043B2
公开(公告)日：2006-12-12
申请号：US10900815
申请日：2004-07-27
申请人： Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
发明人： Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
IPC分类号： F28D15/00
CPC分类号： H01L23/473 , F28F3/12 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system includes a cooling body (1) defining an hollow portion receiving a pump (3) and a number of cooling fins (18) therein, and a contact portion for contacting an electrical component. The cooling body defines a passageway therein filled with liquid coolant, and an inlet (124) and an outlet (125) both in communication with the passageway. The pump defines an exit (31) and an entrance (32) connected to the inlet and the outlet of the cooling body respectively by two tubes (5). Heat is transferred from the electrical component to the contact portion, and then conducted to the coolant, and conducted to other portions of the cooling body as the coolant flows through the passageway. The heat is then conducted to the cooling fins for dissipation.
摘要翻译：液体冷却系统包括限定中空部分的冷却体（1），所述冷却体容纳泵（3）和其中的多个冷却翅片（18），以及用于接触电气部件的接触部分。冷却体限定了其中填充有液体冷却剂的通道，以及与通道连通的入口（124）和出口（125）。泵分别由两个管（5）分别连接到冷却体的入口和出口的出口（31）和入口（32）。热从电气部件传递到接触部分，然后传导到冷却剂，并且随着冷却剂流过通道而传导到冷却体的其它部分。然后将热量传导到散热片以进行散热。

10. 发明申请

US20060120053A1 Universal locking device for heat sink 失效
标题翻译：通用散热器锁紧装置
公开(公告)号：US20060120053A1
公开(公告)日：2006-06-08
申请号：US11210130
申请日：2005-08-23
申请人： Hsieh-Kun Lee , Cheng-Tien Lai , Shao-Long Zhai , Zhi-Yong Zhou
发明人： Hsieh-Kun Lee , Cheng-Tien Lai , Shao-Long Zhai , Zhi-Yong Zhou
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A locking device for securing a heat sink to a heat generating component includes a locking plate, a plurality of locking feet each pivotably attached to the locking plate and a plurality of locking members attached to the locking feet. Adjacent two of the plurality of locking feet are capable of rotating towards each other from a first position at which the locking feet are located apart from each other with the locking members defining a first mounting position to a second position at which the locking feet are stacked together with the locking members defining a second mounting position.
摘要翻译：用于将散热器固定到发热部件的锁定装置包括锁定板，多个锁定脚，每个锁定脚可枢转地附接到锁定板，以及多个锁定构件，其连接到锁定脚。多个锁定脚中的相邻的两个能够从锁定脚彼此分开的第一位置朝向彼此旋转，锁定构件将第一安装位置限定到锁定脚堆叠的第二位置以及限定第二安装位置的锁定构件。

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