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1. 发明授权

US07147043B2 Integratied liquid cooling system for electrical components 失效
标题翻译：电气元件集成液体冷却系统
公开(公告)号：US07147043B2
公开(公告)日：2006-12-12
申请号：US10900815
申请日：2004-07-27
申请人： Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
发明人： Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
IPC分类号： F28D15/00
CPC分类号： H01L23/473 , F28F3/12 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system includes a cooling body (1) defining an hollow portion receiving a pump (3) and a number of cooling fins (18) therein, and a contact portion for contacting an electrical component. The cooling body defines a passageway therein filled with liquid coolant, and an inlet (124) and an outlet (125) both in communication with the passageway. The pump defines an exit (31) and an entrance (32) connected to the inlet and the outlet of the cooling body respectively by two tubes (5). Heat is transferred from the electrical component to the contact portion, and then conducted to the coolant, and conducted to other portions of the cooling body as the coolant flows through the passageway. The heat is then conducted to the cooling fins for dissipation.
摘要翻译：液体冷却系统包括限定中空部分的冷却体（1），所述冷却体容纳泵（3）和其中的多个冷却翅片（18），以及用于接触电气部件的接触部分。冷却体限定了其中填充有液体冷却剂的通道，以及与通道连通的入口（124）和出口（125）。泵分别由两个管（5）分别连接到冷却体的入口和出口的出口（31）和入口（32）。热从电气部件传递到接触部分，然后传导到冷却剂，并且随着冷却剂流过通道而传导到冷却体的其它部分。然后将热量传导到散热片以进行散热。

2. 发明授权

US07100677B2 Integrated liquid cooling system for electrical components 失效
标题翻译：电气元件集成液体冷却系统
公开(公告)号：US07100677B2
公开(公告)日：2006-09-05
申请号：US10900801
申请日：2004-07-27
申请人： Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
发明人： Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/473 , F28F3/02 , F28F3/12 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system includes a tank (10) for thermally contacting a heat source (100), a cylindrical heat dissipating unit (20) mounted on the tank, and a pump (30) located within the cylindrical heat dissipating unit. The tank defines a cavity therein for containing liquid coolant for heat exchange, and an inlet (122) in communication with the cavity. The heat dissipating unit defines a chamber therein in flow communication with the cavity, and an outlet (275) in communication with the chamber. The pump has an entrance (31) in flow communication with the outlet, and an exit (32) in flow communication with the inlet, thereby the tank, the heat dissipating unit, and the pump together forming a loop for circulation the of liquid coolant.
摘要翻译：液体冷却系统包括用于热接触热源（100）的罐（10），安装在罐上的圆柱形散热单元（20）和位于圆柱形散热单元内的泵（30）。所述罐在其中限定了用于容纳用于热交换的液体冷却剂的空腔，以及与所述空腔连通的入口（122）。散热单元限定其中与腔体流动连通的腔室，以及与腔室连通的出口（275）。泵具有与出口流动连通的入口（31）和与入口流动连通的出口（32），从而使罐，散热单元和泵一起形成用于使液体冷却剂循环的回路。

3. 发明授权

US07028761B2 Integrated liquid cooling system for electrical components 失效
标题翻译：电气元件集成液体冷却系统
公开(公告)号：US07028761B2
公开(公告)日：2006-04-18
申请号：US10901749
申请日：2004-07-28
申请人： Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
发明人： Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
IPC分类号： F28D15/00
CPC分类号： F28F3/12 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system includes a cooling unit (100) and a coolant driving unit (200). The cooling unit includes a first cooling body (110) defining a first cavity, a second cooling body (130) defining a second cavity in communication with the first cooling body (110), and a heat sink (150) sandwiched between the first and second cooling bodies. The coolant driving unit is in flow communication with the first and second cooling bodies respectively, so that the first and second cooling bodies and the coolant driving unit together form a loop. Circulation of the coolant in the loop causes the heat generated by the heat generating component to be capable of being transferred from the first and second cooling bodies to the heat sink for dissipation.
摘要翻译：液体冷却系统包括冷却单元（100）和冷却剂驱动单元（200）。冷却单元包括限定第一空腔的第一冷却体（110），限定与第一冷却体（110）连通的第二空腔的第二冷却体（130）和夹在第一和第二冷却体第二冷却体。冷却剂驱动单元分别与第一和第二冷却体流动连通，使得第一和第二冷却体和冷却剂驱动单元一起形成回路。冷却液在回路中的循环使得由发热部件产生的热量能够从第一和第二冷却体转移到散热器以进行散热。

4. 发明授权

US07156160B2 Integrated liquid cooling system for electronic components 失效
标题翻译：电子元件集成液体冷却系统
公开(公告)号：US07156160B2
公开(公告)日：2007-01-02
申请号：US10946702
申请日：2004-09-21
申请人： Hsieh Kun Lee , Cheng-tien Lai , Shi-Wen Zhou
发明人： Hsieh Kun Lee , Cheng-tien Lai , Shi-Wen Zhou
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： G06F1/20 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system includes a container (10) defining communicable first and second chambers (125a, 125b) therein, a pump (15) mounted on the container and having an entrance port (152) in flow communication with the second chamber, and an exit port (150) in flow communication with the first chamber so that the pump, the first chamber, and the second chamber together form a loop for circulation of coolant, and a heat dissipation unit (2) located at the loop for cooling the coolant.
摘要翻译：液体冷却系统包括容纳在其中的可连通的第一和第二腔室（125a，125b）的容器（10），安装在容器上并具有与第二腔室流动连通的入口（152）的泵（15）以及与所述第一室流动连通的出口（150），使得所述泵，所述第一室和所述第二室一起形成用于循环冷却剂的回路，以及位于所述环处的散热单元（2）用于冷却冷却液。

5. 发明授权

US07110261B2 Heat dissipation assembly 失效
标题翻译：散热组件
公开(公告)号：US07110261B2
公开(公告)日：2006-09-19
申请号：US10946663
申请日：2004-09-21
申请人： Hsieh Kun Lee , Cheng-Tien Lai , Shi-Wen Zhou
发明人： Hsieh Kun Lee , Cheng-Tien Lai , Shi-Wen Zhou
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation assembly of the present invention includes a printed circuit board (50), an electronic component (60) mounted on the printed circuit board, a heat dissipation device (70) mounted on the electronic component, four securing members (10) secured to the heat dissipation device and four positioning members (20) extend through the printed circuit board. The positioning members are covered over by four resilient members (30) disposed in the securing members. The positioning members pull the securing members toward the printed circuit board.
摘要翻译：本发明的散热组件包括印刷电路板（50），安装在印刷电路板上的电子部件（60），安装在电子部件上的散热装置（70），固定有四个固定部件散热装置和四个定位构件（20）延伸穿过印刷电路板。定位构件被布置在固定构件中的四个弹性构件（30）覆盖。定位构件将固定构件拉向印刷电路板。

6. 发明授权

US06935410B2 Heat sink assembly 失效
标题翻译：散热器组件
公开(公告)号：US06935410B2
公开(公告)日：2005-08-30
申请号：US10749889
申请日：2003-12-31
申请人： Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
发明人： Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
IPC分类号： H01L23/467 , F28F3/00
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly includes a fan (10), a heat sink (20) and a mounting device (50). The heat sink includes a base (22) and plural of fins (24) extending upwardly from the base. Plural of claws (26) are formed in a top end of one fin which extends from a side of the base. A locking hole (30) is defined in another fin which extends from an opposite side of the base. A vent (52) is defined in the center of the mounting device, and four fixing holes (54) are defined in four comers of the mounting device for engaging with four screws (14) which extend through the fan to the mounting device. Plural of pivots (56) are provided in a first side of the mounting device for pivotably received in the claws of the heat sink thereby pivotably attaching the mounting device to the heat sink. A hook (62) is provided in an opposite side of the mounting device for engaging with the locking hole of the heat sink thereby fixing the mounting device to the heat sink.
摘要翻译：散热器组件包括风扇（10），散热器（20）和安装装置（50）。散热器包括底座（22）和从基座向上延伸的多个翅片（24）。多个爪（26）形成在从基部的一侧延伸的一个翅片的顶端中。锁定孔（30）被限定在从基座的相对侧延伸的另一个翅片中。在安装装置的中心设有一个排气口（52），在安装装置的四个角上限定了四个固定孔（54），用于与通过风扇延伸到安装装置的四个螺钉（14）接合。多个枢轴（56）设置在安装装置的第一侧，用于可枢转地容纳在散热片的爪中，从而将安装装置可枢转地附接到散热器。在安装装置的相对侧设有钩（62），用于与散热片的锁定孔接合，从而将安装装置固定到散热器。

7. 发明申请

US20050098305A1 Integrated liquid cooling system for electronic components 失效
标题翻译：电子元件集成液体冷却系统
公开(公告)号：US20050098305A1
公开(公告)日：2005-05-12
申请号：US10946702
申请日：2004-09-21
申请人： Hsieh Kun Lee , Cheng-tien Lai , Shi-Wen Zhou
发明人： Hsieh Kun Lee , Cheng-tien Lai , Shi-Wen Zhou
IPC分类号： H01L23/473 , F28D15/00
CPC分类号： G06F1/20 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system includes a container (10) defining communicable first and second chambers (125a, 125b) therein, a pump (15) mounted on the container and having an entrance port (152) in flow communication with the second chamber, and an exit port (150) in flow communication with the first chamber so that the pump, the first chamber, and the second chamber together form a loop for circulation of coolant, and a heat dissipation unit (2) located at the loop for cooling the coolant.
摘要翻译：液体冷却系统包括容纳在其中的可连通的第一和第二腔室（125a，125b）的容器（10），安装在容器上并具有与第二腔室流动连通的入口（152）的泵（15）以及与所述第一室流动连通的出口（150），使得所述泵，所述第一室和所述第二室一起形成用于循环冷却剂的回路，以及位于所述环处的散热单元（2）用于冷却冷却液。

8. 发明授权

US07075790B2 Heat dissipating device incorporating clip 失效
标题翻译：散热装置结合夹子
公开(公告)号：US07075790B2
公开(公告)日：2006-07-11
申请号：US10900553
申请日：2004-07-27
申请人： Chun-Chi Chen , Xue-Wen Peng , Hsieh Kun Lee , Cheng-Tien Lai , Zhi-Yong Zhou
发明人： Chun-Chi Chen , Xue-Wen Peng , Hsieh Kun Lee , Cheng-Tien Lai , Zhi-Yong Zhou
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device includes a heat sink (50) and two clips (10) for mounting the heat sink to a retention module (60) which surrounds an electronic component (65). The heat sink provides two shoulders (72). Each clip includes a strap (21) supported on one shoulder, a lever (40) having a cam pivotally connected to the strap, two legs (30) pivotally connected to opposite end portions of the strap, and two spring fingers (26) integrally extending from opposite ends of the strap. In assembly, the straps are downwardly pressed and the retention module push the legs to pivot away from the feet from original states toward forced states. When the legs arrive openings of the retention module the fingers urge the legs to enter the openings. The levers are then pivoted to push the straps to move upwardly to thereby cause the legs to firmly engage in the openings.
摘要翻译：散热装置包括散热器（50）和用于将散热器安装到围绕电子部件（65）的保持模块（60）的两个夹子（10）。散热器提供两个肩部（72）。每个夹子包括支撑在一个肩部上的带子（21），具有枢转地连接到带子上的凸轮的杠杆（40），可枢转地连接到带子的相对端部的两个腿部（30），以及两个弹簧指从带的相对端延伸。在组装中，带子被向下按压，并且保持模块推动腿部以便将脚从原始状态转移到强制状态。当腿部到达保持模块的开口时，手指推动腿进入开口。然后，杠杆枢转以推动带子向上移动，从而使腿部牢固地接合在开口中。

9. 发明授权

US07013959B2 Integrated liquid cooling system for electrical components 失效
标题翻译：电气元件集成液体冷却系统
公开(公告)号：US07013959B2
公开(公告)日：2006-03-21
申请号：US10923185
申请日：2004-08-19
申请人： Hsieh Kun Lee , Cheng-Tien Lai , Zhi Yong Zhou
发明人： Hsieh Kun Lee , Cheng-Tien Lai , Zhi Yong Zhou
IPC分类号： F28D15/00
CPC分类号： H01L23/473 , F28F3/12 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system includes a heat absorbing unit (4) defining a chamber therein for containing coolant, and a heat dissipation unit (2) comprising a liquid circulation module (20) in flow communication with the heat absorbing unit, and a plurality of cooling fins (27). The liquid circulation module comprises first and second hollow cooling bodies (21, 23) cooperatively defining a space therebetween to receive the cooling fins, and a pump (24) coupled to the second cooling body, so that the first and second cooling bodies, the pump, and the heat absorbing unit together forms a closed loop for circulation of the coolant.
摘要翻译：液体冷却系统包括在其中限定用于容纳冷却剂的室的吸热单元（4），以及包括与吸热单元流动连通的液体循环模块（20）的散热单元（2），以及多个冷却翅片（27）。液体循环模块包括第一和第二空心冷却体（21,23），其协作地限定其间的空间以容纳冷却翅片;以及泵（24），其联接到第二冷却体，使得第一和第二冷却体，泵和吸热单元一起形成用于冷却剂循环的闭合回路。

10. 发明授权

US06924984B2 Heat sink clip with pivoting locking portions 失效
标题翻译：具有枢转锁定部分的散热片夹
公开(公告)号：US06924984B2
公开(公告)日：2005-08-02
申请号：US10660425
申请日：2003-09-10
申请人： Hsieh Kun Lee , Cheng-Tien Lai , Tony Zhou
发明人： Hsieh Kun Lee , Cheng-Tien Lai , Tony Zhou
IPC分类号： H01L23/40 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/308 , Y10T24/44026 , H01L2924/00
摘要： A heat sink clip comprises a connecting member (12), two pressing members (14) connecting to the connection member, each of the pressing members comprising a pressing portion (141) and two spring portions (142, 143) extending from opposite ends of the pressing portion, a first locking portion (144) depending from one of the spring portions of each pressing member, two operating members (16) each having spaced first and second pivot means, the second pivot means being below the first pivot means, the operating members respectively pivotably connected to the other one of the spring portions, and two second locking portions (18) respectively pivotably connected to the operating members. When the operating members are rotated downwardly, the first and second locking portions are raised, adapted for engaging with a retention frame and securing a heat sink to an electronic package.
摘要翻译：散热片夹包括连接构件（12），连接到连接构件的两个按压构件（14），每个按压构件包括按压部分（141）和两个弹簧部分（142,143），两个弹簧部分所述按压部分，从每个按压构件的一个弹簧部分悬垂的第一锁定部分（144），每个具有间隔开的第一和第二枢转装置的两个操作构件（16），所述第二枢转装置位于所述第一枢转装置的下方，分别可枢转地连接到另一个弹簧部分的操作构件和分别可枢转地连接到操作构件的两个第二锁定部分（18）。当操作构件向下旋转时，第一和第二锁定部分被升高，适于与保持框架接合并将散热器固定到电子封装件上。

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