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    • 3. 发明授权
    • Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers
    • 用于处理和转移半导体晶片的多个独立的机器人组件和设备
    • US06799939B2
    • 2004-10-05
    • US10378864
    • 2003-03-05
    • Robert B. LowranceHoward Grunes
    • Robert B. LowranceHoward Grunes
    • B66F1100
    • H01L21/67742H01L21/68707H01L21/68742Y10S414/135
    • A robot assembly including multiple independently operable robot assemblies are provided for use in semiconductor wafer processing. The robot assembly includes independent co-axial upper and lower robot assemblies adapted to handle multiple objects. The upper robot is stacked above the lower robot and the two robots are mounted concentrically to allow fast wafer transfer. Concentric drive mechanisms may also be provided for imparting rotary motion to either rotate the robot assembly or extend an extendable arm assembly into an adjacent chamber. Each robot can be either a single blade robot or a dual blade robot. Also provided is an apparatus for processing semiconductor wafers comprising a pre/post process transfer chamber housing multiple independent robot assemblies and surrounded by a plurality of pre-process chambers and post process chambers. Within each process, pre-process and post-process chamber is an apparatus for holding a plurality of stacked wafers. The apparatus includes a wafer lifting and storing apparatus exhibiting a plurality of vertically movable lift pins surrounding the chamber pedestal. The lift pins are configured to receive and hold a plurality of stacked wafers, preferably two, therein.
    • 提供了包括多个可独立操作的机器人组件的机器人组件,用于半导体晶片处理。 机器人组件包括适于处理多个物体的独立的同轴上下机器人组件。 上部机器人堆叠在下部机器人的上方,两个机器人同心安装以允许快速的晶片传送。 也可以提供同心驱动机构用于赋予旋转运动以旋转机器人组件或将可伸展臂组件延伸到相邻的腔室中。 每个机器人可以是单刀片机器人或双刀片机器人。 还提供了一种用于处理半导体晶片的装置,其包括容纳多个独立机器人组件并被多个预处理室和后处理室包围的前/后处理转移室。 在每个过程中,预处理室和后处理室是用于保持多个堆叠的晶片的装置。 该装置包括晶片提升和存储装置,其显示围绕室底座的多个可垂直移动的提升销。 提升销被配置为在其中接收和保持多个堆叠的晶片,优选地两个。