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1. 发明授权

US5747694A Pressure sensor with barrier in a pressure chamber 失效
标题翻译：带压力传感器的压力传感器
公开(公告)号：US5747694A
公开(公告)日：1998-05-05
申请号：US686601
申请日：1996-07-26
申请人： Horonobu Baba , Tiaki Mizuno , Masahito Imai , Yuichi Yokoyama , Masaki Takakuwa , Yasuki Shimoyama
发明人： Horonobu Baba , Tiaki Mizuno , Masahito Imai , Yuichi Yokoyama , Masaki Takakuwa , Yasuki Shimoyama
IPC分类号： G01L9/00
CPC分类号： G01L19/147 , G01L19/0038 , G01L19/0084 , G01L19/0636 , G01L19/143
摘要： A pressure sensor has a resin housing containing a pressure sensor positioned between a reference pressure chamber and a pressure to be measured. A terminal extends through the housing toward the sensor. A wire connects the terminal to the sensor. When a connector is connected to the terminal, it may compress air around the terminal. The compressed air may travel along the terminal and break the wire connected to the sensor. To prevent such breakage, a barrier wall is provided to block the compressed air from penetrating toward the wire. The reference pressure chamber is divided into a main chamber and a subchamber by the barrier wall. Since the barrier wall blocks the compressed air, the compressed air can not reach a silicon gel on the sensor and the wire in the main chamber. Therefore, the wire is protected.
摘要翻译：压力传感器具有树脂壳体，其包含位于参考压力室和待测量压力之间的压力传感器。端子延伸穿过壳体朝向传感器。导线将端子连接到传感器。当连接器连接到终端时，可能会压缩终端周围的空气。压缩空气可以沿着端子行进并断开连接到传感器的电线。为了防止这种破裂，设置阻挡壁以阻止压缩空气渗透到线。基准压力室由隔离壁分为主室和副室。由于阻隔壁阻挡压缩空气，压缩空气不能到达传感器上的硅凝胶和主室中的导线。因此，电线被保护。

2. 发明授权

US5900554A Pressure sensor 失效
标题翻译：压力传感器
公开(公告)号：US5900554A
公开(公告)日：1999-05-04
申请号：US3711
申请日：1998-01-07
申请人： Horonobu Baba , Tiaki Mizuno , Masahito Imai , Yuichi Yokoyama , Masaki Takakuwa , Yasuki Shimoyama
发明人： Horonobu Baba , Tiaki Mizuno , Masahito Imai , Yuichi Yokoyama , Masaki Takakuwa , Yasuki Shimoyama
IPC分类号： G01L9/00 , G01L9/04
CPC分类号： G01L19/147 , G01L19/0038 , G01L19/0084 , G01L19/0636 , G01L19/143
摘要： When a compressed air is led into a reference pressure chamber along with a boundary between a resin housing and a terminal, such compressed air may cause a wire breaking. A barrier wall for blocking the compressed air from penetrating toward the wire is disposed. The reference pressure chamber is divided into a main chamber and a subchamber by the barrier wall. Since the barrier wall blocks the compressed air, the compressed air can not reach a silicon gel in the main chamber. Therefore, the wire breaking caused by the compressed air when connecting a connector therewith can be precluded.
摘要翻译：当压缩空气与树脂壳体和端子之间的边界一起被引入参考压力室时，这种压缩空气可能导致断线。设置用于阻挡压缩空气渗透到线的阻挡壁。基准压力室由隔离壁分为主室和副室。由于阻隔壁阻挡压缩空气，所以压缩空气不能到达主室中的硅凝胶。因此，可以防止在连接连接器时由压缩空气引起的断线。

3. 发明授权

US06255741B1 Semiconductor device with a protective sheet to affix a semiconductor chip 有权
标题翻译：具有用于固定半导体芯片的保护片的半导体器件
公开(公告)号：US06255741B1
公开(公告)日：2001-07-03
申请号：US09270745
申请日：1999-03-16
申请人： Shinji Yoshihara , Sumitomo Inomata , Kinya Atsumi , Minekazu Sakai , Yasuki Shimoyama , Tetsuo Fujii
发明人： Shinji Yoshihara , Sumitomo Inomata , Kinya Atsumi , Minekazu Sakai , Yasuki Shimoyama , Tetsuo Fujii
IPC分类号： G01P100
CPC分类号： B81B7/0058 , B81C1/00896 , G01P1/023 , G01P15/0802 , H01L23/3164 , H01L23/564 , H01L24/05 , H01L2224/04042 , H01L2224/05624 , H01L2224/32245 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01068 , H01L2924/01082 , H01L2924/10253 , H01L2924/16195 , H01L2924/16235 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A heat resisting resin sheet is bonded to a semiconductor chip as a protective cap for protecting a beam structure provided on the semiconductor chip, through a heat resisting adhesive. The heat resisting resin sheet is composed of a polyimide base member and the heat resisting adhesive is composed of silicone adhesive. The heat resisting resin sheet is not deformed during a manufacturing process of the semiconductor chip. In addition, grinding water does not invade into the semiconductor chip during dicing-cut.
摘要翻译：耐热性树脂片通过耐热粘合剂与半导体芯片接合，作为用于保护设置在半导体芯片上的梁结构的保护帽。耐热性树脂片由聚酰亚胺基材构成，耐热粘合剂由硅酮粘合剂构成。耐热性树脂片在半导体芯片的制造工序中不变形。此外，切割时切削水不会侵入半导体芯片。

4. 发明授权

US5554806A Physical-quantity detecting device 失效
标题翻译：物理量检测装置
公开(公告)号：US5554806A
公开(公告)日：1996-09-10
申请号：US477614
申请日：1995-06-07
申请人： Naohito Mizuno , Shinichi Hirose , Hiromi Ariyoshi , Yasuki Shimoyama
发明人： Naohito Mizuno , Shinichi Hirose , Hiromi Ariyoshi , Yasuki Shimoyama
IPC分类号： G01P1/02 , G01P15/08 , H05K1/18
CPC分类号： G01P15/08 , G01P1/023 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2924/15153 , H01L2924/16152 , H01L2924/16195 , H01L2924/19107 , H05K1/181
摘要： An acceleration detecting device, which can be constructed simply and allow compactness, is disclosed. A cover is installed on a housing-body portion to form a hollow portion, and a sensor chip which is subjected to acceleration and displaced is bonded and fixed within this hollow portion. This housing-body portion has a flat end face, and electrical wiring leads and electrically connected to the sensor chip is formed on the end face via the interior of the housing-body portion. This end face is electrically and mechanically connected to a circuit board by a bonding agent, and the housing-body portion is fixed to the circuit board substantially perpendicularly.
摘要翻译：公开了一种加速度检测装置，其可以简单地构造并且具有紧凑性。盖体安装在壳体部分上以形成中空部分，并且经受加速和移位的传感器芯片被结合并固定在该中空部分内。该壳体部分具有平坦的端面，并且经由壳体部分的内部在端面上形成电连接到传感器芯片的电布线。该端面通过接合剂电气机械地连接到电路板，并且壳体主体部分基本上垂直地固定到电路板。

5. 发明授权

US07082830B2 Physical quantity sensor capable of outputting time-serial signal indicative of plural ranges of physical quantity 失效
标题翻译：能够输出指示多个物理量范围的时间序列信号的物理量传感器
公开(公告)号：US07082830B2
公开(公告)日：2006-08-01
申请号：US10771500
申请日：2004-02-05
申请人： Tomohito Kunda , Yasuki Shimoyama
发明人： Tomohito Kunda , Yasuki Shimoyama
IPC分类号： G01P15/08 , G01P21/00
CPC分类号： G01P21/00 , B60R21/0132 , B60R2021/01327 , G01D3/032
摘要： A physical quantity sensor detecting physical quantity, such as acceleration or angular velocity, is provided and mounted on, for example, a vehicle. The sensor has a physical quantity transducer and the first to third circuits. The transducer senses physical quantity acting in a direction determined with respect to a predetermined detection axis of the transducer to output a detection signal corresponding in level to the physical quantity. The first circuit receives the detection signal and output a first physical quantity signal depending in level on the detection signal. The second circuit produces a second physical quantity signal from the first physical quantity signal, the second physical quantity signal being larger in magnitude the first physical quantity signal. The third circuit receives the first and second physical quantity signals and outputs a signal consisting of the first and second physical quantity signals alternately selected and lined up sequentially in time.
摘要翻译：物理量传感器检测物理量，例如加速度或角速度，并且安装在例如车辆上。传感器具有物理量传感器和第一至第三电路。换能器感测以相对于换能器的预定检测轴确定的方向作用的物理量，以输出与物理量相对应的检测信号。第一电路接收检测信号，并根据检测信号的电平输出第一物理量信号。第二电路从第一物理量信号产生第二物理量信号，第二物理量信号的幅度大于第一物理量信号。第三电路接收第一和第二物理量信号，并且输出由交替选择的第一和第二物理量信号组成的信号并且在时间上顺序排列。

6. 发明授权

US06448624B1 Semiconductor acceleration sensor 失效
标题翻译：半导体加速度传感器
公开(公告)号：US06448624B1
公开(公告)日：2002-09-10
申请号：US08908939
申请日：1997-08-08
申请人： Seiichiro Ishio , Kenichi Ao , Minoru Murata , Yasuki Shimoyama , Tomohito Kunda , Norio Kitao
发明人： Seiichiro Ishio , Kenichi Ao , Minoru Murata , Yasuki Shimoyama , Tomohito Kunda , Norio Kitao
IPC分类号： H01L2982
CPC分类号： G01P15/123 , G01P1/006 , G01P15/0802 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor sensor chip is provided with a weight portion supported in a frame via beams whereby acceleration up to substantially ±1 G can be detected by utilizing piezoresistance effect of resistor elements formed on the beams. The semiconductor sensor chip is supported by a seat having a thermal expansion coefficient equivalent to that of the semiconductor sensor chip via the frame. The frame and the seat are adhered to each other by a flexible adhesive agent mixed with a plurality of resin beads functioning as spacers and under an adhesion state, air damping of the weight portion is carried out by setting a dimension of an air gap between the weight portion and the seat to a range of 7 through 15 &mgr;m.
摘要翻译：半导体传感器芯片具有通过光束支撑在框架中的重量部分，由此通过利用形成在梁上的电阻元件的压阻效应可以检测到大致±1G的加速度。半导体传感器芯片由具有与半导体传感器芯片的热膨胀系数相当的热膨胀系数经由框架支撑。框架和座椅通过与作为间隔件起作用的多个树脂珠混合的柔性粘合剂彼此粘合，并且在粘合状态下，通过将重量部分的空气阻力设定在重量部分和座椅到7到15毫米的范围。

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