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    • 4. 发明授权
    • Automated vacuum assisted valve priming system and methods of use
    • 自动真空辅助阀启动系统及使用方法
    • US08690009B2
    • 2014-04-08
    • US13063796
    • 2009-09-18
    • Cutler CrowellErik FiskeHoratio QuinonesBrian Sawatzky
    • Cutler CrowellErik FiskeHoratio QuinonesBrian Sawatzky
    • B67D1/00
    • G05D16/20B05C5/0225B05C11/1005B05C11/1034Y10T137/0396Y10T137/85986
    • An automated system (10) and methods (11) for priming a fluid chamber (12) of a fluid dispensing valve (14) with fluid (16) from fluid material source that includes a vacuum source (46), a valve priming station (32), a vacuum switch (54), and a controller (62). The valve priming station (32) has a boot (40), a vacuum chamber (36), and a vacuum channel (42) in the boot (40). The vacuum channel (42) connects with the vacuum source (46) via the vacuum chamber (36). The boot (40) sealingly engages a valve nozzle (28) of the fluid dispensing valve (14) so that the vacuum chamber (36) connects the vacuum source (46) with the fluid chamber (12). The vacuum switch (54) couples with the vacuum channel (42) via the vacuum chamber (36) and has an opened and closed position based upon a vacuum level in the vacuum chamber (36). The controller (62) is electrically connected with the vacuum source (46) and vacuum switch (54) and controls priming of the fluid dispensing valve (14) based upon whether the vacuum switch (54) is opened or closed.
    • 一种自动化系统(10)和方法(11),用于利用来自流体材料源的流体(16)起动流体分配阀(14)的流体室(12),流体材料源包括真空源(46),阀启动站 32),真空开关(54)和控制器(62)。 阀门启动台(32)具有一个罩(40),一个真空室(36)和一个位于靴子(40)中的真空通道(42)。 真空通道(42)通过真空室(36)与真空源(46)连接。 护罩(40)密封地接合流体分配阀(14)的阀喷嘴(28),使得真空室(36)将真空源(46)与流体室(12)连接。 真空开关(54)经由真空室(36)与真空通道(42)联接,并且基于真空室(36)中的真空水平具有打开和关闭位置。 基于真空开关(54)是打开还是关闭,控制器(62)与真空源(46)和真空开关(54)电连接并控制流体分配阀(14)的启动。
    • 9. 发明授权
    • Zero force heat sink
    • 零力散热器
    • US06212070B1
    • 2001-04-03
    • US09071897
    • 1998-05-05
    • Eugene R. AtwoodJoseph A. BenenatiJames J. DankelmanHoratio QuinonesKarl J. PuttlitzEric J. Kastberg
    • Eugene R. AtwoodJoseph A. BenenatiJames J. DankelmanHoratio QuinonesKarl J. PuttlitzEric J. Kastberg
    • H05K720
    • H01L23/4006H01L2224/16225H01L2924/09701
    • A heat sink in a heat transfer relationship with a substrate such as an integrated chip, chip carrier, or other electronic package. The heat sink is connected to a frame which is connected to a printed circuit board or other suitable support on which the substrate is positioned. The heat sink, which extends through an aperture in the frame is coupled to a surface of the substrate. The heat sink is mechanically decoupled from the substrate. Large heat sinks may be thermally connected to surface mount substrates mounted using technologies such as ceramic ball or column grid arrays, plastic ball or column grid arrays, or solder balls or columns. The heat sink is attached coaxially through the aperture to the substrate. After assembly and lead/tin or other metallic surface mount interconnects are relaxed such that the substrate and is completely supported by the frame and the heat sink imparts zero or nearly zero downward force. Because the heat sink moves freely within the aperture during assembly, the heat sink package is useful for a variety of different substrates. Preferably, the frame is a plate and a plurality of studs. The plate material are selected to match the thermal expansion of the underlying support, and the stud material matched the thermal expansion of the substrate. Thus, the frame construction allows matching expansion and contraction of the assembly to the underlying substrate and support.
    • 与诸如集成芯片,芯片载体或其它电子封装的衬底的热传递关系的散热器。 散热器连接到框架,该框架连接到印刷电路板或其上放置基板的其它合适的支撑件。 延伸穿过框架中的孔的散热器耦合到衬底的表面。 散热器与基板机械分离。 大型散热器可以热连接到使用诸如陶瓷球或列网格阵列,塑料球或列网格阵列或焊球或列的技术安装的表面安装基板。 散热器同轴地穿过孔径连接到基板。 组装之后,铅/锡或其他金属表面贴装互连件松弛,使得基板并被框架和散热器完全支撑,使零或接近零的向下的力。 因为散热器在组装期间在孔内自由移动,所以散热器封装对于各种不同的衬底是有用的。 优选地,框架是板和多个螺柱。 选择板材以匹配下面的支撑件的热膨胀,并且螺柱材料与基板的热膨胀相匹配。 因此,框架结构允许将组件的膨胀和收缩与下面的衬底和支撑件相匹配。