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    • 4. 发明授权
    • Method for forming metal electrode, method for manufacturing semiconductor light emitting elements and nitride based compound semiconductor light emitting elements
    • 金属电极的形成方法,半导体发光元件的制造方法以及氮化物系化合物半导体发光元件
    • US09219198B2
    • 2015-12-22
    • US12296487
    • 2007-04-24
    • Jong-Lam LeeHo Won Jang
    • Jong-Lam LeeHo Won Jang
    • H01L33/00H01L33/40H01L33/44
    • H01L33/405H01L33/0095H01L33/44H01L2924/0002H01L2924/00
    • A method for forming a metal electrode and a method for manufacturing semiconductor light emitting elements include providing a substrate having a semiconductor layer formed thereon; forming a bonding metal layer and a reflective metal layer on the semiconductor layer; and forming a metal electrode by layer inversion of the bonding metal layer and the reflective metal layer through a heat treatment process. An interface characteristic between a semiconductor layer and an electrode having a reflective metal layer is enhanced by a layer inversion phenomenon. High reflectivity can be obtained, because a reflection metal layer is uniformly distributed on a semiconductor layer. Further, out-diffusion of a reflective metal layer is prevented through layer inversion to enhance the thermal stability of an electrode. And the number of accepters for generating holes is increased through heat treatment under an oxygen atmosphere, so that contact resistance can be lowered.
    • 一种形成金属电极的方法和半导体发光元件的制造方法包括提供其上形成有半导体层的基板; 在所述半导体层上形成接合金属层和反射金属层; 以及通过热处理工艺通过接合金属层和反射金属层的层反转而形成金属电极。 半导体层和具有反射金属层的电极之间的界面特性通过层反转现象而增强。 因为反射金属层均匀分布在半导体层上,所以可以获得高的反射率。 此外,通过层反转来防止反射金属层的扩散,从而提高电极的热稳定性。 并且通过在氧气氛下的热处理增加了用于产生孔的接收器的数量,从而可以降低接触电阻。
    • 7. 发明申请
    • METHOD FOR FORMING METAL ELECTRODE, METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING ELEMENTS AND NITRIDE BASED COMPOUND SEMICONDUCTOR LIGHT EMITTING ELEMENTS
    • 形成金属电极的方法,制造半导体发光元件和基于氮化物的化合物半导体发光元件的方法
    • US20090278150A1
    • 2009-11-12
    • US12296487
    • 2007-04-24
    • Jong-Lam LeeHo Won Jang
    • Jong-Lam LeeHo Won Jang
    • H01L33/00H01L21/28H01L21/30
    • H01L33/405H01L33/0095H01L33/44H01L2924/0002H01L2924/00
    • A method for forming a metal electrode and a method for manufacturing semiconductor light emitting elements include providing a substrate having a semiconductor layer formed thereon; forming a bonding metal layer and a reflective metal layer on the semiconductor layer; and forming a metal electrode by layer inversion of the bonding metal layer and the reflective metal layer through a heat treatment process. An interface characteristic between a semiconductor layer and an electrode having a reflective metal layer is enhanced by a layer inversion phenomenon. High reflectivity can be obtained, because a reflection metal layer is uniformly distributed on a semiconductor layer. Further, out-diffusion of a reflective metal layer is prevented through layer inversion to enhance the thermal stability of an electrode. And the number of accepters for generating holes is increased through heat treatment under an oxygen atmosphere, so that contact resistance can be lowered.
    • 一种形成金属电极的方法和半导体发光元件的制造方法包括提供其上形成有半导体层的基板; 在所述半导体层上形成接合金属层和反射金属层; 以及通过热处理工艺通过接合金属层和反射金属层的层反转而形成金属电极。 半导体层和具有反射金属层的电极之间的界面特性通过层反转现象而增强。 因为反射金属层均匀分布在半导体层上,所以可以获得高的反射率。 此外,通过层反转来防止反射金属层的扩散,从而提高电极的热稳定性。 并且通过在氧气氛下的热处理增加了用于产生孔的接收器的数量,从而可以降低接触电阻。
    • 8. 发明授权
    • Method for manufacturing heterojunction field effect transistor device
    • 异质结场效应晶体管器件的制造方法
    • US06762083B2
    • 2004-07-13
    • US10102856
    • 2002-03-22
    • Jong-Lam LeeChang Min JeonHo Won Jang
    • Jong-Lam LeeChang Min JeonHo Won Jang
    • H01L21338
    • H01L29/66462H01L29/2003H01L29/7787
    • A method for manufacturing a hetero-junction field effect transistor (HFET) device, which includes sequentially forming a non-doped GaN semiconductor layer and an AlGaN semiconductor layer on a substrate, separating devices from each other by etching the substrate, forming a photoresist layer pattern on the AlGaN semiconductor layer and forming gate electrodes by depositing a material on the substrate using the photoresist layer pattern, treating the surface of the AlGaN semiconductor layer, and forming a photoresist layer pattern on the substrate and forming ohmic electrodes by depositing a metal on the substrate using the photoresist layer pattern, is provided. Accordingly, it is possible to overcome a difficulty in aligning the gate electrode with the ohmic electrodes and prevent a substrate from having a step difference introduced by the ohmic electrodes because the gate electrode is formed before the ohmic electrodes are formed. It is possible to form a finer photoresist layer pattern used to form the gate electrode and improve the degree, to which the gate electrode is aligned with the ohmic electrodes. In addition, since the surface of an AlGaN semiconductor layer is treated with ICP before the ohmic electrodes are formed. Thus, it is possible to obtain ohmic characteristics without heat-treating a metal deposited on the AlGaN semiconductor layer to form the ohmic electrodes. Finally, since the maximum transconductance and maximum drain current characteristics of the AlGaN/GaN HFET device are good, the AlGaN/GaN HFET device can have improved amplification capability.
    • 一种用于制造异质结场效应晶体管(HFET)器件的方法,其包括在衬底上顺序地形成非掺杂GaN半导体层和AlGaN半导体层,通过蚀刻衬底将器件彼此分离,形成光致抗蚀剂层 在AlGaN半导体层上形成图案并通过使用光致抗蚀剂层图案在衬底上沉积材料形成栅电极,处理AlGaN半导体层的表面,并在衬底上形成光致抗蚀剂层图案,并通过在金属上沉积金属形成欧姆电极 提供了使用光致抗蚀剂层图案的基板。 因此,由于在形成欧姆电极之前形成栅电极,所以可以克服将栅电极与欧姆电极对准的困难,并防止由欧姆电极引入的阶跃差。 可以形成用于形成栅电极的更细的光致抗蚀剂层图案,并且提高栅电极与欧姆电极对准的程度。 此外,由于在形成欧姆电极之前用ICP处理AlGaN半导体层的表面。 因此,可以在不对AlGaN半导体层上沉积的金属进行热处理以形成欧姆电极的情况下获得欧姆特性。 最后,由于AlGaN / GaN HFET器件的最大跨导和最大漏极电流特性良好,因此AlGaN / GaN HFET器件具有改善的放大能力。
    • 10. 发明授权
    • P-type ohmic electrode in gallium nitride based optical device and fabrication method thereof
    • 氮化镓基光学器件中的P型欧姆电极及其制造方法
    • US06818467B2
    • 2004-11-16
    • US10394045
    • 2003-03-24
    • Jong Lam LeeSoo Young KimHo Won Jang
    • Jong Lam LeeSoo Young KimHo Won Jang
    • H01L2940
    • H01L33/42H01L21/28575H01L33/32
    • A gallium nitride (GaN) based optical device and a fabrication method thereof are provided. The GaN based optical device includes a substrate, a p-type GaN (p-GaN) layer formed on the substrate, and a p-type ohmic electrode formed on the p-GaN layer, wherein the p-type ohmic electrode is formed of a triple layer comprised of a nickel (Ni) layer, a gold (Au) layer and an indium tin oxide (ITO) layer sequentially formed. The thicknesses of the Ni layer and the Au layer forming the triple layer are smaller than the thickness of the ITO layer. When the p-type ohmic electrode in the GaN based optical device is formed of a triple layer comprised of Ni/Au/ITO, the Ni/Au layers reduce contact resistance and the ITO, which is a transparent, conductive oxide layer, increases transparency and increases luminescence efficiency.
    • 提供了一种基于氮化镓(GaN)的光学器件及其制造方法。 GaN基光学器件包括衬底,在衬底上形成的p型GaN(p-GaN)层和形成在p-GaN层上的p型欧姆电极,其中p型欧姆电极由 依次形成由镍(Ni)层,金(Au)层和氧化铟锡(ITO)层构成的三层。 形成三层的Ni层和Au层的厚度小于ITO层的厚度。 当GaN基光学器件中的p型欧姆电极由由Ni / Au / ITO组成的三层形成时,Ni / Au层降低接触电阻,并且作为透明导电氧化物层的ITO增加透明度 并提高发光效率。