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1. 发明授权

US06770383B2 Plated material, method of producing same, and electrical/electronic part using same 有权
标题翻译：电镀材料，其制造方法以及使用其的电气/电子部件
公开(公告)号：US06770383B2
公开(公告)日：2004-08-03
申请号：US10247319
申请日：2002-09-18
申请人： Hitoshi Tanaka , Akira Matsuda , Satoshi Suzuki , Morimasa Tanimoto
发明人： Hitoshi Tanaka , Akira Matsuda , Satoshi Suzuki , Morimasa Tanimoto
IPC分类号： H01R1303
CPC分类号： B32B15/01 , C23C26/00 , C23C28/021 , C23C28/023 , C23C28/028 , H01R13/03 , Y10S428/929 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722
摘要： To provide a plated material having both high heat-resistance and good insertability/extractability. The plated material comprises an undercoating of any one of metals belonging to group 4, group 5, group 6, group 7, group 8, group 9 or group 10 of the periodic table or an alloy containing any one of those metals as a main component, an intermediate coating of Cu or a Cu alloy, and a top-coating of Sn or an Sn alloy, the undercoating, the intermediate coating and the top-coating being formed on a surface of an electrically conductive base in this order, and the thickness of the top-coating is 1.9 times or more the thickness of the intermediate coating.
摘要翻译：提供具有高耐热性和良好的可插入性/可萃取性的电镀材料。电镀材料包括属于周期表第4族，第5族，第6族，第7族，第8族，第9族或第10族的金属中的任一种的底涂层或含有这些金属中的任一种作为主要成分的合金，Cu或Cu合金的中间涂层以及Sn或Sn合金的顶涂层，底涂层，中间涂层和顶涂层依次形成在导电基材的表面上，并且顶涂层的厚度为中间涂层厚度的1.9倍或更多。

2. 发明授权

US6110608A Lead material for electronic part, lead and semiconductor device using the same 失效
标题翻译：电子元件引线材料，铅和半导体器件使用该材料
公开(公告)号：US6110608A
公开(公告)日：2000-08-29
申请号：US987318
申请日：1997-12-09
申请人： Morimasa Tanimoto , Satoshi Suzuki , Akira Matsuda , Kinya Sugie
发明人： Morimasa Tanimoto , Satoshi Suzuki , Akira Matsuda , Kinya Sugie
IPC分类号： B32B15/01 , C22C13/00 , C22C13/02 , H01L23/48 , H01L23/495 , H01V23/48
CPC分类号： H01L23/49582 , B32B15/01 , C22C13/00 , C22C13/02 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L24/45 , H01L24/48 , H01L2924/01039 , H01L2924/01047 , H01L2924/01078 , H01L2924/01322 , H01L2924/181 , H01L2924/19041 , Y10T428/12708 , Y10T428/12715
摘要： A lead material for an electronic part having no adverse effect on the environment, having excellent solderability, desirable welding strength during welding and a low degree of nonuniform thickness of the plated layer during reflow processing. The lead material has a first plated layer and a second plated layer, both of which do not contain Pb, laminated on the surface of a conductive substrate in such order. The melting point of the second plated layer is lower than that of the first plated layer. The first and second plated layers are made of a Sn substance and a Sn alloy, respectively or vice versa.
摘要翻译：用于电子部件的铅材料，对环境没有不利影响，具有优异的可焊性，焊接期间所需的焊接强度和回流处理期间镀层厚度不均匀。引线材料具有第一镀层和第二镀层，它们都不含Pb，按顺序层压在导电衬底的表面上。第二镀层的熔点低于第一镀层的熔点。第一和第二镀层分别由Sn物质和Sn合金制成，反之亦然。

3. 再颁专利

USRE38588E1 Lead material for electronic part, lead and semiconductor device using the same 有权
标题翻译：电子元件引线材料，铅和半导体器件使用该材料
公开(公告)号：USRE38588E1
公开(公告)日：2004-09-14
申请号：US10218559
申请日：2002-08-14
申请人： Morimasa Tanimoto , Satoshi Suzuki , Akira Matsuda , Kinya Sugie
发明人： Morimasa Tanimoto , Satoshi Suzuki , Akira Matsuda , Kinya Sugie
IPC分类号： H01L2348
CPC分类号： H01L23/49582 , B32B15/01 , C22C13/00 , C22C13/02 , H01L24/45 , H01L24/48 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2924/01039 , H01L2924/01047 , H01L2924/01078 , H01L2924/01322 , H01L2924/181 , H01L2924/19041 , Y10T428/12708 , Y10T428/12715 , H01L2924/00014 , H01L2924/00 , H01L2924/2076 , H01L2924/00015 , H01L2924/00012
摘要： A lead material for an electronic part having no adverse effect on the environment, having excellent solderability, desirable welding strength during welding and a low degree of nonuniform thickness of the plated layer during reflow processing. The lead material has a first plated layer and a second plated layer, both of which do not contain Pb, laminated on the surface of a conductive substrate in such order. The melting point of the second plated layer is lower than that of the first plated layer. The first and second plated layers are made of a Sn substance and a Sn alloy, respectively or vice versa.

4. 发明授权

US6140583A Lead member with multiple conductive layers and specific grain size 失效
标题翻译：导电元件具有多个导电层和特定的晶粒尺寸
公开(公告)号：US6140583A
公开(公告)日：2000-10-31
申请号：US864339
申请日：1997-05-28
申请人： Satoshi Suzuki , Morimasa Tanimoto
发明人： Satoshi Suzuki , Morimasa Tanimoto
IPC分类号： C23C28/02 , H01L21/60 , H01L23/48 , H01L23/49 , H01L23/50 , H05K1/00
CPC分类号： H01L24/45 , H01L24/43 , H01L2224/43825 , H01L2224/43848 , H01L2224/45139 , H01L2224/45147 , H01L2224/4516 , H01L2224/45565 , H01L2224/45572 , H01L2224/45573 , H01L2224/45611 , H01L2224/45639 , H01L2224/45644 , H01L2224/45647 , H01L2224/45655 , H01L2224/45657 , H01L2224/45663 , H01L2224/45664 , H01L2224/45669 , H01L2224/45673 , H01L2224/45676 , H01L2224/45678 , H01L2224/4851 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01007 , H01L2924/01011 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/19041 , H01L2924/19043
摘要： A lead member for electronic parts which has excellent heat resistance, oxidation resistance and corrosion resistance and is especially excellent in solderability and a process of producing such a lead member at low cost by plating are provided. The lead member comprises a base, at least a surface region of which is made of Cu or a Cu alloy, a primary coat of Ni, Co, a Ni alloy or a Co alloy and a surface layer of Pd, Ru, a Pd alloy or a Ru alloy formed sequentially on the base in the order mentioned. The primary coat consists of grains having a grain size of 20 .mu.m or more.
摘要翻译：提供了具有优异的耐热性，抗氧化性和耐腐蚀性并且特别优异的可焊性的电子部件的引线部件和通过电镀以低成本制造这种引线部件的工艺。引线构件包括基底，至少其表面区域由Cu或Cu合金制成，Ni，Co，Ni合金或Co合金的初级涂层以及Pd，Ru，Pd合金的表面层或Ru合金按照所述顺序依次形成在基材上。初级涂层由粒径20μm以上的晶粒构成。

5. 发明授权

US5614328A Reflow-plated member and a manufacturing method therefor 失效
标题翻译：回流构件及其制造方法
公开(公告)号：US5614328A
公开(公告)日：1997-03-25
申请号：US534330
申请日：1995-09-27
申请人： Satoshi Suzuki , Kazuya Takahashi , Teruo Kawada , Yuuji Suzuki , Morimasa Tanimoto
发明人： Satoshi Suzuki , Kazuya Takahashi , Teruo Kawada , Yuuji Suzuki , Morimasa Tanimoto
IPC分类号： C25D5/50 , B32B15/20
CPC分类号： C25D5/505 , Y10S379/912 , Y10S428/935 , Y10S428/939 , Y10T428/12715
摘要： Provided is a method for manufacturing a reflow-plated member, which comprises a process for forming a plated layer of Sn or Sn alloy on the surface of a base material, at least the surface of which is formed of Cu or Cu alloy, by electroplating, and a process for running the base material at a traveling speed equivalent to 80% to 90% of the lowest traveling speed that said plated layer does not melt when the base material is continuously run for reflowing in a heating furnace at a predetermined temperature. The obtained reflow-plated member is excellent in any of properties including solderability, heat resistance, bendability, wear resistance, and corrosion resistance.
摘要翻译：提供了一种制造回流部件的方法，其包括在基材表面上形成Sn或Sn合金的镀层的工艺，至少其表面由Cu或Cu合金形成，通过电镀以及当在预定温度下在加热炉中连续运行用于回流的所述镀层不熔化的最低行进速度的80％至90％的行进速度下运行所述基材的工艺。获得的回流镀层构件在包括可焊性，耐热性，弯曲性，耐磨性和耐腐蚀性的任何特性方面都是优异的。

6. 发明授权

US5338618A Electric contact material and electric contact using said material 失效
标题翻译：使用所述材料的电接触材料和电接触
公开(公告)号：US5338618A
公开(公告)日：1994-08-16
申请号：US951587
申请日：1992-09-25
申请人： Satoshi Suzuki , Nobuyuki Shibata , Ryotomo Shirakawa , Akira Matsuda
发明人： Satoshi Suzuki , Nobuyuki Shibata , Ryotomo Shirakawa , Akira Matsuda
IPC分类号： C22C1/10 , C22C5/06 , H01H1/023 , H01H1/0237 , H01H11/04 , H01R39/20 , H01H1/02
CPC分类号： H01H1/0237 , Y10T428/12486 , Y10T428/12882 , Y10T428/12896 , Y10T428/12903
摘要： An electric contact material containing Li oxide of 0.01 to 2.0% by weight when represented in terms of the amount of Li, oxide of at least one rare earth element of 0.05 to 0.18% by weight when represented in terms of the amount of the rare earth element, and Ag or Ag alloy as the remaining portion; an electric contact material containing Li oxide of 0.01 to 2.0% by weight when represented in terms of the amount of Li, at least one rare earth element of 0.05 to 0.18% by weight when represented in terms of the amount of the rare earth element, at least one element selected from a group consisting of In, Sn, Zn, Mn, Pd, Sb, Cu, Mg, Pb, Cd, Cr and Bi by an amount of 0.1 to 1.0% by weight (however, in the case of Zn and Mn, the amount is set less than 0.5% by weight), and/or at least one element selected from a group consisting of Fe, Ni and Co by an amount of 0.03 to 0.6% by weight, and Ag as the remaining portion; and an electric contact formed by using the above material. It is excellent in the arc resistance, wear resistance an lubricity in a small current region and is suitable as the material for a slide contact and rotary slide contact.
摘要翻译：当以稀土量表示的至少一种稀土元素的Li的氧化物为0.05〜0.18重量％表示时，含有0.01〜2.0重量％的Li氧化物的电接触材料元素，Ag或Ag合金作为剩余部分; 当以Li的量表示，含有0.01〜2.0重量％的Li氧化物的电接触材料，当以稀土元素的量表示时，至少一种稀土元素为0.05〜0.18重量％选自由In，Sn，Zn，Mn，Pd，Sb，Cu，Mg，Pb，Cd，Cr和Bi组成的组中的至少一种元素，其量为0.1至1.0重量％（然而，在 Zn和Mn，其含量设定为小于0.5重量％），和/或至少一种选自Fe，Ni和Co的元素的量为0.03至0.6重量％，Ag为剩余量一部分; 以及通过使用上述材料形成的电接触。电弧电阻优良，耐磨性小，在小电流区域具有润滑性，适用于滑动接触和旋转滑动接触的材料。

7. 发明授权

US5171643A Electric contact material and electric contact using said material 失效
标题翻译：电接触材料和电接触使用材料
公开(公告)号：US5171643A
公开(公告)日：1992-12-15
申请号：US556825
申请日：1990-07-23
申请人： Satoshi Suzuki , Nobuyuki Shibata , Ryotomo Shirakawa , Akira Matsuda
发明人： Satoshi Suzuki , Nobuyuki Shibata , Ryotomo Shirakawa , Akira Matsuda
IPC分类号： C22C1/10 , C22C5/06 , H01H1/023 , H01H1/0237 , H01H11/04 , H01R39/20
CPC分类号： H01H1/0237 , Y10T428/12486 , Y10T428/12882 , Y10T428/12896 , Y10T428/12903
摘要： An electric contact material comprising 0.01 to 2.0 weight % of Li, 0.01 weight % or more to less than 0.2 weight % of at least one rare earth metal and the remainder being Ag. The electric contact material may further comprise 0.1 to 1.0 weight % of at least one element selected from a group consisting of In, Sn, Zn, Mn, Pd, Sb, Cu, Mg, Pb, Cd, Cr and Bi, however, for Zn and Mn, the amount is less than 0.5 % by weight; and/or 0.03 to 0.6 weight % of at least one element selected from a group consisting of Fe, Ni and Co. The electric contact material is excellent in arc resistance, wear resistance and lubricity in a small current region and is suitable as a material for a slide contact and a rotary slide contact.

8. 发明申请

US20100120546A1 BOOT FOR CONSTANT-VELOCITY UNIVERSAL JOINT AND CROSS-GROOVED CONSTANT-VELOCITY UNIVERSAL JOINT 有权
标题翻译：启动恒定速度通用联合和跨平台恒定速度通用联接
公开(公告)号：US20100120546A1
公开(公告)日：2010-05-13
申请号：US12444427
申请日：2007-10-12
申请人： Satoshi Suzuki , Kenji Oe , Yuji Furuta , Satoshi Suzuki
发明人： Satoshi Suzuki , Kenji Oe , Yuji Furuta , Satoshi Suzuki
IPC分类号： F16D3/16 , F16J15/52
CPC分类号： F16J3/041 , F16D3/223 , F16D3/845 , F16D2003/22316 , F16D2300/12 , Y10S464/906 , Y10T403/31
摘要： A boot for constant-velocity universal joint comprises a major-diameter cylindrical portion 2, a minor-diameter cylindrical portion 3 being separated away from and being put in place concentrically with the major-diameter cylinder portion 2, and having a smaller diameter than that of the major-diameter cylindrical portion 2, and an intermediate portion 10 connecting the major-diameter cylindrical portion 2 with the minor-diameter cylindrical portion 3. The intermediate portion 10 comprises a stretchable bellows portion 19 being connected with the minor-diameter cylindrical portion 3 integrally, and a rigidity-producing portion 11 being connected with the bellows portion 19 and the major-diameter cylindrical portion 2 integrally. The rigidity-producing portion 11 enlarges diametrically from the bellows portion 19 toward the major-diameter cylindrical portion 2, and additionally at least an outer peripheral surface 101 of the rigidity-producing portion 11 has a plurality of shoulders 61 in a stepwise manner. By means of the rigidity-producing portion 11, the rigidity at around the major-diameter cylindrical portion is enhanced, and thereby it is possible to suppress deformation at the time of assembling.
摘要翻译：用于等速万向接头的保护罩包括一个大直径圆柱形部分2，一个小直径圆柱形部分3与大直径圆筒部分2同心分离并与其直径相比更小，并且具有比该直径圆筒部分2小的直径。以及将长径圆筒部2与小径圆筒部3连结的中间部10.中间部10具有与小径圆筒部连接的伸缩性波纹管部19， 3和一体地形成有与波纹管部19和长径圆筒部2连接的刚性产生部11。刚性产生部分11从波纹管部分19向大直径圆柱形部分2径向扩大，另外，刚性产生部分11的至少外周表面101还具有多个台阶61。通过刚性产生部分11，提高了大直径圆筒部分周围的刚性，从而可以抑制组装时的变形。

9. 发明授权

US08070612B2 Boot for constant-velocity universal joint and cross-grooved constant-velocity universal joint 有权
标题翻译：恒速万向节和十字槽等速万向节引导
公开(公告)号：US08070612B2
公开(公告)日：2011-12-06
申请号：US12444427
申请日：2007-10-12
申请人： Satoshi Suzuki , Kenji Oe , Yuji Furuta , Satoshi Suzuki
发明人： Satoshi Suzuki , Kenji Oe , Yuji Furuta , Satoshi Suzuki
IPC分类号： F16D3/227 , F16D3/84
CPC分类号： F16J3/041 , F16D3/223 , F16D3/845 , F16D2003/22316 , F16D2300/12 , Y10S464/906 , Y10T403/31
摘要： A boot for constant-velocity universal joint comprises a major-diameter cylindrical portion 2, a minor-diameter cylindrical portion 3 being separated away from and being put in place concentrically with the major-diameter cylinder portion 2, and having a smaller diameter than that of the major-diameter cylindrical portion 2, and an intermediate portion 10 connecting the major-diameter cylindrical portion 2 with the minor-diameter cylindrical portion 3. The intermediate portion 10 comprises a stretchable bellows portion 19 being connected with the minor-diameter cylindrical portion 3 integrally, and a rigidity-producing portion 11 being connected with the bellows portion 19 and the major-diameter cylindrical portion 2 integrally. The rigidity-producing portion 11 enlarges diametrically from the bellows portion 19 toward the major-diameter cylindrical portion 2, and additionally at least an outer peripheral surface 101 of the rigidity-producing portion 11 has a plurality of shoulders 61 in a stepwise manner. By means of the rigidity-producing portion 11, the rigidity at around the major-diameter cylindrical portion is enhanced, and thereby it is possible to suppress deformation at the time of assembling.
摘要翻译：用于等速万向接头的保护罩包括一个大直径圆柱形部分2，一个小直径圆柱形部分3与大直径圆筒部分2同心分离并与其直径相比更小，并且具有比该直径圆筒部分2小的直径。以及将长径圆筒部2与小径圆筒部3连结的中间部10.中间部10具有与小径圆筒部连接的伸缩性波纹管部19， 3和一体地形成有与波纹管部19和长径圆筒部2连接的刚性产生部11。刚性产生部分11从波纹管部分19向大直径圆柱形部分2径向扩大，另外，刚性产生部分11的至少外周表面101还具有多个台阶61。通过刚性产生部分11，提高了大直径圆筒部分周围的刚性，从而可以抑制组装时的变形。

10. 发明授权

US09803257B2 High-strength stainless steel pipe 有权
公开(公告)号：US09803257B2
公开(公告)日：2017-10-31
申请号：US13263124
申请日：2009-05-07
申请人： Seiichi Isozaki , Yasutoshi Hideshima , Hiroshi Fujimoto , Satoshi Suzuki
发明人： Seiichi Isozaki , Yasutoshi Hideshima , Hiroshi Fujimoto , Satoshi Suzuki
IPC分类号： C21D9/50 , C21D6/00 , C21D8/10 , C21D9/08 , C21D9/14 , C22C38/02 , C22C38/04 , C22C38/18 , C22C38/40 , C22C38/00 , C22C38/42
CPC分类号： C21D9/50 , C21D6/002 , C21D6/004 , C21D6/008 , C21D8/10 , C21D8/105 , C21D9/08 , C21D9/14 , C21D2211/005 , C21D2211/008 , C22C38/002 , C22C38/02 , C22C38/04 , C22C38/18 , C22C38/40 , C22C38/42 , Y02P10/212
摘要： A stainless steel material having compositions which contain on the basis of percent by mass, C from 0.04 to 0.12%, Ni from 0 (including a case of no addition) to 5.0%, Cr from 12.0 to 17.0%, N from 0.0 to 0.10%, Si from 0.2 to 2.0%, Mn at 2.0% or less, Cu from 0.0 to 2.0%, P at 0.06% or less, S at 0.006% or less, with residue being Fe and unavoidable impurities. Further, a parent phase has any one of a single phase structure of ferrite phase or martensite phase and a diploid phase structure of ferrite phase and martensite phase. An end of the base material is melt-welded as a joint to form a pipe. The parent phase is provided with carbide uniformly separated at grain boundaries and within grains, with a dissolved amount of C being 0.03% by mass or less.

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