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    • 4. 发明申请
    • FILM DEPOSITION APPARATUS, FILM DEPOSITION METHOD AND STORAGE MEDIUM
    • 薄膜沉积装置,薄膜​​沉积方法和储存介质
    • US20130059415A1
    • 2013-03-07
    • US13602587
    • 2012-09-04
    • Hitoshi KATOKatsuyuki HISHIYAShigehiro USHIKUBO
    • Hitoshi KATOKatsuyuki HISHIYAShigehiro USHIKUBO
    • C23C16/505H01L21/50
    • C23C16/45542C23C16/345C23C16/45551H01J37/321H01J37/32733
    • A film deposition apparatus includes a turntable having a substrate mounting area, a first plasma gas supplying part, a second plasma supplying part, a first plasma gas generating part to convert the first plasma generating gas to first plasma, and a second plasma generating part provided away from the first plasma generating part in a circumferential direction and to convert the second plasma generating gas to second plasma. The first plasma generating part includes an antenna facing the turntable so as to convert the first plasma generating gas to the first plasma, and a grounded Faraday shield between the antenna and an area where a plasma process is performed, and to include plural slits respectively extending in directions perpendicular to the antenna and arranged along an antenna extending direction to prevent an electric field from passing toward the substrate and to pass a magnetic field toward the substrate.
    • 一种成膜装置,包括具有基板安装区域的转台,第一等离子体气体供给部,第二等离子体供给部,将第一等离子体产生气体转换为第一等离子体的第一等离子体气体发生部,以及第二等离子体产生部, 在圆周方向上离开第一等离子体产生部分并将第二等离子体产生气体转换成第二等离子体。 第一等离子体产生部件包括面向转盘的天线,以将第一等离子体产生气体转换成第一等离子体,以及天线与执行等离子体处理的区域之间的接地法拉第屏蔽,并且包括分别延伸的多个狭缝 在垂直于天线的方向上并沿着天线延伸方向布置,以防止电场通向衬底并使磁场朝向衬底。
    • 5. 发明申请
    • FILM DEPOSITION APPARATUS
    • 胶片沉积装置
    • US20130042813A1
    • 2013-02-21
    • US13571546
    • 2012-08-10
    • Hitoshi KATOShigehiro UshikuboKatsuyuki Hishiya
    • Hitoshi KATOShigehiro UshikuboKatsuyuki Hishiya
    • C23C16/458
    • C23C16/4412C23C16/45551C23C16/45578H01L21/02164H01L21/02211H01L21/0228
    • A film deposition apparatus includes a turntable including plural substrate placing areas in the circumferential direction; a gas nozzle provided to extend from an inner edge to an outer edge of the substrate placing area; a gas evacuation port provided outside of an outer edge of the turntable and downstream in a rotational direction of the turntable with respect to the gas nozzle for evacuating the gas; and a regulation member including a wall portion provided between the gas nozzle and the gas evacuation port for isolating the gas nozzle and the gas evacuation port at least at a part between the inner edge to the outer edge of the substrate placing area while having a space extending from the inner edge to the outer edge of the substrate placing area when a substrate is placed on the substrate placing area.
    • 一种成膜装置,包括在圆周方向上包括多个基板放置区域的转盘; 气体喷嘴,其设置成从所述基板放置区域的内边缘延伸到外边缘; 气体排出口,其设置在所述转台的外缘的外侧,并且相对于所述气体喷嘴排出所述转台,在所述转台的旋转方向的下游; 以及调节构件,其包括设置在所述气体喷嘴和所述气体排出口之间的壁部,用于至少在所述基板放置区域的内缘与外缘之间的部分处隔开所述气体喷嘴和所述排气口,同时具有空间 当基板被放置在基板放置区域上时,从基板放置区域的内边缘延伸到外边缘。
    • 8. 发明申请
    • FILM DEPOSITION APPARATUS AND FILM DEPOSITION METHOD
    • 膜沉积装置和膜沉积方法
    • US20120267341A1
    • 2012-10-25
    • US13430871
    • 2012-03-27
    • Hitoshi KATOTakeshi Kumagai
    • Hitoshi KATOTakeshi Kumagai
    • C23C16/56
    • H01L21/0228C23C16/045C23C16/402C23C16/45534C23C16/4554C23C16/45551H01L21/02164H01L21/0234
    • A film deposition method includes steps of transferring a substrate having a pattern including a concave part into a vacuum chamber; supplying a first reaction gas to the substrate from a first reaction gas supplying part, thereby allowing the first reaction gas to be adsorbed on the substrate; supplying a second reaction gas that reacts with the first reaction gas to the substrate from a second reaction gas supplying part, thereby allowing the first reaction gas adsorbed on the substrate to react with the second reaction gas and forming a reaction product of the first and the second reaction gases on the substrate; supplying an alteration gas to the substrate through an activated gas supplying part capable of activating the alteration gas; and supplying an etching gas to the substrate chamber through the activated gas supplying part under an environment where the reaction product is not formed.
    • 膜沉积方法包括以下步骤:将具有凹部的图案的基板转印到真空室中; 从第一反应气体供给部向基板供给第一反应气体,由此使第一反应气体吸附在基板上; 从第二反应气体供给部分向基板供给与第一反应气体反应的第二反应气体,从而使吸附在基板上的第一反应气体与第二反应气体反应,形成第一反应气体的反应产物 基板上的第二反应气体; 通过能够激活所述改变气体的活化气体供给部件向所述基板供给改变气体; 以及在没有形成反应产物的环境下通过活性气体供给部分向基材室供给蚀刻气体。
    • 9. 发明申请
    • FILM DEPOSITION APPARATUS
    • 胶片沉积装置
    • US20110155056A1
    • 2011-06-30
    • US12969699
    • 2010-12-16
    • Hitoshi KATOManabu HONMAYasushi TAKEUCHI
    • Hitoshi KATOManabu HONMAYasushi TAKEUCHI
    • C23C16/458
    • H01L21/68764C23C16/45538C23C16/45551H01L21/68771
    • A film deposition apparatus has a vacuum chamber in which a turntable placing plural substrates is rotated, the plural substrates come into contact with plural reaction gases supplied to plural process areas and thin films are deposited on surfaces of the plural substrates, and has plural reaction gas supplying portions for supplying the plural processing gases, a separation gas supplying portion for supplying a separation gas and an evacuation mechanism for ejecting the plural processing gases and the separation gas, wherein the plural process areas includes a first process area for causing a first reaction gas to adsorb on the surfaces of the plural substrates, and a second process area, having an area larger than the first process area, for causing the first reaction gas having adsorbed the surfaces of the plural substrates and a second reaction gas to react, and depositing the films on the surfaces of the plural substrates.
    • 一种成膜装置具有:真空室,其中放置多个基板的转台旋转,多个基板与多个处理区域供应的多个反应气体接触,薄膜沉积在多个基板的表面上,并且具有多个反应气体 用于供给多种处理气体的供给部分,用于供给分离气体的分离气体供给部分和用于喷射多种处理气体和分离气体的排出机构,其中多个处理区域包括:第一处理区域,用于使第一反应气体 吸附在多个基板的表面上,以及具有比第一处理区域大的面积的第二处理区域,用于使吸附有多个基板的表面的第一反应气体和第二反应气体反应, 在多个基板的表面上的膜。