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1. 发明专利

JP2009233713A Laser beam machining apparatus 有权
标题翻译：激光加工设备
公开(公告)号：JP2009233713A
公开(公告)日：2009-10-15
申请号：JP2008083898
申请日：2008-03-27
申请人： Hitachi Via Mechanics Ltd , 日立ビアメカニクス株式会社
发明人： ITO YASUSHI , KITA YASUHIKO
IPC分类号： B23K26/10 , B23K26/16 , B23K26/42
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus capable of machining a thin and low-rigidity workpiece highly precisely, eliminating needs of the recovery work of scraps and a tool setting-up operation, and efficiently collecting the scraps cut from the workpiece.
SOLUTION: A machining table 15 of the laser beam machining apparatus is provided with: a space 60a formed inside; a through-hole 61b through which a workpiece placing face 61c and the space are communicated with each other and the scraps 70 of the workpiece can be falled into the space; and a through-hole 61a through which the workpiece placing face and the space are communicated with each other and whose cross section is smaller than the through-hole 61b. A negative pressure source stops up the through-holes 61b, 61a, adsorbing to the workpiece placing face 61c the workpiece W placed thereon and, after the workpiece W is machined and removed, sucking the air in the space 60a where the through-holes 61b, 61a are covered with a shielding plate 40, and suctionally collecting the scraps 70 fell in the space.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供能够高精度地加工薄而低刚度工件的激光束加工装置，消除了废料回收工作的需要和工具设置操作，并且有效地收集废料切割从工件。解决方案：激光束加工装置的加工台15设置有：内部形成的空间60a; 工件放置面61c和空间彼此连通的通孔61b和工件的废料70可以落入空间中; 以及通孔61a，工件配置面和空间通过该通孔61a彼此连通且横截面小于通孔61b。负压源阻止在其上放置工件W吸附到工件放置面61c的通孔61b，61a，并且在加工和移除工件W之后，在通孔61b的空间60a中吸入空气 61a被遮蔽板40覆盖，并且抽吸收集废料70落在空间中。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2006205261A Drilling device of printed circuit board 审中-公开
标题翻译：印刷电路板钻孔装置
公开(公告)号：JP2006205261A
公开(公告)日：2006-08-10
申请号：JP2006112650
申请日：2006-04-14
申请人： Hitachi Via Mechanics Ltd , 日立ビアメカニクス株式会社
发明人： ARAI KUNIO , ISHII KAZUHISA , KITA YASUHIKO
IPC分类号： B23K26/067 , B23K26/00 , B23K26/38 , B23K101/42 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a working device appropriate for a drilling method of a printed circuit board which improves the reliability of working and the quality of a hole and eliminates the need for a desmear process by performing working so as not to allow films to remain in the bottom of the hole. SOLUTION: The substrate working device arranged in such a manner that a laser beam radiated from a UV laser source is distributed by a light deflector to two directions and the each energy density, energy space distribution and beam diameter can be set by discrete setting means is used. The energy density of the first UV laser beam is made higher than the resolution energy threshold value of a conductive layer and a hole is drilled down to an insulating layer immediate before the desired conductor layer. Next, the laser beam is switched to a second UV laser beam made lower than the resolution energy threshold value of the conductive layer and made higher than the resolution energy threshold value of the insulation layer and the remaining insulating layer is removed. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供适合于印刷电路板的钻孔方法的工作装置，其提高了加工的可靠性和孔的质量，并且通过执行工作来消除对去污工艺的需要，从而不允许胶片留在孔的底部。解决方案：基板工作装置以从UV激光源辐射的激光束通过光偏转器分布到两个方向的方式布置，并且每个能量密度，能量空间分布和光束直径可以通过离散设置使用设定方式。使第一UV激光束的能量密度高于导电层的分辨率能量阈值，并且在期望的导体层之前立即将孔向下钻取到绝缘层。接下来，将激光束切换到低于导电层的分辨率能量阈值的第二UV激光束，并使其高于绝缘层的分辨率能量阈值，并且去除剩余的绝缘层。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2008055485A Laser beam machining method and apparatus 有权
标题翻译：激光束加工方法和装置
公开(公告)号：JP2008055485A
公开(公告)日：2008-03-13
申请号：JP2006237033
申请日：2006-08-31
申请人： Hitachi Via Mechanics Ltd , 日立ビアメカニクス株式会社
发明人： ARAI KUNIO , KITA YASUHIKO , ITO YASUSHI
IPC分类号： B23K26/04 , B23K26/06 , B23K26/08 , G02B13/00 , G02B17/08
CPC分类号： B23K26/0648 , B23K26/064 , B23K26/0643 , B23K26/082 , B23K26/382 , B23K2201/42 , B23K2203/50
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machining method and apparatus capable of efficiently machining a hole that is superior in shape accuracy. SOLUTION: A cylindrical lens 50a and/or 50b for correcting deformation of the reflection area of a mirror 1a and/or 1b is arranged on the optical axis of a laser beam 20 and the converging position of X and Y components of the laser beam 20 is aligned with the optical axis direction. In place of the cylindrical lens, a reflection mirror having a curved reflection area may be used. As a method of aligning the converging position of the X and Y components of the laser beam 20 with the optical axis direction, both the X and Y components may be made to coincide with a design position Fa. As an alternative, one is not corrected and the other may be made to coincide with the uncorrected one. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供能够有效地加工形状精度优异的孔的激光束加工方法和装置。解决方案：用于校正反射镜1a和/或1b的反射区域的变形的柱面透镜50a和/或50b布置在激光束20的光轴上，并且X和Y分量的会聚位置激光束20与光轴方向对准。可以使用具有弯曲反射区域的反射镜来代替柱面透镜。作为将激光光束20的X成分和Y成分的会聚位置与光轴方向对准的方法，可以使X和Y成分与设计位置Fa一致。作为替代，一个不被修正，另一个可以与未校正的一致。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2007322557A Fθ LENS 有权
标题翻译： Ftheta LENS
公开(公告)号：JP2007322557A
公开(公告)日：2007-12-13
申请号：JP2006150704
申请日：2006-05-30
申请人： Hitachi Via Mechanics Ltd , 日立ビアメカニクス株式会社
发明人： ARAI KUNIO , KITA YASUHIKO , KUBOTA AKIHIRO , UENO FUMIHIRO
IPC分类号： G02B7/02 , G02B13/00 , G02B26/10
摘要： PROBLEM TO BE SOLVED: To provide an fθ lens which is easily assembled and has a uniform characteristic.
SOLUTION: The fθ lens 30 is configuredd by holding single lenses 1A, 1B and 1C in cases 50A, 50B and 50C, respectively, and the cases 50A, 50B and 50C are connected one another in an optical axis direction O. The cases 50B and 50C have recessed parts 6b and 6c for housing the single lenses at one side end part, and recessed parts 20 and 21 for housing the other cases on the other side end part, respectively. Further two single lenses can be housed in one case.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种易于组装且具有均匀特性的fθ透镜。解决方案：通过在情况50A，50B和50C中分别保持单个透镜1A，1B和1C来配置fθ透镜30，并且盒50A，50B和50C在光轴方向O上彼此连接。壳体50B和50C具有用于在一个侧端部处容纳单个透镜的凹部6b和6c，以及用于将另一个壳体容纳在另一侧端部的凹部20和21。另外两个单一透镜可以容纳在一个壳体中。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2004216385A Laser drilling method 审中-公开
公开(公告)号：JP2004216385A
公开(公告)日：2004-08-05
申请号：JP2003003365
申请日：2003-01-09
申请人： Hitachi Via Mechanics Ltd , 日立ビアメカニクス株式会社
发明人： ARAI KUNIO , KITA YASUHIKO
IPC分类号： B23K26/00 , B23K26/04 , B23K26/08 , B23K26/38 , B23K101/42 , H05K3/00
CPC分类号： B23K26/042 , B23K26/08 , B23K26/082 , B23K26/382 , B23K2201/42 , B23K2203/30 , B23K2203/50 , H05K3/0026 , H05K3/0032 , H05K2201/068
摘要： PROBLEM TO BE SOLVED: To dissolve the problem that a hole positional precision is degraded to ≥±20 μm since the input energy is large to cause rapid temperature rising in a laser drilling process of a base board large in thermal coefficient of expansion and thick in material thickness. SOLUTION: In this drilling method, the drilling is performed so as to drill toward the inner peripheral side of the working area in order while changing a beam position around in the peripheral direction from the outer peripheral side of the working area. In this way, thermal deformation becomes tension at a central-symmetric and inner peripheral part in the working area and thus, since the strain is not developed, the hole positional precision can be improved. COPYRIGHT: (C)2004,JPO&NCIPI

6. 发明专利

DE10149559A1 未知
公开(公告)号：DE10149559A1
公开(公告)日：2002-04-11
申请号：DE10149559
申请日：2001-10-08
申请人： HITACHI VIA MECHANICS LTD
发明人： ARAI KUNIO , ISHII KAZUHISA , KITA YASUHIKO
IPC分类号： B23K26/06 , B23K26/067 , B23K26/38 , H05K1/03 , H05K3/00 , H05K3/40

7. 发明专利

DE10149559B4 Vorrichtung und Verfahren zur Laserbearbeitung einer gedruckten Verdrahtungsplatte 未知
公开(公告)号：DE10149559B4
公开(公告)日：2012-12-20
申请号：DE10149559
申请日：2001-10-08
申请人： HITACHI VIA MECHANICS LTD
发明人： ARAI KUNIO , ISHII KAZUHISA , KITA YASUHIKO
IPC分类号： H05K3/00 , B23K26/06 , B23K26/067 , B23K26/38 , H05K1/03
摘要： Vorrichtung zur Laserbearbeitung einer gedruckten Verdrahtungsplatte, mit • einem Laserkopf (1), • einer optischen Ablenkvorrichtung (6) zum Umschalten von optischen Pfaden des von dem Laserkopf (1) emittierten Laserstrahls (2), • entlang den optischen Pfaden angeordneten optischen Elementen (3i, 4i, 5i, 30i, 3k, 4k, 5k, 30k) zum individuellen Einstellen der Energiedichten, der räumlichen Energieverteilungen und der Strahlendurchmesser der Laserstrahlen (2i, 2k), gekennzeichnet durch eine Strahlenkombiniervorrichtung (10), um die mittels der optischen Elemente eingestellten Laserstrahlen (2i, 2k) auf einem gemeinsamen optischen Pfad zur Weiterbewegung zu leiten.

8. 发明专利

JP2003136268A METHOD FOR DRILLING PRINTED BOARD 审中-公开
公开(公告)号：JP2003136268A
公开(公告)日：2003-05-14
申请号：JP2001340196
申请日：2001-11-06
申请人： HITACHI VIA MECHANICS LTD
发明人： ARAI KUNIO , KITA YASUHIKO
IPC分类号： B23K26/00 , B23K26/18 , B23K26/382 , B23K101/42 , H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To control the shape of a hole drilled in a resin film layer, a surface- roughened external conductor copper layer, and an insulating resin layer in this order from above, which are different from each other in materials. SOLUTION: By making a laser beam pulse to-hat shaped and controlling a pulse width, these can be controlled diameters of the lower part of the hole of the resin film layer, of the hole of the external conductor layer, and of the upper part of the hole of the insulating resin layer.

9. 发明专利

JP2002335063A METHOD AND APPARATUS FOR DRILLING PRINTED BOARD 失效
公开(公告)号：JP2002335063A
公开(公告)日：2002-11-22
申请号：JP2001138204
申请日：2001-05-09
申请人： HITACHI VIA MECHANICS LTD
发明人： ARAI KUNIO , ISHII KAZUHISA , KITA YASUHIKO
IPC分类号： B23K26/382 , B23K26/06 , B23K26/073 , B23K101/42 , H05K3/00 , B23K26/00
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for drilling a printed board without necessity of a desmearing step by improving reliability of working and the quality of a hole and working so as not to leave a film at the bottom of the hole. SOLUTION: The method for drilling a printed board comprises steps of setting an energy density of a first UV laser beam to a higher energy density than a decomposing energy threshold value of a conductor layer, working the board, and drilling a hole up to an insulating layer immediately before the conductor layer to be an object. The method further comprises steps of then setting an energy density of a second UV laser beam to a value lower than the decomposing energy threshold value of the conductor layer and higher than the decomposing energy threshold value of an insulating layer, working the residual insulating layer, and exposing an object conductor layer.

10. 发明专利

JP2002118344A METHOD AND DEVICE FOR WORKING PRINTED CIRCUIT BOARD 失效
公开(公告)号：JP2002118344A
公开(公告)日：2002-04-19
申请号：JP2000308355
申请日：2000-10-06
申请人： HITACHI VIA MECHANICS LTD
发明人： ARAI KUNIO , ISHII KAZUHISA , KITA YASUHIKO
IPC分类号： B23K26/06 , B23K26/073 , B23K26/382 , B23K101/42 , H05K3/00 , B23K26/00
摘要： PROBLEM TO BE SOLVED: To provide a method and a device for boring a printed circuit board, with which reliability in working and the quality of a bore can be improved and a desmear process is unnecessitated by leaving no remaining film on the bottom of the bore. SOLUTION: In the working method for the printed circuit board, the first layer of a surface is a conductor layer and the conductor layer and an insulating layer are alternately laminated. The conductor layer of the first layer is worked while making the energy density of the laser light of a first wavelength with high absorbent ratio at the conductor layer and the insulating layer into a level higher than the decomposition threshold of the conductor layer and the insulating layer. The insulating layer of the second layer is worked while making the energy density of the laser light of a second wavelength with low absorbent ratio at the conductor layer, but with high absorbent ratio at the insulating layer, into a level lower than the decomposition threshold of the conductor layer and higher than the decomposition threshold of the insulating layer. The insulating layer of the second layer is finished while making the energy density of the laser light of a third wavelength with high absorbent ratio of at the insulating layer, into energy density higher than the decomposition threshold of the insulating layer and lower than the decomposition threshold of the conductor layer so that the conductor layer of the third layer can be exposed.

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