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1. 发明专利

DE10149559B4 Vorrichtung und Verfahren zur Laserbearbeitung einer gedruckten Verdrahtungsplatte 未知
公开(公告)号：DE10149559B4
公开(公告)日：2012-12-20
申请号：DE10149559
申请日：2001-10-08
申请人： HITACHI VIA MECHANICS LTD
发明人： ARAI KUNIO , ISHII KAZUHISA , KITA YASUHIKO
IPC分类号： H05K3/00 , B23K26/06 , B23K26/067 , B23K26/38 , H05K1/03
摘要： Vorrichtung zur Laserbearbeitung einer gedruckten Verdrahtungsplatte, mit • einem Laserkopf (1), • einer optischen Ablenkvorrichtung (6) zum Umschalten von optischen Pfaden des von dem Laserkopf (1) emittierten Laserstrahls (2), • entlang den optischen Pfaden angeordneten optischen Elementen (3i, 4i, 5i, 30i, 3k, 4k, 5k, 30k) zum individuellen Einstellen der Energiedichten, der räumlichen Energieverteilungen und der Strahlendurchmesser der Laserstrahlen (2i, 2k), gekennzeichnet durch eine Strahlenkombiniervorrichtung (10), um die mittels der optischen Elemente eingestellten Laserstrahlen (2i, 2k) auf einem gemeinsamen optischen Pfad zur Weiterbewegung zu leiten.

2. 发明专利

DE112010000963T5 Verfahren und Vorrichtung zum maschinellen Bearbeiten einer Dünnfilmschicht eines Werkstücks 未知
公开(公告)号：DE112010000963T5
公开(公告)日：2012-08-02
申请号：DE112010000963
申请日：2010-02-24
申请人： HITACHI VIA MECHANICS LTD
发明人： KANAYA YASUHIKO , HONDA HIROSHI , ARAI KUNIO , ISHII KAZUHISA
IPC分类号： B23K26/36 , B23K26/10 , B23K26/12 , B23K26/14 , B23K26/16 , B23K26/42 , B65G49/06 , H01L21/677 , H01L31/04
摘要： Eine Vorrichtung zum Bearbeiten bzw. maschinellen Bearbeiten einer Dünnfilmschicht eines Werkstücks, das ein transparentes Glas ist, auf dem eine Dünnfilmschicht auf seiner oberen Oberfläche angeordnet ist, enthält eine Werkstückunterseitenstützeinrichtung zum Stützen des Werkstücks in einer vertikalen Richtung durch einen Luftauftriebsmechanismus und einen Saugmechanismus, eine Klemmeneinrichtung zum Greifen des Werkstücks, so dass der Bewegung in der vertikalen Richtung des Werkstücks bzw. des Werkstücks in der vertikalen Richtung gefolgt wird, und einen Bearbeitungskopf zum Bearbeiten der Dünnfilmschicht mit einem Laserstrahl. Der Bearbeitungskopf bearbeitet die Dünnfilmschicht auf der oberen Oberfläche des Werkstücks, indem er das Werkstück mit einem Laserstrahl bestrahlt, der durch die Unterseite des Werkstücks eintritt. Ferner enthaltend Düsen, die Dünnfilmschicht wird bearbeitet, während das Kühlmedium von den auf der Dünnfilmschichtseite angeordneten Düsen zugeführt wird.

3. 发明专利

DE102004042032A1 未知
公开(公告)号：DE102004042032A1
公开(公告)日：2005-08-04
申请号：DE102004042032
申请日：2004-08-31
申请人： HITACHI VIA MECHANICS LTD
发明人： ARAI KUNIO , ISHII KAZUHISA , ASHIZAWA HIROAKI
IPC分类号： B23K26/06 , B23K26/073 , B23K26/382 , B23K101/40 , B23K101/42 , H05K3/00 , B23K26/40
摘要： A laser machining method and a laser machining apparatus superior in hole position accuracy and hole quality. An outgoing beam outputted as short pulses is shaped by a pulse shaping unit so as to form a #1 branch beam. The #1 branch beam is supplied to a portion to be machined, so as to machine the portion. In this case, the #1 branch beam may be controlled to synchronize with the outgoing beam. When a piece to be machined is made from a metal material and at least one of an organic material and an inorganic material, the metal material is machined with a laser beam shaped to have a pulse width not shorter than 100 ns, and at least one of the organic material and the inorganic material is machined with a laser beam shaped to have a pulse width shorter than 100 ns.

4. 发明专利

DE10149559A1 未知
公开(公告)号：DE10149559A1
公开(公告)日：2002-04-11
申请号：DE10149559
申请日：2001-10-08
申请人： HITACHI VIA MECHANICS LTD
发明人： ARAI KUNIO , ISHII KAZUHISA , KITA YASUHIKO
IPC分类号： B23K26/06 , B23K26/067 , B23K26/38 , H05K1/03 , H05K3/00 , H05K3/40

5. 发明专利

JP2006205261A Drilling device of printed circuit board 审中-公开
标题翻译：印刷电路板钻孔装置
公开(公告)号：JP2006205261A
公开(公告)日：2006-08-10
申请号：JP2006112650
申请日：2006-04-14
申请人： Hitachi Via Mechanics Ltd , 日立ビアメカニクス株式会社
发明人： ARAI KUNIO , ISHII KAZUHISA , KITA YASUHIKO
IPC分类号： B23K26/067 , B23K26/00 , B23K26/38 , B23K101/42 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a working device appropriate for a drilling method of a printed circuit board which improves the reliability of working and the quality of a hole and eliminates the need for a desmear process by performing working so as not to allow films to remain in the bottom of the hole. SOLUTION: The substrate working device arranged in such a manner that a laser beam radiated from a UV laser source is distributed by a light deflector to two directions and the each energy density, energy space distribution and beam diameter can be set by discrete setting means is used. The energy density of the first UV laser beam is made higher than the resolution energy threshold value of a conductive layer and a hole is drilled down to an insulating layer immediate before the desired conductor layer. Next, the laser beam is switched to a second UV laser beam made lower than the resolution energy threshold value of the conductive layer and made higher than the resolution energy threshold value of the insulation layer and the remaining insulating layer is removed. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供适合于印刷电路板的钻孔方法的工作装置，其提高了加工的可靠性和孔的质量，并且通过执行工作来消除对去污工艺的需要，从而不允许胶片留在孔的底部。解决方案：基板工作装置以从UV激光源辐射的激光束通过光偏转器分布到两个方向的方式布置，并且每个能量密度，能量空间分布和光束直径可以通过离散设置使用设定方式。使第一UV激光束的能量密度高于导电层的分辨率能量阈值，并且在期望的导体层之前立即将孔向下钻取到绝缘层。接下来，将激光束切换到低于导电层的分辨率能量阈值的第二UV激光束，并使其高于绝缘层的分辨率能量阈值，并且去除剩余的绝缘层。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2001198690A LASER MACHINING DEVICE 失效
公开(公告)号：JP2001198690A
公开(公告)日：2001-07-24
申请号：JP2000007145
申请日：2000-01-14
申请人： HITACHI VIA MECHANICS LTD
发明人： ARAI KUNIO , AOYAMA HIROSHI , ISHII KAZUHISA
IPC分类号： B23K26/046 , B23K26/03 , G02B26/10 , H05K3/00 , B23K26/04 , B23K26/02
摘要： PROBLEM TO BE SOLVED: To provide a laser machining device which has an excellent machining precision and gives an improved working rate of the device even when the environmental condition of the body of a scanner varies. SOLUTION: A reflection face 7b in parallel with the reflection face 7a of a mirror 7 is provided on the opposite side of the reflection face 7a, and a beam radiation device 21 which radiates a guide beam 24 different from a machining laser beam 12, and a light receiving device 23 are provided. The light receiving device 23 is arranged at a position which is opposite to the beam radiation device 21 with respect to an axis perpendicular to the reflection face 7a of the mirror 7 so that the guide beam 24 is received. A rotation angle of the reflection face 7a is detected from the position of the guide beam 24 received by the light receiving device 23. A beam splitter 22 is arranged in the optical path of the guide beam 24, the magnitude of the displacement of the incident angle of the guide beam 24 with respect to the reflection face 7b is decided by measuring the displacement of the beam radiation device 21 by means of a light receiving device 25, the rotation angle of the reflection face 7a is corrected, then the positioning precision of the reflection face 7a is further improved.

7. 发明专利

JP2008012916A Composite sheet, machining method of composite sheet and laser machining device 审中-公开
标题翻译：复合板，复合板和激光加工装置的加工方法
公开(公告)号：JP2008012916A
公开(公告)日：2008-01-24
申请号：JP2007149531
申请日：2007-06-05
申请人： Hitachi Via Mechanics Ltd , 日立ビアメカニクス株式会社
发明人： ARAI KUNIO , MATSUMOTO TADASHI , NISHIYAMA HIROMI , ISHII KAZUHISA
IPC分类号： B32B3/12 , B23K26/00 , B23K26/067 , B23K26/38 , B23K26/40 , B32B27/36
CPC分类号： B23K26/082 , B23K26/067 , B23K26/384 , B23K26/389 , B23K2201/34 , B23K2201/40 , Y10T428/24298 , Y10T428/24306
摘要： PROBLEM TO BE SOLVED: To reduce machining steps to lower production unit cost. SOLUTION: A laser oscillator 8 outputs a pulsed laser at a frequency f. A mask 13 shapes the outer shape of the laser into a triangular, quadrangular or hexagonal shape. N pieces of time-sharing means 10 time-share the laser to form N lasers having a frequency f/N. N pairs of positioning means 29, 30 position the time-shared lasers. A condenser lens 32 condenses the lasers. A rotating drum 18 displaces a workpiece. A control means controls the moving device of the time-sharing means 10, the N pairs of positioning means 29, 30 and a pedestal 19. The N pairs of positioning means 29, 30 are positioned to irradiate predetermined positions with the lasers. The pedestal 19 is moved. The time-sharing means 10 are thereupon operated in a predetermined order. The composite sheet A is machined to make holes whose outer shapes depend on the mask 13 so that distances between sides of adjacent holes are equal to one another. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：减少加工步骤降低生产单位成本。解决方案：激光振荡器8以频率f输出脉冲激光。掩模13将激光的外形形成三角形，四边形或六边形。 N个分时装置10对激光器进行时间分配以形成具有频率f / N的N个激光器。 N对定位装置29,30定位时分激光。聚光透镜32冷凝激光。旋转滚筒18移动工件。控制装置控制分时装置10的移动装置，N对定位装置29,30和基座19.N对定位装置29,30被定位成用激光照射预定位置。基座19移动。分时装置10随后以预定顺序操作。加工复合片A以形成其外形取决于掩模13的孔，使得相邻孔的侧面之间的距离彼此相等。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2005199323A Laser beam machining method and laser beam machining device 有权
标题翻译：激光束加工方法和激光束加工装置
公开(公告)号：JP2005199323A
公开(公告)日：2005-07-28
申请号：JP2004009421
申请日：2004-01-16
申请人： Hitachi Via Mechanics Ltd , 日立ビアメカニクス株式会社
发明人： ARAI KUNIO , ISHII KAZUHISA , ASHIZAWA HIROAKI
IPC分类号： B23K26/04 , B23K26/06 , B23K26/073 , B23K101/40 , B23K101/42 , H05K3/00
CPC分类号： H05K3/0038 , B23K26/04 , B23K26/0622 , B23K26/384 , B23K2201/42 , B23K2203/12
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machining method and a laser beam machining device which are excellent in hole positional precision and hole quality. SOLUTION: An outgoing beam 6 to be short-pulsed and outputted is shaped by a pulse shaping means to form a #1 branch beam 7, and the #1 branch beam 7 is fed to a machining part so as to perform machining. In this case, preferably, the #1 branch beam 7 is made synchronous with the outgoing beam 6. Then, in the case the object for machining is composed of a metallic material and at least either an organic material or an inorganic material, the metallic material is machined by laser light shaped so as to have a pulse width of ≥100 nm, and the organic material and/or inorganic material is machined by laser light shaped so as to have a pulse width of COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供孔位置精度和孔质量优异的激光束加工方法和激光束加工装置。解决方案：短脉冲输出的出射束6由脉冲整形装置整形，形成＃1分支光束7，＃1分支光束7被馈送到加工部分，以进行加工。在这种情况下，优选地，＃1分支光束7与出射光束6同步。然后，在加工对象由金属材料和至少一种有机材料或无机材料构成的情况下，金属材料通过激光加工成具有≥100nm的脉冲宽度，有机材料和/或无机材料通过激光加工成具有<100ns的脉冲宽度。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2011143434A Laser beam drilling method 审中-公开
标题翻译：激光束钻孔方法
公开(公告)号：JP2011143434A
公开(公告)日：2011-07-28
申请号：JP2010005508
申请日：2010-01-14
申请人： Hitachi Via Mechanics Ltd , 日立ビアメカニクス株式会社
发明人： SHIGENOBU KEIGO , ARAI KUNIO , KANETANI YASUHIKO , ISHII KAZUHISA , HONDA HIROSHI
IPC分类号： B23K26/38 , B23K26/40 , C03C23/00
摘要： PROBLEM TO BE SOLVED: To provide laser beam drilling (with a hole diameter of about 1 to 10 mm) for rapidly forming a hole in a glass substrate having a thickness of about 1-10 mm by using laser beam while the residual stress is suppressed.
SOLUTION: First, a hole is rapidly drilled in a glass substrate with CO
2 laser beam, and then an inner wall of the hole is finished with the removing width being ≥100 μm by using UV laser beam to the hole. Thus, the hole with less residual stress, and less burrs in the inner wall of the hole or the like can be formed in the glass substrate without using any drill.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供通过使用激光束在具有约1-10mm的厚度的玻璃基板中快速形成孔的激光束钻孔（孔直径为约1至10mm），同时残留压力被抑制。
解决方案：首先，在具有CO 2 激光束的玻璃基板中快速钻孔，然后通过使用紫外线去除孔的内壁，去除宽度≥100μm 激光束到孔。因此，可以在玻璃基板中形成具有较小残余应力的孔，并且在孔的内壁中的毛刺较少，而不需要使用任何钻头。版权所有（C）2011，JPO＆INPIT

10. 发明专利

JP2003158358A LASER PERFORATION WORKING METHOD AND EQUIPMENT 审中-公开
公开(公告)号：JP2003158358A
公开(公告)日：2003-05-30
申请号：JP2001359425
申请日：2001-11-26
申请人： HITACHI VIA MECHANICS LTD
发明人： ARAI KUNIO , ISHII KAZUHISA
IPC分类号： B23K26/382 , B23K26/18 , B23K101/42 , H05K1/00 , H05K3/00 , B23K26/00
摘要： PROBLEM TO BE SOLVED: To provide a laser perforation working method wherein a sag part, a bulge part, wrinkles, etc., of a copper foil which are to be generated when an ultraviolet laser light in which surface roughening treatment is unnecessary is used to a thin copper clad film are not generated. SOLUTION: A working method of a copper clad film is used which method has a feature that an ultraviolet laser is used as a laser light, a resin film is stuck on a rear of a surface which the laser light is made to enter, working is performed and the resin film on the rear is exfoliated after the working is finished. Since sagging of the copper foil is depressed by the resin film stuck on the rear, the laser light can be supplied effectively to the copper foil, and the copper foil can be eliminated perfectly by ablation. Also in the case of a blind hole, a bulge of the copper foil can be depressed by the resin film stuck on the rear. Generation of wrinkles can be also restrained.

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