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1. 发明专利

DE3940909C2 未知
公开(公告)号：DE3940909C2
公开(公告)日：2002-04-25
申请号：DE3940909
申请日：1989-12-11
申请人： HITACHI LTD
发明人： NISHIDA HIROSHI , ISHIGAKI TATSUYA , ITO ATSUSHI , KUDOU YOSHINOBU , KATOU HIROSHI , FUJII KOUSUKE
IPC分类号： G11B21/16 , G11B5/48 , G11B21/21 , G11B25/04 , G11B33/12 , G11B17/32
摘要： A magnetic disk apparatus has a base member and a cover mounted on the base member to form an enclosure having at least six magnetic disks rotatably supported therein. First and second transducers are included for writing information on and reading information from upper and lower surfaces of adjacent ones of the magnetic disks. The transducers are supported by leaf springs in close proximity to both surfaces of adjacent ones of the magnetic disks. The leaf springs extend in a radial direction with respect to the magnetic disks and are supported on one end by a plurality of head arms. The leaf springs are arranged substantially within the same plane parallel to the magnetic disks so they do not overlie one another. A voice coil motor is provided for moving the head arms in order to position the transducer pairs in predetermined positions. A circuit board is included for controlling the magnetic disk apparatus.

2. 发明专利

DE3940909A1 未知
公开(公告)号：DE3940909A1
公开(公告)日：1990-06-13
申请号：DE3940909
申请日：1989-12-11
申请人： HITACHI LTD
发明人： NISHIDA HIROSHI , ISHIGAKI TATSUYA , ITO ATSUSHI , KUDOU YOSHINOBU , KATOU HIROSHI , FUJII KOUSUKE
IPC分类号： G11B21/16 , G11B5/48 , G11B21/21 , G11B25/04 , G11B33/12
摘要： A magnetic disk apparatus has a base member and a cover mounted on the base member to form an enclosure having at least six magnetic disks rotatably supported therein. First and second transducers are included for writing information on and reading information from upper and lower surfaces of adjacent ones of the magnetic disks. The transducers are supported by leaf springs in close proximity to both surfaces of adjacent ones of the magnetic disks. The leaf springs extend in a radial direction with respect to the magnetic disks and are supported on one end by a plurality of head arms. The leaf springs are arranged substantially within the same plane parallel to the magnetic disks so they do not overlie one another. A voice coil motor is provided for moving the head arms in order to position the transducer pairs in predetermined positions. A circuit board is included for controlling the magnetic disk apparatus.

3. 发明专利

JPS59107527A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：JPS59107527A
公开(公告)日：1984-06-21
申请号：JP21683882
申请日：1982-12-13
申请人： Hitachi Ltd
发明人： KOBAYASHI MASAMICHI , KATOU HIROSHI , HOTSUCHI CHIYOKO
IPC分类号： H01L21/52 , H01L21/58 , H01S5/00
CPC分类号： H01L24/83 , H01L24/26 , H01L2224/48091 , H01L2224/48137 , H01L2224/4823 , H01L2224/8319 , H01L2224/8385 , H01L2924/01029 , H01L2924/01042 , H01L2924/07802 , H01L2924/10329 , H01L2924/15312 , H01L2924/351 , H01L2924/00014 , H01L2924/00
摘要： PURPOSE:To prevent application of a large thermal stress on GaAs by a method wherein the supporting body of a GaAs element is composed of Mo. CONSTITUTION:A GaAs chip 4 is adhered to the main surface of the Cu stem 2 provided in the center of the main surface of a Cu flange 1 using PbSn 5 through the intermediary of an Mo 3. Said Mo has the linear expansion coefficience approximate to that of the GaAs element, and has the thermal conductivity larger than that of GaAs, and the Mo is almost equal to Si both in linear expansion coefficient and thermal conductivity. Accordingly, thermal stress is not applied to the chip 4, thereby enabling to extend the life of the GaAs element.
摘要翻译：目的：通过GaAs元件的支撑体由Mo构成的方法防止在GaAs上施加大的热应力。构成：GaAs芯片4粘附在设置在中心的Cu芯柱2的主表面上使用PbSn 5通过Mo 3中间体的Cu凸缘1的主表面。所述Mo的线性膨胀系数近似于GaAs元件的线性膨胀系数，并且具有比GaAs更高的导热系数，并且Mo几乎等于Si的线性膨胀系数和导热系数。因此，不对芯片4施加热应力，能够延长GaAs元件的寿命。

4. 发明专利

JPS5858786A MOUNTING STRUCTURE OF COMPOUND SEMICONDUCTOR ELEMENT 失效
公开(公告)号：JPS5858786A
公开(公告)日：1983-04-07
申请号：JP15751181
申请日：1981-10-05
申请人： HITACHI LTD
发明人： KOBAYASHI MASAMICHI , SATOU CHIKU , KATOU HIROSHI , HANEDA MAKOTO
IPC分类号： H01L21/52 , H01L23/492 , H01S5/00
摘要： PURPOSE:To prevent the generation of the whisker of Sn and defective characteristics by using three-dimensional group solder consisting of lead, tin and gold as solder, making the content of lead 5-60% and making the content of gold 0-5%. CONSTITUTION:A solder board 14, a sub-mount 4 and a chip 1 are stacked onto a stem 2 in succession, heat is applied separately or simultaneously, and they are mutually fastened. Each member is connected by solder 20 and solder 5 composed of the three-dimensional alloy of Pb-Sn-Au at that time. The content of Pb is made 5-60%. The content of Au is made 1-5%. Accordingly, a change into a whisker of Sn is prevented, and defective short circuit and the shielding of a laser beam path are not generated.

5. 发明专利

JPS57188832A SOLDERING METHOD 失效
公开(公告)号：JPS57188832A
公开(公告)日：1982-11-19
申请号：JP7349981
申请日：1981-05-18
申请人： HITACHI LTD , HITACHI OME ELECTRONIC CO
发明人： FUNADA TSUYOSHI , OOHASHI YOSHIO , OOKUBO TADASHI , KATOU HIROSHI , KOBAYASHI MASAMICHI
IPC分类号： B23K1/06 , H01L21/52 , H01L21/58
摘要： PURPOSE:To attach a fixed quantity of remaining solder onto a horn at all times, and to conduct the next preparatory soldering work positively by pulling up the horn from a melted solder lump while vibrating the horn. CONSTITUTION:The horn 3 is dropped, the lower end of the horn 3 contacts with the melted solder lump 5 at a point c, the horn is extracted further deeply from the solder lump 5, the horn is further lowered, the horn ultrasonic-vibrates under a condition that the nose is contacted with the melted solder lump 5, the interface of the melted solder lump 5 and a stem 1 is activated, and solder wetting property is improved. When the horn 3 is elevated, the horn 3 is ultrasonic- vibrated, the interface of the horn 3 and attaching melted solder is activated through the vibration, and solder is easy to adhere on the lower end of the horn 3 at all times. Accordingly, a fixed quantity of solder 9 adheres by the surface tension and viscosity of solder.

6. 发明专利

JPS5793523A FORMING METHOD FOR ELECTRODE IN SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS5793523A
公开(公告)日：1982-06-10
申请号：JP16955780
申请日：1980-12-03
申请人： HITACHI LTD
发明人： KOBAYASHI MASAMICHI , KATOU HIROSHI
IPC分类号： H01L21/28 , H01L33/20 , H01L33/30 , H01L33/40
摘要： PURPOSE:To prevent damage of a protective film at the time of the electrode formation by a method wherein after a photo resist film is covered on the PSG protective film deposited on a recess part around a mesa part including a PN junction of an IRED element, gold-tin films are formed over the entire surface of a substrate and removed with a sticking tape selectively. CONSTITUTION:A P layer 2, an N layer 3 and a P layer 4 are formed on a GaAlAs substrate 1. And, gold electrodes 5a, 5b are formed, and mesa etch 6 is formed between the N layer 3 and the P layer 4. A PSG film is formed within a recess part 6. A backing plate 8 is sticked on the substrate side by means of a photoresist 9. A photoresist 11 is provided on the electrode forming surface, and is left on only a mesa groove part. On an Au film on said resist 11 an Sn film 13 is formed, and an adhesive tape is sticked on said films. Further, said films are left on only an electrode part selectively by stripping said tape compulsorily. Hereby, damage to the protective film is removed when the electrode is formed, and an IRED is formed without defects from the viewpoint of the appearance and the characteristics.

7. 发明专利

JPS5691317A DEVICE FOR EXTINGUISHING SOLENOID CONTACTOR 失效
公开(公告)号：JPS5691317A
公开(公告)日：1981-07-24
申请号：JP16840879
申请日：1979-12-26
申请人： HITACHI LTD , HITACHI OMIKA DENKI
发明人： TAKAHASHI MATSUO , KATOU HIROSHI
IPC分类号： H01H9/44

8. 发明专利

JPS5670926A AUTOMATIC MOLDING MATERIAL CONVEYING SYSTEM 失效
公开(公告)号：JPS5670926A
公开(公告)日：1981-06-13
申请号：JP14705279
申请日：1979-11-15
申请人： HITACHI LTD
发明人： KATOU HIROSHI , NAKADA TAISUKE
IPC分类号： B29C45/00 , B29B9/00 , B29C31/00 , B29C31/02 , B29C31/10 , B29C35/00 , B29C45/17 , B29C45/18 , B29C45/82
摘要： PURPOSE:To provide a system enabling an efficient molding work by automating material selection in an injection molding work which is designed to convey molding material to a molding material retaining means selectively by a conveying means from one of a plurality of storage means according to a command. CONSTITUTION:When a command is given to convey material from any one of material hoppers 1-4, an electrostatic capacity type level gage 12 carried on a machine hopper detects whether the hopper section 11 is empty or not. When it is detected to be employ, after an idle blowing with a blower 8, an air damper 5 is opened to convey material from the hopper to a charge tank 7 which forces it to a cyclone section 10 with a blower 8 through a piping 14 until it is stored. When the level gage 12 detected that the hopper 11 is filled to the capacity, a stopping command is given to close the damper 5. After a continued idle blowing, the blower 8 is switched off.

9. 发明专利

JPS5443677A BONDING TOOL 失效
公开(公告)号：JPS5443677A
公开(公告)日：1979-04-06
申请号：JP10987977
申请日：1977-09-14
申请人： HITACHI LTD
发明人： KIYONO MASAMI , UNNO TASUKU , HAJIME TETSUO , KATOU HIROSHI , HIRANO MIKIO
IPC分类号： H01L21/677 , H01L21/60 , H01L21/68
摘要： PURPOSE:To make the temperature of a pressing face uniform by providing a concave on he square plane face at the bonding tool pointed end corresponding to a semiconductor chip while positioning the concave at the center. CONSTITUTION:Bonding tool 20 is constituted by main body 22 incorporating heater 21, fitting axis 23 protruding to the upper part of main body 22, and pressing part 24 consisting of a square protrusion which protrudes to the lower part of main body 22. This tool 20 is formed in one body by beryllia, etc., and pressing part 24 has the approximately same size as a semiconductor chip, and plane pressing face 25 is formed in the lower edge face of 24. Further, round concave 26 is provided at the center of this pressing face 25. Thus, concave 26 has a function to lower the temperature, and reduces the temperature difference of each surrounding part of pressing face 25. As a result, a sure bonding through out all areas is possible and exfoliation, etc., are not generated.

10. 发明专利

JPS53127621A COMBINATION STARTER 失效
公开(公告)号：JPS53127621A
公开(公告)日：1978-11-08
申请号：JP4139477
申请日：1977-04-13
申请人： HITACHI LTD
发明人： FUJIMOTO MINORU , TOONISHI EIJIYU , KATOU HIROSHI
IPC分类号： H01H50/00 , H02P1/16
摘要： PURPOSE:To produce compact and highly reliable combination starter by integrating current limiting fuse and electromagnetic contactor.

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