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1. 发明专利

DE3171177D1 THERMOSETTING RESIN COMPOSITION, PROCESS FOR PREPARATION THEREOF AND CURED PRODUCT THEREOF 未知
公开(公告)号：DE3171177D1
公开(公告)日：1985-08-08
申请号：DE3171177
申请日：1981-03-05
申请人： HITACHI LTD
发明人： ISHII TAKEO , OGATA MASATSUGU , NARAHARA TOSHIKAZU
IPC分类号： C08F226/06 , C08F299/02 , C08F222/40
摘要： The present invention relates to a thermosetting resin composition, a process for the preparation of this composition and a cured product obtained by heating and curing this composition. Both the thermosetting resin composition and cured product of the present invention comprise tri- allylisocyanurate (TAIC) and a poly(phenylmethylene)-polymaleimide represented by the following general formula:wherein n is a number of at least 1.This composition is obtained by heating and dissolving the polymaleimide into TAIC. According to the intended use of the molded product, various additives may be added to the composition. For example, there may be added a radical-polymerizable thermosetting resin such as an unsaturated polyester, an epoxy acrylate resin or a diallyl phthalate prepolymer and a filler represented by a thermoplastic resin. The composition of the present invention is excellent in the compatibility and therefore, a good moldability is obtained at the molding step. Furthermore, the cured product of the present invention is excellent in the mechanical properties, electric properties and heat resistance.

2. 发明专利

DE2729847A1 Aromatic polyamide contg. sulphonamide gp. in side-chain - prepd. from aromatic diamino-sulphonamide and dibasic acid halide and used as reverse osmosis membranes 未知
公开(公告)号：DE2729847A1
公开(公告)日：1978-01-05
申请号：DE2729847
申请日：1977-07-01
申请人： HITACHI LTD
发明人： KINJO NORIYUKI , ISHII TAKEO , YOKONO HITOSHI , MIYADERA YASUO
IPC分类号： B01D71/56 , C08G69/32 , C08G69/26 , C08J5/22
摘要： New aromatic polyamide, having reduced viscosity >=0.5 dl/g., measured at concn. 0.1 g/dl in dimethyl acetamide at 30 degrees C, consists of repeat units having formula -NH-Ar(SO2NH2)n-NH-CO-Q-CO- (where Ar is a divalent aromatic gp. in which each -SO2NH2 gp. is bonded in a posn which does not adjoin C atom to which N atom is linked; Q is an aromatic or aliphatic residue of an aromatic or aliphatic dicarboxylic acid dihalide and n is 1 or 2). The polyamides are used in prodn. of revers osmosis membranes for purificn. of waste waters, concn. and recovery of dissolved inorganic cpds.; desalination of sea- and subterranean water; treatment of milk and other liq. foods; sepn. and concn. of biological and pharmaceutical prods. The polyamide is soluble in organic solvents and is easily cast to films having high strength and heat-resistance. Membranes have high selective permeability and high compressive strength. Water permeation rate may be 0.1-3m3/m2.day and desalination ratio 60-99%.

3. 发明专利

DE3375489D1 EPOXY RESIN COMPOSITION AND MOLDED ARTICLES OBTAINED THEREFROM 未知
公开(公告)号：DE3375489D1
公开(公告)日：1988-03-03
申请号：DE3375489
申请日：1983-09-05
申请人： HITACHI LTD , HITACHI CHEMICAL CO LTD
发明人： OGATA MASATSUGU , ISHII TAKEO , WAJIMA MOTOYO
IPC分类号： C08G59/00 , C08G59/18 , C08G59/40 , C08G59/62 , C08G59/68 , C08K5/06 , C08K5/13 , C08K7/02 , C08L63/00 , B29C39/10 , C08L25/18

4. 发明专利

JPH04184628A SYSTEM FOR SUPPORTING AUTOMATION OF ASYNCHRONOUS PROCESSING 失效
公开(公告)号：JPH04184628A
公开(公告)日：1992-07-01
申请号：JP31561890
申请日：1990-11-20
申请人： HITACHI LTD , HITACHI SOFTWARE ENG
发明人： ISHII TAKEO , YOSHINO MATSUKI , NISHIYAMA ISAO , TAKAOKA KAZUHIRO , TANAKA SHINJI
IPC分类号： G06F9/06
摘要： PURPOSE:To improve the maintenance and the productivity of a program by deciding automatically an asynchronous processing executing timing and then producing automatically an asynchronous processing program. CONSTITUTION:In a processing specifications input process 3, the information of the processing specifications 7 is processed and the intermediate information-1(8) is outputted. In this case, the designation is added to the language specifications in the specifications 7 so that a user can express the asynchronous processing. In a specifications analysis process 4, the information 8 is inputted and the information on the item designating the saving carried out with the asynchronous processing is set to an asynchronous processing table 1 together with the information on the name of the asynchronous processing procedure. In a definer input process 5, the information on the definers of the screen items, the file items, etc., are inputted from a definer file 10 and set to a generation information table 2. In the final generation process 6, both tables 1 and 2 and the intermediate information-2(9) are inputted for the generation of a working area where the items are saved, the saving/recovering processing of items, and then the processing where the executing time of the asynchronous processing is decided and this processing is carried out.

5. 发明专利

JPH0115367B2 失效
公开(公告)号：JPH0115367B2
公开(公告)日：1989-03-16
申请号：JP12239280
申请日：1980-09-05
申请人： HITACHI LTD
发明人： OGATA MASAJI , ASANO HIDEKI , NARISAWA TSUNEO , NEMOTO MASANORI , ISHII TAKEO
IPC分类号： B29C45/00 , B29C39/40 , B29C43/00 , B29C45/02 , B29C45/72 , C08F290/00 , C08F299/00 , G11B15/61 , G11B15/66

6. 发明专利

JPS62184012A HEAT-RESISTANT RESIN COMPOSITION 失效
公开(公告)号：JPS62184012A
公开(公告)日：1987-08-12
申请号：JP2383486
申请日：1986-02-07
申请人： HITACHI LTD
发明人： NISHIKAWA AKIO , ISHII TAKEO
IPC分类号： C08G59/32 , C08G59/20 , C08G59/40 , C08L63/00
摘要： PURPOSE:To form a heat-resistant resin composition having excellent electrical insulating property, especially, at high temperatures and being useful as a semiconductor sealing material, by mixing a specified polyepoxy compound with a specified triphenylmethane derivative. CONSTITUTION:This heat-resistant resin composition contains at least a polyepoxy compound (A) based on tris(hydroxyphenyl)methane of formula I and a trisphenylmethane derivative (B) of formula II (wherein X is any one of -OH, -SH, -CN, -OCN-, -NCO, -NH2 and -COOH). Examples of components B include tris(hydroxyphenyl)methane and tris(4,4',4''-aminophenyl)methane. A cure accelerator and various common additives may be added to said epoxy resin composition.

7. 发明专利

JPS59149923A Heat-resistant molding composition 失效
标题翻译：耐热成型组合物
公开(公告)号：JPS59149923A
公开(公告)日：1984-08-28
申请号：JP2284283
申请日：1983-02-16
申请人： Hitachi Chem Co Ltd , Hitachi Ltd
发明人： ISHII TAKEO , OGATA MASAJI , WAJIMA MOTOYO
IPC分类号： C08G59/00 , C08G59/40 , C08G59/62 , C08G59/68 , C08K5/09 , C08K5/49 , C08L1/00 , C08L27/00 , C08L63/00 , C08L77/00
摘要： PURPOSE: The titled composition capable of providing a molding excellent in high-temperature properties and long-term thermal deterioration resistance, comprising an epoxy resin, an alkenylphenol polymer, a maleimide compound, a specified coupling agent, and fibrous and/or granular fillers.
CONSTITUTION: 100pts.wt. resin component prepared by mixing (A) an epoxy resin with (B) an alkenylphenol polymer of a degree of polymerization of 20W80 in an amount to provide a molar ratio of the epoxy groups in component A to the OH groups in component B of 0.8W1.2 is mixed with (C) 30W120pts.wt. maleimide compound (e.g., N,N-ethylenebismaleimide), (D) 100W500pts.wt. fibrous and/ or granular fillers, and (E) 0.1W3wt%, based on component D, coupling agent selected from the group consisting of organotitanium compounds of formulas I and II (wherein R
1 is a 1W4 C alkyl, R
2 is an 8W30 C alkyl, X
1 is a group of formulas IIIWVII, and m and n are each 1W4) and an organoaluminum compound of formula VIII (wherein R
1 is a 1W8 C alkyl, R
2 and R
3 are each a 1W30 C alkyl or alkoxy, and m is 1W3).
COPYRIGHT: (C)1984,JPO&Japio
摘要翻译：目的：提供能够提供高温性能和长期耐热劣化性优异的成型体的标题化合物，其包含环氧树脂，链烯基酚聚合物，马来酰亚胺化合物，特定的偶联剂和纤维和/或颗粒填料。组成：100pts.wt。通过将（A）环氧树脂与（B）聚合度为20-80的烯基酚聚合物混合（A）得到组分A中的环氧基与组分B中的OH基的摩尔比， 0.8-1.2与（C）混合30-120pts.wt。马来酰亚胺化合物（例如N，N-亚乙基双马来酰亚胺），（D）100-500pts.wt。纤维和/或颗粒填料，和（E）0.1-3wt％，基于组分D，偶联剂选自式I和II的有机钛化合物（其中R1是1-4C烷基，R2是 8-30烷基，X 1为式III-VII的基团，m和n各自为1-4）和式VIII的有机铝化合物（其中R 1为1-8烷基，R 2和R 3各自为 1-30 C烷基或烷氧基，m为1-3）。

8. 发明专利

JPS58138729A THERMOSETTING MOLDING COMPOSITION 失效
公开(公告)号：JPS58138729A
公开(公告)日：1983-08-17
申请号：JP1974082
申请日：1982-02-12
申请人： HITACHI LTD , HITACHI CHEMICAL CO LTD
发明人： OGATA MASAJI , ISHII TAKEO , WAJIMA MOTOYO
IPC分类号： C08L25/00 , C08G59/00 , C08G59/62 , C08L1/00 , C08L25/08 , C08L27/00 , C08L59/00 , C08L63/00 , C08L77/00
摘要： PURPOSE:To obtain the titled composition having excellent storage stability and rapid curability, by mixing and dispersing anepoxy resin, a powdery alkenylphenol polymer, a latent cure accelerator and a fibrous or granular filler. CONSTITUTION:The objective thermosetting molding composition is prepared by compounding and mixing (A) an epoxy resin (e.g. bisphenol-type epoxy resin) with (B) a powdery alkenylphenol polymer (e.g. polymer of vinylphenol, etc.), (C) a latent curing agent[e.g. 3-(p-chlorophenyl)-1,1-dimethylurea], (D) a fibrous and/or granular filler (e.g. glass fiber, calcium carbonate, etc.) and if necessary, (E) a modifier (e.g. silicone resin), a pigment, a dye, etc. EFFECT:The composition gives a molded article having high thermal aging resistance.

9. 发明专利

JPS588745A HEAT-RESISTANT RESIN COMPOSITION 失效
公开(公告)号：JPS588745A
公开(公告)日：1983-01-18
申请号：JP10569281
申请日：1981-07-08
申请人： HITACHI LTD
发明人： OGATA MASAJI , ISHII TAKEO , WAJIMA MOTOYO , NISHIKAWA AKIO
IPC分类号： C08L33/00 , C08F2/44 , C08F20/52 , C08F222/00 , C08F222/40 , C08F290/00 , C08F299/02 , C08L33/24 , C08L35/00 , C08L61/04 , C08L61/06
摘要： PURPOSE:To provide a liquid thermosetting resin compsn. having excellent mechanical and electrical properties at an elevated temperature as well as excellent workability such as impregnation, casting, or bonding workability, by blending a polyamine/bismaleimide, a monomer having a copolymerizable double bond and a phenolic resin. CONSTITUTION:30-60wt% polyamide/bismaleimide obtd. by reacting one mol of an N,N'-bismaleimide compd. of the formula (wherein R is alkylene, arylene, aralkylene) such as N,N'-ethylenebismaleimide with 0.2-1mol of a diamine such as ethylenediamine, 30-60wt% monomer having a copolymerizable double bond such as styrene or triallyl isocyanurate, 10-30wt% phenolic resin such as an alkyl-modified phenolic resin, and 0.1-5wt% free radical polymn. initiator are blended together. This liquid resin compsn. is precured by heating it at 150- 180 deg.C for 3-10min, and then postcured by heating it at 180-230 deg.C for 5- 6hr to obtain a cured article having good heat resistance.

10. 发明专利

JPS5747634A Thermoplastic resin parts for precision mechanism 失效
标题翻译：热塑性树脂精密机械零件
公开(公告)号：JPS5747634A
公开(公告)日：1982-03-18
申请号：JP12239280
申请日：1980-09-05
申请人： Hitachi Ltd
发明人： OGATA MASAJI , ASANO HIDEKI , NARISAWA TSUNEO , NEMOTO MASANORI , ISHII TAKEO
IPC分类号： B29C45/00 , B29C39/40 , B29C43/00 , B29C45/02 , B29C45/72 , C08F290/00 , C08F299/00 , G11B15/61 , G11B15/66
摘要： PURPOSE: To provide the titled parts excellent in dimensional precision and useful for a amount base of a VTR magnetic tape scanner or the like, by molding the part from a themoplastic resin such that the relationship between the glass transition temperature of the resin and the temperature of the molding die at the time of mold release satisfied equation.
CONSTITUTION: The titled parts excellent in dimensional precision is molded from a thermoplastic resin such that the relationship between the glass transition temperature Tg of the resin and the temperature Td of the molding die at the time of mold release satisfies the equation Td-Tg≤20. The thermoplastic resin is preferably one which has a mold shrinkage facter (see JIS-K-6911) adjusted to be not higher than 0.2. Examples of the thermoplastic resin include an unsaturated polyester resin, a diallyl phthalate prepolymer, an epoxy acrylate resin, a mixture of a maleimide compound with a polymerizable nomomer, etc. Preferable molding conditions are the die temperature of about 120W200°C, the molding time of about 1W 10min and the molding pressure of about 50W300kg/cm
2 .
COPYRIGHT: (C)1982,JPO&Japio
摘要翻译：目的：为了提供尺寸精度优异的标准件，并且可用于VTR磁带扫描器等的数量基底，通过从树脂树脂模制该部件，使得树脂的玻璃化转变温度与温度之间的关系的脱模时的成型模具满足方程式。构成：由热塑性树脂模制出尺寸精度优异的标准部件，使得树脂的玻璃化转变温度Tg与脱模时成型模具的温度Td之间的关系满足方程Td-Tg <= 20。热塑性树脂优选具有调整为不高于0.2的模具收缩条（参见JIS-K-6911）的热塑性树脂。热塑性树脂的实例包括不饱和聚酯树脂，邻苯二甲酸二烯丙酯预聚物，环氧丙烯酸酯树脂，马来酰亚胺化合物与可聚合的异构体的混合物等。优选的成型条件是模具温度为约120-200℃，成型时间约1-10分钟，成型压力约50-300kg / cm 2。

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