专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2013035931A Method for producing compatibilizing resin, thermosetting resin composition, prepreg and laminate 有权
标题翻译：生产粘合树脂，热固性树脂组合物，PREPREG和层压板的方法
公开(公告)号：JP2013035931A
公开(公告)日：2013-02-21
申请号：JP2011172359
申请日：2011-08-05
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： TSUCHIKAWA SHINJI , IZUMI HIROYUKI , ISHIKURA KUMIKO , MURAI AKIRA
IPC分类号： C08G59/40 , C08G81/00 , C08J5/24 , C08K9/06 , C08L63/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition showing excellence in all of low thermal expansion, adhesion to copper foils, heat resistance, flame retardancy, heat resistance (T-300) with copper, a dielectric property and drilling workability, and to provide a prepreg, a laminate and a wiring board each using the same.SOLUTION: In a method for producing a compatibilizing resin, a cyanate compound is reacted with a siloxane resin having a hydroxy group at its terminal and an epoxy resin at a specific reaction rate. The thermosetting resin composition contains a compatibilizing resin (A) produced by the method and fused silica (B) whose surface is treated with a trimethoxysilane compound. The prepreg, laminate and wiring board are made by using the same.
摘要翻译：要解决的问题：提供一种热稳定性优异的热固性树脂组合物，其具有优异的低热膨胀性，对铜箔的粘附性，耐热性，阻燃性，耐铜（T-300）与铜的介电性能和钻孔加工性并且提供使用其的预浸料，层压板和布线板。解决方案：在相容性树脂的制造方法中，氰酸酯化合物与其末端具有羟基的硅氧烷树脂和环氧树脂以特定的反应速率反应。热固性树脂组合物含有通过该方法制备的相容化树脂（A）和表面用三甲氧基硅烷化合物处理的熔融二氧化硅（B）。预浸料，层压板和接线板是通过使用它们制成的。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2012052110A Thermosetting resin composition, and prepreg using the same, laminate 有权
标题翻译：热固性树脂组合物，以及使用它们的复合层压板
公开(公告)号：JP2012052110A
公开(公告)日：2012-03-15
申请号：JP2011172362
申请日：2011-08-05
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUCHIKAWA SHINJI , IZUMI HIROYUKI , ISHIKURA KUMIKO , MURAI AKIRA
IPC分类号： C08G73/06 , C08J5/24 , C08K9/06 , C08L79/04 , H05K1/03
CPC分类号： C08L83/06 , B32B5/022 , B32B5/024 , B32B5/08 , B32B7/06 , B32B15/14 , B32B15/20 , B32B2260/023 , B32B2260/046 , B32B2262/0276 , B32B2262/101 , B32B2307/306 , B32B2307/3065 , B32B2307/51 , B32B2307/714 , B32B2307/734 , B32B2307/748 , B32B2457/00 , C08G73/0644 , C08G73/0655 , C08G77/16 , C08G77/452 , C08J5/24 , C08J2383/10 , C08K9/06 , H05K1/0326 , H05K1/0366 , H05K1/0373 , H05K2201/0209 , H05K2201/029 , C08L83/10
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition whose adhesiveness with a conductor layer, heat resistance, flame retardancy, low thermal expansibility, low dielectric properties, low dielectric dissipation factor, drillability or the like each satisfies both standards corresponding to a product and an environment using the composition.SOLUTION: The thermosetting resin composition comprises: a thermosetting resin (A); and fused silica (B). The thermosetting resin (A) is obtained by reacting a siloxane resin (a) having a hydroxy group at its terminal and a compound (b) having at least two cyanate groups in one molecule. The siloxane resin (a) and the compound (b) are contained in amounts of 10-70 pts.mass and 30-90 pts.mass, respectively, to 100 pts.mass of the total of the siloxane resin (a) and the compound (b). The reaction rate of the compound (b) is 40-70 mol%. The surface of the fused silica is treated with a trimethoxysilane compound.
摘要翻译：要解决的问题：提供一种与导体层的粘合性，耐热性，阻燃性，低热膨胀性，低介电性，低介电损耗因数，可钻性等的热固性树脂组合物都满足对应于使用该组合物的产品和环境。热固性树脂组合物包含：热固性树脂（A）; 和二氧化硅（B）。热固性树脂（A）通过在其末端具有羟基的硅氧烷树脂（a）和在一个分子中具有至少两个氰酸酯基的化合物（b）反应而获得。硅氧烷树脂（a）和化合物（b）的含量分别为10-70质量份和30-90质量分数，相对于硅氧烷树脂（a）和化合物（b）。化合物（b）的反应速度为40〜70摩尔％。熔融二氧化硅的表面用三甲氧基硅烷化合物处理。版权所有（C）2012，JPO＆INPIT

3. 发明公开

EP2602277A4 PROCESS FOR PRODUCING COMPATIBILIZED RESIN, THERMOSETTING RESIN COMPOSITION, PREPREG, AND LAMINATE 有权
标题翻译：用于生产相容树脂，热固性树脂组合物，预浸料及叠层体
公开(公告)号：EP2602277A4
公开(公告)日：2013-07-17
申请号：EP11814751
申请日：2011-08-05
申请人： HITACHI CHEMICAL CO LTD
发明人： TSUCHIKAWA SHINJI , IZUMI HIROYUKI , ISHIKURA KUMIKO , MURAI HIKARI
IPC分类号： C08G73/06 , B32B5/28 , C08G77/16 , C08G77/452 , C08J5/24 , C08K9/06 , C08L79/04 , C08L83/10 , H05K1/03
CPC分类号： C08L83/06 , B32B5/022 , B32B5/024 , B32B5/08 , B32B7/06 , B32B15/14 , B32B15/20 , B32B2260/023 , B32B2260/046 , B32B2262/0276 , B32B2262/101 , B32B2307/306 , B32B2307/3065 , B32B2307/51 , B32B2307/714 , B32B2307/734 , B32B2307/748 , B32B2457/00 , C08G73/0644 , C08G73/0655 , C08G77/16 , C08G77/452 , C08J5/24 , C08J2383/10 , C08K9/06 , H05K1/0326 , H05K1/0366 , H05K1/0373 , H05K2201/0209 , H05K2201/029 , C08L83/10

4. 发明专利

JP2014122339A Thermosetting resin composition, prepreg, laminate, print circuit board, mounting substrate, and method for producing thermosetting resin composition 审中-公开
标题翻译：热固性树脂组合物，PREPREG，层压板，印刷电路板，安装基板和生产热固性树脂组合物的方法
公开(公告)号：JP2014122339A
公开(公告)日：2014-07-03
申请号：JP2013241841
申请日：2013-11-22
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： KUSHIDA YUKO , IZUMI HIROYUKI , ISHIKURA KUMIKO , TSUCHIKAWA SHINJI
IPC分类号： C08L63/00 , C08G59/30 , C08J5/24 , C08K3/36 , C08K9/06 , C08L79/04 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition applicable as a material for electronic apparatus, which is excellent in low thermal expansion, low dielectric characteristics, moist solder heat resistance, flame retardancy, low dielectric dissipation factor, and desmear liquid resistance; a prepreg obtained by impregnating with or coating the thermosetting resin composition; a laminate formed by laminating the prepreg; a print circuit board; a mounting substrate; and a method for producing the thermosetting resin composition.SOLUTION: Provided is a thermosetting resin composition obtained by a thermosetting resin (A) having a hydroxyl group and an epoxy group within a molecular structure and a cyanate compound (B) having at least two cyanate groups in one molecule. The thermosetting resin (A) is obtained by subjecting a siloxane resin (a) having a carboxyl group, represented by the following general formula (I), and an epoxy compound (b) having at least two epoxy groups in one molecule to an esterification reaction: (I)
摘要翻译：要解决的问题：提供一种适用于电子设备的材料的热固性树脂组合物，该热固性树脂组合物具有优异的低热膨胀，低介电特性，耐湿焊料耐热性，阻燃性，低介电损耗因数和去污液体阻力; 通过浸渍或涂布热固性树脂组合物获得的预浸料; 通过层叠预浸料形成的层压体; 印刷电路板; 安装基板; 和热固性树脂组合物的制造方法。提供一种热分解结构中具有羟基和环氧基的热固性树脂（A）和具有至少两个氰酸酯的氰酸酯化合物（B）一个分子中的基团。热固性树脂（A）通过使一分子中具有羧基的硅氧烷树脂（a）和具有至少两个环氧基的环氧化合物（b）在一个分子中进行酯化而获得，反应：（I）

5. 发明专利

JP2014012761A Prepreg using organic fiber base material and manufacturing method of the same, and laminated plate, metal foil-clad laminated plate, and wiring board using the prepreg 审中-公开
标题翻译： PREPREG使用有机纤维基材料及其制造方法，以及层压板，金属箔层压板和使用PREPREG的接线板
公开(公告)号：JP2014012761A
公开(公告)日：2014-01-23
申请号：JP2012150387
申请日：2012-07-04
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： NOMOTO SHUJI , IZUMI HIROYUKI , ISHIKURA KUMIKO , SAKAI KAZUNAGA , MORITA KOJI , TAKAHARA NAOKI
IPC分类号： C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a prepreg expressing low thermal expansion and high adhesiveness and a manufacturing method of the same, and a laminated plate, a metal foil-clad laminated plate, and a wiring board using the prepreg.SOLUTION: A prepreg is obtained by immersing, in an organic fiber base material, a thermosetting resin obtained by reacting, in an organic solvent, (a) a siloxane resin having hydroxyl groups at its terminals represented by following general formula (I) and (b) a compound having at least two or more cyanate groups in one molecule and a thermosetting resin composition containing a compound having at least two or more epoxy groups in one molecule.
摘要翻译：要解决的问题：提供一种表现出低热膨胀和高粘合性的预浸料及其制造方法，以及层压板，覆盖金属箔的层压板和使用该预浸料的布线板。解决方案：预浸料是通过将有机溶剂中的（a）具有羟基的硅氧烷树脂在其末端由下述通式（I）表示的末端与（b）所示的化合物反应得到的热固性树脂，一个分子中的至少两个以上的氰酸酯基和含有一个分子中具有至少两个以上环氧基的化合物的热固性树脂组合物。

6. 发明专利

JP2013216881A Method for producing compatibilizing resin, thermosetting resin composition, prepreg and laminate 有权
标题翻译：生产粘合树脂，热固性树脂组合物，PREPREG和层压板的方法
公开(公告)号：JP2013216881A
公开(公告)日：2013-10-24
申请号：JP2013052462
申请日：2013-03-14
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： TSUCHIKAWA SHINJI , IZUMI HIROYUKI , ISHIKURA KUMIKO , MURAI AKIRA
IPC分类号： C08G59/14 , B32B5/28 , B32B15/08 , B32B27/00 , C08G59/40 , C08J5/24 , C08K9/06 , C08L63/00
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition showing excellence in all of low thermal expansion, adhesion to copper foil, heat resistance, flame retardancy, heat resistance with copper, low dielectric property, low dielectric loss tangent and drilling workability, and a prepreg and a laminate each using the same.SOLUTION: A thermosetting resin composition contains a compatibilizing resin (A) having an iminocarbonate structure and a triazine structure, and fused silica (B) surface-treated with a trimethoxysilane compound, wherein the compatibilizing resin (A) is produced by bringing a compound (a) having hydroxyl and epoxy groups in its molecular structure, obtained by bringing a siloxane resin (a1) having a phenolic hydroxyl group at its terminal and a compound (a2) having at least two epoxy groups in one molecule into an etherification reaction, and a compound (b) having at least two cyanate groups in one molecule into an iminocarbonation reaction and a triazine cyclization reaction in a specific organic solvent in the presence of an organic metal salt (c) in such a way that the reaction rate of the component (b) is 30-70 mol%. A prepreg and a laminate use the thermosetting resin composition.
摘要翻译：要解决的问题：提供一种显示低热膨胀，对铜箔的粘附性，耐热性，阻燃性，铜的耐热性，低介电性，低介电损耗角正切和钻孔加工性的热固性树脂组合物，以及预浸料坯和使用其的层压板。热固性树脂组合物含有具有亚氨基碳酸酯结构和三嗪结构的相容性树脂（A）和用三甲氧基硅烷化合物表面处理的熔融二氧化硅（B），其中相容性树脂 A）是通过在其末端带有具有酚羟基的硅氧烷树脂（a1）而得到的分子结构中具有羟基和环氧基的化合物（a）和具有至少两个环氧基的化合物（a2）在一个分子中进行醚化反应，和在一个分子中具有至少两个氰酸酯基团的化合物（b）进入亚氨基碳酰化反应和三嗪在有机金属盐（c）的存在下，在特定有机溶剂中使组分（b）的反应速率为30-70摩尔％的方式进行环化反应。预浸料和层压材料使用热固性树脂组合物。

7. 发明专利

JP2014012759A Prepreg using organic fiber base material and manufacturing method of the same, and laminated plate, metal foil-clad laminated plate, and wiring board using the prepreg 审中-公开
标题翻译： PREPREG使用有机纤维基材料及其制造方法，以及层压板，金属箔层压板和使用PREPREG的接线板
公开(公告)号：JP2014012759A
公开(公告)日：2014-01-23
申请号：JP2012150385
申请日：2012-07-04
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： TAKAHARA NAOKI , OZE MASAHISA , SAKAI KAZUNAGA , MORITA KOJI , IZUMI HIROYUKI , ISHIKURA KUMIKO
IPC分类号： C08J5/24 , B32B5/28 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a prepreg expressing low thermal expansion and a manufacturing method of the same, and a laminated plate, a metal foil-clad laminated plate, and a wiring board using the prepreg.SOLUTION: A thermosetting resin is obtained by reacting, in an organic solvent, (a) a siloxane resin having hydroxyl groups at its terminals represented by following general formula (I) and (b) a compound having at least two or more cyanate groups in one molecule, and contains 10-70 pts.mass of the siloxane resin (a) and 30-90 pts.mass of the compound (b) based on the sum total 100 pts.mass of the siloxane resin (a) and the compound (b). A prepreg is obtained by immersing the thermosetting resin having a reaction rate of the compound (b) of 40-70 mol% in an organic fiber base material. In general formula (I), each Ris independently an alkylene group having 1-5 carbon atoms or an alkyleneoxy group; each Aris independently a single bond, an arylene group, or an alkylene group having 1-5 carbon atoms; and m is an integer of 5-100.
摘要翻译：要解决的问题：提供一种表现出低热膨胀的预浸料及其制造方法，以及层压板，覆盖金属箔的叠层板和使用该预浸料的布线板。溶解性：热固性树脂通过在有机溶剂中，（a）在其末端具有羟基的硅氧烷树脂在下列通式（I）表示的末端和（b）在一分子中具有至少两个以上氰酸酯基的化合物，并含有10-70 硅氧烷树脂（a）的pts.mass和化合物（b）的30-90质量份，基于硅氧烷树脂（a）和化合物（b）的总共100质量份。通过将具有40-70摩尔％的化合物（b）的反应速率的热固性树脂浸渍在有机纤维基材中来获得预浸料。在通式（I）中，各R独立地为具有1-5个碳原子的亚烷基或亚烷基氧基; 每个Aris独立地是单键，亚芳基或具有1-5个碳原子的亚烷基; m为5〜100的整数。

8. 发明专利

JP2013189580A Resin composition, and prepreg and laminated plate using the same 有权
标题翻译：树脂组合物，以及使用该树脂组合物的PREPREG和层压板
公开(公告)号：JP2013189580A
公开(公告)日：2013-09-26
申请号：JP2012058018
申请日：2012-03-14
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： ISHIKURA KUMIKO , TSUCHIKAWA SHINJI , IZUMI HIROYUKI
IPC分类号： C08G59/40 , B32B5/28 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition excellent in low thermal expansion, copper foil adhesivity, heat resistance and dielectric property.SOLUTION: A resin composition contains a thermosetting resin obtained by reacting a siloxane resin (a) represented by formula (1), a compound (b) having at least two isocyanate groups in one molecule thereof, and a compound (c) having at least two epoxy groups in one molecule thereof, wherein the siloxane resin (a), the compound (b) and the compound (c) are used in respective proportions of 10 to 50 pts.mass, 40 to 80 pts.mass and 10 to 50 pts.mass with respect to 100 pts.mass of the sum total of the siloxane resin (a), the compound (b) and the compound (c); and the reaction is carried out in an organic solvent so that the reaction rate of the compound (b) becomes 30 to 70 mol%. In the formula, X are each independently selected from the groups of carboxyl, methacryl, glycidyl, alicyclic epoxy and mercapto.
摘要翻译：要解决的问题：提供低热膨胀，铜箔粘合性，耐热性和介电性能优异的树脂组合物。溶液：树脂组合物含有通过使由式（1）表示的硅氧烷树脂（a）在一个分子中具有至少两个异氰酸酯基的化合物（b）和在其一个分子中具有至少两个环氧基的化合物（c），其中硅氧烷树脂（a），化合物（b）和化合物（c）相对于硅氧烷树脂（a）的总和的100重量份的比例分别为10〜50质量份，40〜80质量份和10〜50质量比，化合物（b）和化合物（c）; 反应在有机溶剂中进行，使化合物（b）的反应速度为30〜70摩尔％。在该式中，X各自独立地选自羧基，甲基丙烯酰基，缩水甘油基，脂环族环氧基和巯基。

9. 发明专利

JP2013189577A Thermosetting resin composition, prepreg, and laminated plate 有权
标题翻译：热固性树脂组合物，PREPREG和层压板
公开(公告)号：JP2013189577A
公开(公告)日：2013-09-26
申请号：JP2012058008
申请日：2012-03-14
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： TAKAHARA NAOKI , OSE MASAHISA , MORITA KOJI , MURAI AKIRA , TSUCHIKAWA SHINJI , IZUMI HIROYUKI , ISHIKURA KUMIKO
IPC分类号： C08G73/06 , C08J5/24 , C08K5/3445 , C08K9/06 , C08L63/00 , C08L65/00 , C08L83/06
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition having excellent low thermal expansion and heat resistance, and a prepreg and a laminated plate using the same.SOLUTION: A thermosetting resin composition contains a compatibilization resin (A) obtained by reacting a siloxane resin (a) having hydroxyl groups on terminals thereof, a compound (b) having at least two cyanate groups in one molecule thereof, and a compound (c) having at least two epoxy groups in one molecule thereof, and a compound (B) which contains an imidazole structure in the molecular structure and whose secondary amine moiety is modified. A prepreg and a laminated plate use the composition are also provided.
摘要翻译：要解决的问题：提供一种具有优异的低热膨胀和耐热性的热固性树脂组合物，以及预浸料和使用该热固性树脂的层压板。热固性树脂组合物含有通过使硅氧烷树脂（a）在其末端具有羟基的化合物（b），其分子中具有至少两个氰酸酯基的化合物（b）和在其一分子中具有至少两个环氧基的化合物（c）和化合物（B）在分子结构中含有咪唑结构，其仲胺部分被修饰。还提供了预浸料和层压板的组合物。

10. 发明专利

JP2013108067A Method for producing compatibilized resin, compatibilized resin, thermosetting resin composition, prepreg and laminated plate 审中-公开
标题翻译：生产混合树脂，兼容树脂，热固性树脂组合物，PREPREG和层合板的方法
公开(公告)号：JP2013108067A
公开(公告)日：2013-06-06
申请号：JP2012234130
申请日：2012-10-23
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： TSUCHIKAWA SHINJI , IZUMI HIROYUKI , ISHIKURA KUMIKO , MURAI AKIRA
IPC分类号： C08L79/00 , C08G59/20 , C08G59/62 , C08J5/24 , C08K9/06 , C08L63/00 , C08L83/06 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a compatibilized resin, capable of providing a thermosetting resin composition which is excellent in all of low thermal expandability, copper foil adhesion, heat resistance, flame retardancy, copper-clad heat resistance (T-300), dielectric characteristic, and drill workability, a compatibilized resin produced by the method, a thermosetting resin composition, and a prepreg and a laminated plate using the same.SOLUTION: The method for producing a compatibilized resin includes: reacting a cyanate compound, a siloxane resin having hydroxyl at the terminal, and a cyloxane resin having epoxy at the terminal at a specific reaction rate. The compatibilized resin is produced by the method. The thermosetting resin composition contains the compatibilized resin (A) and molten silica (B) surface-treated with a trimethoxysilane compound. The prepreg and laminated plate use the composition.
摘要翻译：要解决的问题：提供一种能够提供低热膨胀性，铜箔粘合性，耐热性，阻燃性，铜包层耐热性优异的热固性树脂组合物的相容化树脂的制造方法（T-300），介电特性和钻孔加工性，通过该方法制造的增容树脂，热固性树脂组合物和预浸料以及使用其的层压板。解决方案：相容化树脂的制造方法包括：使氰酸酯化合物，末端具有羟基的硅氧烷树脂和末端具有环氧基的环氧树脂以特定的反应速度反应。通过该方法制造相容化树脂。热固性树脂组合物含有用三甲氧基硅烷化合物表面处理的相容化树脂（A）和熔融二氧化硅（B）。预浸料和层压板使用组合物。版权所有（C）2013，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式