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1. 发明专利

JP2005322938A Wiring-connecting material and method for manufacturing wiring board using same 有权
标题翻译：使用相同方式制造接线板的连接材料和方法
公开(公告)号：JP2005322938A
公开(公告)日：2005-11-17
申请号：JP2005164401
申请日：2005-06-03
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： FUJINAWA MITSUGI , YUSA MASAMI , NOMURA MICHIYUKI , ONO YUTAKA , WATANABE ITSUO , ARIFUKU MASAHIRO , KANAZAWA TOMOKO
IPC分类号： C09J7/00 , C09J4/06 , C09J9/02 , C09J11/06 , C09J175/04 , C09J175/16 , H05K3/32
CPC分类号： H01L24/29
摘要： PROBLEM TO BE SOLVED: To provide an electric and electronic wiring-connecting material more excellent in low temperature rapid curability than a conventional epoxy resin base connecting material and having a work life. SOLUTION: A wiring-connecting film comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a urethane acrylate, an adhesion component including from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and from 0.1 to 30% by volume of conductive particles for the adhesion component, and interposed between two or more wiring-connecting materials arranged such that the surfaces having connection ends are in opposition to each other and connected such that the connection ends are brought into conduction by heating and applying pressure. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种电气和电子布线连接材料，其比低于常规环氧树脂基底连接材料的具有更好的低温快速固化性并且具有工作寿命。解决方案：一种配线连接膜，包括2至75重量份的聚氨酯树脂，30至60重量份的氨基甲酸酯丙烯酸酯，粘合组分，其包含0.1至30重量份的固化剂能够在加热时产生自由基，和0.1至30体积％的用于粘合组分的导电颗粒，并插入两个或多个布线连接材料之间，使得具有连接端的表面彼此相对，并且连接使得连接端部通过加热和施加压力而导通。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2007291396A Wiring-connecting material and process for producing circuit board with the same 有权
标题翻译：用于生产电路板的接线连接材料和工艺
公开(公告)号：JP2007291396A
公开(公告)日：2007-11-08
申请号：JP2007122764
申请日：2007-05-07
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： FUJINAWA MITSUGI , YUSA MASAMI , NOMURA MICHIYUKI , ONO YUTAKA , WATANABE ITSUO , ARIFUKU MASAHIRO , KANAZAWA TOMOKO
IPC分类号： C09J175/04 , C09J4/00 , C09J9/02 , C09J11/04 , C09J11/06 , C09J175/16 , H01B1/22 , H01L21/60 , H05K3/32
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a wiring-connecting material for electric/electronic uses, which is excellent in low temperature quick curability than those of conventional epoxy resin-based connecting materials, and has a good pot life, and to provide a method for producing a circuit board with the same. SOLUTION: A wiring-connecting material (15) comprises 2 to 75 parts by weight of a polyurethane resin, 30 to 60 parts by weight of a radical-polymerizable substance, and 0.1 to 30 parts by weight of a hardener which upon heating generates free radicals. The material (15) preferably further contains a film-forming material and/or conductive particles (14). COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供与常规的环氧树脂基连接材料相比具有优异的低温快速固化性的电气/电子用布线连接材料，并且具有良好的适用期，并提供一种用于制造具有该电路板的电路板的方法。配线连接材料（15）包含2〜75重量份的聚氨酯树脂，30〜60重量份的自由基聚合性物质和0.1〜30重量份的固化剂，其在加热产生自由基。材料（15）优选还包含成膜材料和/或导电颗粒（14）。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2007169632A Adhesive for circuit connection, circuit connection method using the same and circuit connection structure 审中-公开
标题翻译：用于电路连接的电路，使用其的电路连接方法和电路连接结构
公开(公告)号：JP2007169632A
公开(公告)日：2007-07-05
申请号：JP2006335488
申请日：2006-12-13
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： NOMURA MICHIYUKI , FUJINAWA MITSUGI , ONO YUTAKA , KANAZAWA TOMOKO , YUSA MASAMI
IPC分类号： C09J201/08 , C09J9/02 , C09J11/00 , H01B1/22 , H01L21/60 , H01R4/04
摘要： PROBLEM TO BE SOLVED: To provide a circuit-connection adhesive for circuit connection achieving the lowering of connection temperature and the shortening of connection time, a circuit connection method using the adhesive, and a circuit connection structure produced by using the adhesive.
SOLUTION: The circuit connection adhesive contains a carboxy group-containing compound and electrically connects opposed circuit electrodes on a substrate by applying the adhesive between substrates having opposed circuit electrodes and pressing the substrate having the opposed circuit electrodes. The acid equivalent of the carboxy group-containing compound is 5-500 (KOH mg/g). The circuit connection adhesive may further contain a radically polymerizable substance and further electrically conductive particles.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于实现连接温度降低和连接时间缩短的电路连接的电路连接粘合剂，使用该粘合剂的电路连接方法以及通过使用粘合剂制造的电路连接结构。解决方案：电路连接粘合剂含有含羧基的化合物，并且通过在具有相对的电路电极的基板之间施加粘合剂并且对具有相对的电路电极的基板进行按压来电连接基板上的相对的电路电极。含羧基化合物的酸当量为5-500（KOH mg / g）。电路连接粘合剂还可以含有可自由基聚合的物质和另外的导电颗粒。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2006249229A Polymer having luminous unit emitting light after change in chemical structure and organic electroluminescent element using the same 审中-公开
标题翻译：具有化学结构改变后的发光单元的聚合物和使用该化合物的有机电致发光元件
公开(公告)号：JP2006249229A
公开(公告)日：2006-09-21
申请号：JP2005067216
申请日：2005-03-10
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： HOSHI YOSUKE , MORISHITA YOSHII , NOMURA MICHIYUKI , TSUDA YOSHIHIRO , FUNYU SHIGEAKI , IKEDA HIROSHI , IKUI NORITO
IPC分类号： C08G61/02 , C09K11/06 , H01L51/50
CPC分类号： Y02B20/181
摘要： PROBLEM TO BE SOLVED: To obtain a polymer that inexpensively and safely emits a light in a wide visible light range from a short-wavelength (blue) to a long-wavelength (red) and to provide a light emitting apparatus using the polymer, preferably an organic electroluminescent (EL) element.
SOLUTION: The polymer has a luminous unit having a changing chemical structure in which a first luminous unit is changed to a second luminous unit having a chemical structure different from that of the first luminous unit to emit a light. The second luminous unit is preferably returned to the first luminous unit after the emission.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了获得在从短波长（蓝色）到长波长（红色）的宽可见光范围内廉价且安全地发出光的聚合物，并且提供使用聚合物，优选有机电致发光（EL）元件。解决方案：聚合物具有变化的化学结构的发光单元，其中将第一发光单元改变为具有不同于第一发光单元的化学结构的第二发光单元以发光。第二发光单元优选地在发射之后返回到第一发光单元。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2005029784A High-molecular copolymer containing metal coordination compound and organic electroluminescent element using the same 有权
标题翻译：含有金属配位化合物的高分子共聚物和使用其的有机电致发光元件
公开(公告)号：JP2005029784A
公开(公告)日：2005-02-03
申请号：JP2004180147
申请日：2004-06-17
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MORISHITA YOSHII , NOMURA MICHIYUKI , TSUDA YOSHIHIRO
IPC分类号： H01L51/50 , C07D213/50 , C07D401/04 , C08G61/12 , C08G65/34 , C09K11/06 , H05B33/14
摘要： PROBLEM TO BE SOLVED: To provide a high-molecular copolymer containing a metal coordination compound having blue phosphorescence emission excellent in color purity, and to provide a high-molecular copolymer containing metal coordination compound having various color emission of from blue to red with long driving life. SOLUTION: The high-molecular copolymer containing a metal coordination compound which imparts phosphorescence emission of predetermined color comprises a metal coordination compound monomer unit determining energy level of the lowest excitation state and a specific (substituted) conjugated monomer unit, wherein each monomer unit is connected by a specific bonding group. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种含有具有优异的色纯度的蓝色磷光发射的金属配位化合物的高分子共聚物，并提供含有从蓝色到红色各种颜色发射的金属配位化合物的高分子共聚物驾驶寿命长。解决方案：含有赋予预定颜色的磷光发射的金属配位化合物的高分子共聚物包括确定最低激发态的能级的金属配位化合物单体单元和特定（取代的）共轭单体单元，其中各单体单元通过特定的接合组连接。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2005023071A Metal coordination compound, polymer composition, and organic electroluminescent element using them 有权
标题翻译：金属协调化合物，聚合物组合物和有机电致发光元件
公开(公告)号：JP2005023071A
公开(公告)日：2005-01-27
申请号：JP2004171228
申请日：2004-06-09
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： NOMURA MICHIYUKI , MORISHITA YOSHII , TSUDA YOSHIHIRO
IPC分类号： H01L51/50 , C07C49/92 , C07F15/00 , C08K5/56 , C08L101/00 , C09K11/06 , H05B33/14
摘要： PROBLEM TO BE SOLVED: To provide a metal coordination compound which emits light covering from green to red and has a long drive life, to provide a polymer composition, and to provide an organic electroluminescent element using them.
SOLUTION: The metal coordination compound is represented by any one of formulae (1) to (6) [wherein M is Ir, Rh, Ru, Os, Pd, or Pt; n is 2 or 3; another bidentate ligand is further bonded to M when M is Ir, Rh, Ru, or Os and n is 2; ring A is a cyclic compound containing a nitrogen atom bonded to M; X
1 to X
7 are each independently a substituent selected from the group consisting of -H, -OH, -R
1 , -OR
2 , -SR
3 , -OCOR
4 , -COOR
5 , -SiR
6 R
7 R
8 , -NH
2 , -NHR
9 , and -NR
10 R
11 (wherein R
1 to R
11 are each an alkyl group, an aryl group, a heteroaryl group, or an aralkyl group), provided that ring A may have a substituent similar to a group defined in X
1 to X
7 ].
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种金属配位化合物，其发出从绿色到红色的光，并且具有长的驱动寿命，以提供聚合物组合物，并提供使用它们的有机电致发光元件。解决方案：金属配位化合物由式（1）至（6）中的任一个表示[其中M为Ir，Rh，Ru，Os，Pd或Pt; n为2或3; 当M是Ir，Rh，Ru或Os，n是2时，另一个二齿配体进一步键合到M上; 环A是含有与M键合的氮原子的环状化合物; X 1 至X 7 各自独立地为选自-H，-OH，-R SP 1，-OR， SP> 2 ，-SR 3 ，-OCOR 4 ，-COOR 5 ，-SiR 6 R 11 （其中R 1 至R SP 11各自为烷基，芳基，杂芳基或芳烷基基团），条件是环A可以具有类似于X 1 至X 7 中定义的基团的取代基。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2003077335A Surface treated conductive particles, treating method for conductive particles, adhesive for circuit connection using the conductive particles, and circuit connection structure 审中-公开
标题翻译：表面处理导电颗粒，导电颗粒的处理方法，使用导电颗粒进行电路连接的电路连接结构和电路连接结构
公开(公告)号：JP2003077335A
公开(公告)日：2003-03-14
申请号：JP2001261674
申请日：2001-08-30
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： YUSA MASAMI , NOMURA MICHIYUKI , SUDO TOMOKO , ONO YUTAKA
IPC分类号： C09C1/62 , C09C3/00 , C09J9/02 , C09J201/00 , H01B1/00 , H01B1/22 , H01L21/60 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To provide conductive particles with excellent preservation stability to the surface of which, a surface treatment is applied, without coating defect on its insulation resin coated conductive resin, and to provide a treatment method for conducive particles, a circuit connecting adhesive using the conductive particles, and a circuit connection structure.
SOLUTION: A surface treatment is applied to the conductive particles by using a treatment liquid containing (1) a radical polymerizable compound, (2) an acidic compound, and (3) water. The adhesive for circuit connection is laid between base boards having circuit electrodes facing each other, and the base boards having circuit electrodes facing each other are pressed, and the circuit electrodes laid in the pressing direction are electrically connected. The adhesive for circuit connection contains the surface treated conductive particles.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供对其表面具有优异保存稳定性的导电颗粒，在其绝缘树脂涂覆的导电树脂上施加表面处理而没有涂层缺陷，并且提供用于导电颗粒的处理方法，连接粘合剂的电路使用导电颗粒，以及电路连接结构。解决方案：使用含有（1）可自由基聚合的化合物，（2）酸性化合物和（3）水）的处理液对导电颗粒进行表面处理。用于电路连接的粘合剂被放置在具有彼此面对的电路电极的基板之间，并且具有彼此面对的电路电极的基板被按压，并且沿按压方向放置的电路电极电连接。用于电路连接的粘合剂包含经表面处理的导电颗粒。

8. 发明专利

JP2012159670A Light control material and light control film 有权
标题翻译：光控材料和灯控制膜
公开(公告)号：JP2012159670A
公开(公告)日：2012-08-23
申请号：JP2011018899
申请日：2011-01-31
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KAMIYA YUKIO , MORISHITA YOSHII , SAKAYORI MUNEMARU , MARUYAMA YUKIKO , NOMURA MICHIYUKI , TANAKA TORU
IPC分类号： G02F1/19 , B32B27/00 , G02B1/04
摘要： PROBLEM TO BE SOLVED: To provide a light control film which suppresses deterioration in light transmittance to heat, and a light control material capable of forming the light control film.SOLUTION: In the light control material including an ethylenically unsaturated group-containing siloxane resin and a light control suspension dispersed in the ethylenically unsaturated group-containing siloxane resin, the total content of an unreacted substance and a by-product in the ethylenically unsaturated group-containing siloxane resin is 0-1 mass%.
摘要翻译：要解决的问题：提供一种抑制对光的透光率的劣化的光控膜和能够形成光控膜的光控制材料。解决方案：在包含含烯键式不饱和基团的硅氧烷树脂的光控制材料和分散在含烯属不饱和基团的硅氧烷树脂中的光控悬浮液中，烯属不饱和基团中的未反应物质和副产物的总含量不饱和基团的硅氧烷树脂为0〜1质量％。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2005023072A Metal coordination compound, polymer composition, and organic electroluminescent element using them 有权
标题翻译：金属协调化合物，聚合物组合物和有机电致发光元件
公开(公告)号：JP2005023072A
公开(公告)日：2005-01-27
申请号：JP2004171704
申请日：2004-06-09
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： NOMURA MICHIYUKI , MORISHITA YOSHII , TSUDA YOSHIHIRO
IPC分类号： H01L51/50 , C07C49/92 , C07D213/50 , C07D249/18 , C07D263/32 , C07D277/66 , C07D409/04 , C07F15/00 , C09K11/06 , H05B33/14
摘要： PROBLEM TO BE SOLVED: To provide a metal coordination compound having blue phosphorescence excellent in color purity and long-drive-life phosphorescence ranging from blue to red, to provide a polymer composition, and to provide an organic electroluminescent element using them.
SOLUTION: The metal coordination compound is represented by any one of formulae (1) to (6) [wherein M is Ir, Rh, Ru, Os, Pd, or Pt; n is 2 or 3; another bidentate ligand is further bonded to M when M is Ir, Rh, Ru, or Os and n is 2; ring A is a cyclic compound containing a nitrogen atom bonded to M; X
1 to X
6 and R are each a substituent selected from the group consisting of -R
1 , -OR
2 , -SR
3 , -OCOR
4 , -COOR
5 , -SiR
6 R
7 R
8 , and -NR
9 R
10 (wherein R
1 to R
10 are each a hydrogen atom, a halogen atom, a cyano group, a nitro group, or an optionally halogen-substituted alkyl, aryl, heteroaryl, or aralkyl group)].
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供具有蓝色磷光的金属配位化合物，其颜色纯度和蓝色至红色的长驱动寿命磷光都是优异的，以提供聚合物组合物，并提供使用它们的有机电致发光元件。解决方案：金属配位化合物由式（1）至（6）中的任一个表示[其中M为Ir，Rh，Ru，Os，Pd或Pt; n为2或3; 当M是Ir，Rh，Ru或Os，n是2时，另一个二齿配体进一步键合到M上; 环A是含有与M键合的氮原子的环状化合物; X 1 至X 6，R各自为选自-R SP 1，-OR 2， SP>，-SR 3 ，-OCOR 4 ，-COOR 5 ，-SiR 6 R （其中R 1 R 8 > 10 各自为氢原子，卤素原子，氰基，硝基或任选卤素取代的烷基，芳基，杂芳基或芳烷基）]。版权所有（C）2005，JPO＆NCIPI

10. 发明专利

JP2003064344A Adhesive for circuit connection and circuit-connected structural material using the same 有权
标题翻译：用于电路连接的电阻和使用其的电路连接的结构材料
公开(公告)号：JP2003064344A
公开(公告)日：2003-03-05
申请号：JP2001261673
申请日：2001-08-30
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： YUSA MASAMI , SUDO TOMOKO , NOMURA MICHIYUKI , ONO YUTAKA
IPC分类号： C09C1/00 , C09C3/00 , C09J4/00 , C09J9/02 , C09J11/06 , C09J201/00 , H01B1/20 , H01L21/60 , H05K1/14 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide an adhesive for circuit connection excellent in low temperature rapid curing property, also having a good preservation stability and stable connection resistance, and a circuit connected structural material by using the same. SOLUTION: This adhesive for circuit connection by placing it between substrates having opposing circuit electrodes, electrically connecting the electrodes by pressurizing the substrates having the opposing circuit electrodes in pressurizing direction contains a radically polymerizable compound and electric conductive particles surface-coated with a basic compound.
摘要翻译：要解决的问题：提供一种具有优异的低温快速固化性能的电路连接用粘合剂，具有良好的保存稳定性和稳定的连接电阻，以及通过使用该粘合剂的电路连接的结构材料。解决方案：该电路连接用粘合剂通过将其放置在具有相对的电路电极的基板之间，通过在加压方向上加压具有相对的电路电极的基板来电连接电极，其包含自由基聚合性化合物和表面涂覆有碱性化合物的导电性粒子。

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