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1. 发明授权

US07106771B2 Semiconductor laser device and optical pickup device 失效
标题翻译：半导体激光器件和光学拾取器件
公开(公告)号：US07106771B2
公开(公告)日：2006-09-12
申请号：US10650081
申请日：2003-08-28
申请人： Hisayuki Shinohara , Akira Ariyoshi , Osamu Hamaoka
发明人： Hisayuki Shinohara , Akira Ariyoshi , Osamu Hamaoka
IPC分类号： H01S5/00
CPC分类号： G11B7/1353 , G11B7/123
摘要： A semiconductor laser device has a semiconductor laser and a polarizing diffraction grating that is arranged ahead of the semiconductor laser. A reflected light from an optical recording medium is diffracted by the polarizing diffraction grating according to the polarization direction of the reflected light. The reflected light is thereby deviated from the direction toward the semiconductor laser to prevent the reflected light from returning to the semiconductor laser.
摘要翻译：半导体激光装置具有设置在半导体激光器前方的半导体激光器和偏振衍射光栅。来自光学记录介质的反射光根据反射光的偏振方向被偏振衍射光栅衍射。因此反射光从朝向半导体激光器的方向偏离，以防止反射光返回到半导体激光器。

2. 发明授权

US07016274B2 Optical pickup system with light receiving portion 失效
标题翻译：具有光接收部分的光学拾取系统
公开(公告)号：US07016274B2
公开(公告)日：2006-03-21
申请号：US10112180
申请日：2002-03-27
申请人： Osamu Hamaoka
发明人： Osamu Hamaoka
IPC分类号： G11B7/13
CPC分类号： G11B7/131 , G11B7/123 , G11B7/133 , G11B7/1353
摘要： An optical pickup comprises a light source, a three-way split light diffracting section for dividing light emitted from a light source into one main beam and two subbeams, a hologram for dividing each of the main beam and the subbeams reflected from a recording medium into two predetermined directions, and a light receiving section for receiving the beams divided by the hologram. The hologram includes two regions having a small-pitch grating for diffracting each beam to a predetermined direction, the small-pitch gratings have substantially the same pitch and are symmetrical about a split line separating the two regions.
摘要翻译：光拾取器包括光源，用于将从光源发射的光分成一个主光束和两个子光束的三路分裂光衍射部分，将从记录介质反射的每个主光束和子光束分成全息图，两个预定方向，以及用于接收由全息图分割的光束的光接收部分。全息图包括具有用于将每个光束衍射到预定方向的小间距光栅的两个区域，小间距光栅具有基本上相同的间距并且关于分开两个区域的分割线对称。

3. 发明授权

US06700911B2 Semiconductor laser device, fabricating method thereof and optical pickup employing the semiconductor laser device 有权
标题翻译：半导体激光器件，其制造方法和采用半导体激光器件的光学拾取器
公开(公告)号：US06700911B2
公开(公告)日：2004-03-02
申请号：US09725513
申请日：2000-11-30
申请人： Ikuo Kohashi , Osamu Hamaoka , Takeshi Horiguchi
发明人： Ikuo Kohashi , Osamu Hamaoka , Takeshi Horiguchi
IPC分类号： H01S500
CPC分类号： H01S5/0226 , H01S5/005 , H01S5/02236 , H01S5/02268 , H01S2301/02
摘要： In a semiconductor laser device, a semiconductor laser chip is placed on a stem so that an end surface of the semiconductor laser chip, on which the main radiation side light emission point is located, protrudes from an edge of a header portion of the stem or from an edge of a header portion of a sub-mount provided on the stem so as to conceal no light emission points of the semiconductor. A conductive die bonding paste is used for the die bonding of the semiconductor laser chip. A chamfered portion or a rounded corner portion is formed at the edge of the header portion of the stem or the edge of the header portion of the sub-mount provided on the stem. Also, an optical pickup is constructed of at least the semiconductor laser device, a diffraction grating, a photodetector, a condenser lens and an object lens.
摘要翻译：在半导体激光器件中，将半导体激光器芯片放置在杆上，使得主辐射侧发光点所在的半导体激光器芯片的端面从杆的头部的边缘突出，或从设置在杆上的副安装座的集管部分的边缘开始，以便不隐藏半导体的发光点。导电芯片粘接膏用于半导体激光芯片的裸片接合。在杆的集管部分的边缘或设置在杆上的副安装座的集管部分的边缘处形成倒角部分或圆角部分。此外，光学拾取器至少由半导体激光器件，衍射光栅，光电检测器，聚光透镜和物镜构成。

4. 发明授权

US06972205B2 Semiconductor laser device, fabricating method thereof and optical pickup employing the semiconductor laser device 有权
标题翻译：半导体激光器件，其制造方法和采用半导体激光器件的光学拾取器
公开(公告)号：US06972205B2
公开(公告)日：2005-12-06
申请号：US10655044
申请日：2003-09-05
申请人： Ikuo Kohashi , Osamu Hamaoka , Takeshi Horiguchi
发明人： Ikuo Kohashi , Osamu Hamaoka , Takeshi Horiguchi
IPC分类号： G11B7/125 , G11B7/135 , G11B7/22 , H01S5/02 , H01S5/022 , H01S5/30 , H01L21/00
CPC分类号： H01S5/0226 , H01S5/005 , H01S5/02236 , H01S5/02268 , H01S2301/02
摘要： In a semiconductor laser device, a semiconductor laser chip is placed on a stem so that an end surface of the semiconductor laser chip, on which the main radiation side light emission point is located, protrudes from an edge of a header portion of the stem or from an edge of a header portion of a sub-mount provided on the stem so as to conceal no light emission points of the semiconductor. A conductive die bonding paste is used for the die bonding of the semiconductor laser chip. A chamfered portion or a rounded corner portion is formed at the edge of the header portion of the stem or the edge of the header portion of the sub-mount provided on the stem. Also, an optical pickup is constructed of at least the semiconductor laser device, a diffraction grating, a photodetector, a condenser lens and an object lens.
摘要翻译：在半导体激光器件中，将半导体激光器芯片放置在杆上，使得主辐射侧发光点所在的半导体激光器芯片的端面从杆的头部的边缘突出，或从设置在杆上的副安装座的集管部分的边缘开始，以便不隐藏半导体的发光点。导电芯片粘接膏用于半导体激光芯片的裸片接合。在杆的集管部分的边缘或设置在杆上的副安装座的集管部分的边缘处形成倒角部分或圆角部分。此外，光学拾取器至少由半导体激光器件，衍射光栅，光电检测器，聚光透镜和物镜构成。

5. 发明授权

US06812501B2 Semiconductor laser package and fabrication method thereof 失效
标题翻译：半导体激光器封装及其制造方法
公开(公告)号：US06812501B2
公开(公告)日：2004-11-02
申请号：US10058664
申请日：2002-01-28
申请人： Takahide Ishiguro , Osamu Hamaoka
发明人： Takahide Ishiguro , Osamu Hamaoka
IPC分类号： H01L29227
CPC分类号： H01S5/02469 , H01L33/483 , H01L2224/48091 , H01S5/02248 , H01L2924/00014
摘要： A semiconductor laser package includes an island member formed of metal, including a base plane and a block member protruding in a direction substantially perpendicular to the base plane, a lead, a resin member molded integrally with the island member and the lead so as to fix the relative position relationship between the island member and the lead, a laser chip fixed at the block member, and a light receiving element functioning as a light receiving unit, directly fixed to the resin member.
摘要翻译：半导体激光器封装包括由金属形成的岛状部件，其包括基本平面和沿基本垂直于基板的方向突出的块状部件，引线，与岛状部件和引线一体模制的树脂部件，以便固定岛部件和引线之间的相对位置关系，固定在块部件上的激光芯片和用作光接收单元的光接收元件直接固定到树脂部件。

6. 发明申请

US20070165684A1 Semiconductor laser device, method for manufacturing the same and optical pickup apparatus 失效
标题翻译：半导体激光装置及其制造方法以及光学拾取装置
公开(公告)号：US20070165684A1
公开(公告)日：2007-07-19
申请号：US11655130
申请日：2007-01-19
申请人： Osamu Hamaoka
发明人： Osamu Hamaoka
IPC分类号： H01S3/04
CPC分类号： H01S5/02244 , H01L2224/48091 , H01S5/02208 , H01S5/02248 , H01S5/02469 , H01S5/02476 , H01L2924/00014
摘要： A semiconductor laser chip is mounted on one surface of an electrode lead for chip mounting having a heat release region for releasing heat around the semiconductor laser chip. Therefore, it is possible to release heat of the semiconductor laser chip to the chip mounting lead and release the heat from the heat release region, thereby suppressing increase of a temperature of the semiconductor laser chip and suppressing shortening of life of the semiconductor laser chip.
摘要翻译：半导体激光芯片安装在用于芯片安装的电极引线的一个表面上，具有用于在半导体激光器芯片周围释放热的放热区域。因此，可以将半导体激光器芯片的热量释放到芯片安装引线，并且从放热区域释放热量，从而抑制半导体激光器芯片的温度升高并抑制半导体激光器芯片的寿命缩短。

7. 发明授权

US07217955B2 Semiconductor laser device 失效
标题翻译：半导体激光器件
公开(公告)号：US07217955B2
公开(公告)日：2007-05-15
申请号：US10968213
申请日：2004-10-20
申请人： Osamu Hamaoka , Hiroshi Nakatsu , Hideki Ichikawa
发明人： Osamu Hamaoka , Hiroshi Nakatsu , Hideki Ichikawa
IPC分类号： H01L27/15
CPC分类号： H01S5/4031 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/4813 , H01L2224/4911 , H01L2224/49429 , H01L2924/12036 , H01L2924/12042 , H01L2924/12043 , H01S5/0224 , H01S5/02248 , H01S5/02272 , H01S5/02276 , H01S5/02476 , H01S5/0683 , H01S5/4087 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor laser device includes a one-body submount composed of a predetermined material such as SiC or AlN and placed on a mounting surface. A laser diode is placed on a front portion of an upper surface of the submount. A monitoring photodiode composed of crystalline silicon is stacked on a portion of the upper surface of the submount backward from the laser diode.
摘要翻译：半导体激光装置包括由诸如SiC或AlN的预定材料构成并放置在安装表面上的单体基座。激光二极管放置在基座的上表面的前部。由晶体硅构成的监视光电二极管，从激光二极管的后方堆叠在副安装座的上表面的一部分上。

8. 发明授权

US08059515B2 Optical pickup apparatus 有权
标题翻译：光拾取装置
公开(公告)号：US08059515B2
公开(公告)日：2011-11-15
申请号：US12581434
申请日：2009-10-19
申请人： Shinzoh Murakami , Takehiro Shiomoto , Katsushige Masui , Osamu Hamaoka
发明人： Shinzoh Murakami , Takehiro Shiomoto , Katsushige Masui , Osamu Hamaoka
IPC分类号： G11B7/135
CPC分类号： G11B7/0948 , G11B7/0903 , G11B7/131 , G11B7/1353
摘要： Provided is an optical pickup apparatus that can be made compact and is capable of producing stable push-pull signals. The optical pickup apparatus includes a light source, an objective lens, a diffraction element, a light-receiving element, and a control-driving section. The diffraction element receives light reflected from an optical recording medium. The light-receiving element receives light beams diffracted by the diffraction element. The light-receiving element has a plurality of light-receiving regions. The light-receiving region produces an output signal responsive to the quantity of the incident light beam. The control-driving section obtains differences among the output signals from a plurality of the light-receiving regions by calculation to derive a push-pull signal, and drives the objective lens under control on the basis of the push-pull signal.
摘要翻译：提供一种可以制造得紧凑并且能够产生稳定的推挽信号的光学拾取装置。光拾取装置包括光源，物镜，衍射元件，光接收元件和控制驱动部。衍射元件接收从光记录介质反射的光。光接收元件接收由衍射元件衍射的光束。光接收元件具有多个光接收区域。光接收区域响应入射光束的量产生输出信号。控制驱动部通过计算得到来自多个受光区域的输出信号之间的差异，得到推挽信号，并根据推挽信号驱动物镜进行控制。

9. 发明申请

US20100097919A1 OPTICAL PICKUP APPARATUS 有权
公开(公告)号：US20100097919A1
公开(公告)日：2010-04-22
申请号：US12581434
申请日：2009-10-19
申请人： Shinzoh MURAKAMI , Takehiro Shiomoto , Katsushige Masui , Osamu Hamaoka
发明人： Shinzoh MURAKAMI , Takehiro Shiomoto , Katsushige Masui , Osamu Hamaoka
IPC分类号： G11B7/135
CPC分类号： G11B7/0948 , G11B7/0903 , G11B7/131 , G11B7/1353
摘要： Provided is an optical pickup apparatus that can be made compact and is capable of producing stable push-pull signals. The optical pickup apparatus includes a light source, an objective lens, a diffraction element, a light-receiving element, and a control-driving section. The diffraction element receives light reflected from an optical recording medium. The light-receiving element receives light beams diffracted by the diffraction element. The light-receiving element has a plurality of light-receiving regions. The light-receiving region produces an output signal responsive to the quantity of the incident light beam. The control-driving section obtains differences among the output signals from a plurality of the light-receiving regions by calculation to derive a push-pull signal, and drives the objective lens under control on the basis of the push-pull signal.
摘要翻译：提供一种可以制造得紧凑并且能够产生稳定的推挽信号的光学拾取装置。光拾取装置包括光源，物镜，衍射元件，光接收元件和控制驱动部。衍射元件接收从光记录介质反射的光。光接收元件接收由衍射元件衍射的光束。光接收元件具有多个光接收区域。光接收区域响应入射光束的量产生输出信号。控制驱动部通过计算得到来自多个受光区域的输出信号之间的差异，得到推挽信号，并根据推挽信号驱动物镜进行控制。

10. 发明授权

US07489716B2 Semiconductor laser device, method for manufacturing the same and optical pickup apparatus 失效
标题翻译：半导体激光装置及其制造方法以及光学拾取装置
公开(公告)号：US07489716B2
公开(公告)日：2009-02-10
申请号：US11655130
申请日：2007-01-19
申请人： Osamu Hamaoka
发明人： Osamu Hamaoka
IPC分类号： H01S3/04
CPC分类号： H01S5/02244 , H01L2224/48091 , H01S5/02208 , H01S5/02248 , H01S5/02469 , H01S5/02476 , H01L2924/00014
摘要： A semiconductor laser chip is mounted on one surface of an electrode lead for chip mounting having a heat release region for releasing heat around the semiconductor laser chip. Therefore, it is possible to release heat of the semiconductor laser chip to the chip mounting lead and release the heat from the heat release region, thereby suppressing increase of a temperature of the semiconductor laser chip and suppressing shortening of life of the semiconductor laser chip.
摘要翻译：半导体激光芯片安装在用于芯片安装的电极引线的一个表面上，具有用于在半导体激光器芯片周围释放热的放热区域。因此，可以将半导体激光器芯片的热量释放到芯片安装引线，并且从放热区域释放热量，从而抑制半导体激光器芯片的温度升高并抑制半导体激光器芯片的寿命缩短。

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