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1. 发明授权

US07106771B2 Semiconductor laser device and optical pickup device 失效
标题翻译：半导体激光器件和光学拾取器件
公开(公告)号：US07106771B2
公开(公告)日：2006-09-12
申请号：US10650081
申请日：2003-08-28
申请人： Hisayuki Shinohara , Akira Ariyoshi , Osamu Hamaoka
发明人： Hisayuki Shinohara , Akira Ariyoshi , Osamu Hamaoka
IPC分类号： H01S5/00
CPC分类号： G11B7/1353 , G11B7/123
摘要： A semiconductor laser device has a semiconductor laser and a polarizing diffraction grating that is arranged ahead of the semiconductor laser. A reflected light from an optical recording medium is diffracted by the polarizing diffraction grating according to the polarization direction of the reflected light. The reflected light is thereby deviated from the direction toward the semiconductor laser to prevent the reflected light from returning to the semiconductor laser.
摘要翻译：半导体激光装置具有设置在半导体激光器前方的半导体激光器和偏振衍射光栅。来自光学记录介质的反射光根据反射光的偏振方向被偏振衍射光栅衍射。因此反射光从朝向半导体激光器的方向偏离，以防止反射光返回到半导体激光器。

2. 发明申请

US20080230790A1 SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
标题翻译：半导体发光器件
公开(公告)号：US20080230790A1
公开(公告)日：2008-09-25
申请号：US12053356
申请日：2008-03-21
申请人： Masahiro SEKO , Hisayuki Shinohara
发明人： Masahiro SEKO , Hisayuki Shinohara
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L24/45 , H01L24/48 , H01L25/0753 , H01L33/62 , H01L2224/05599 , H01L2224/05639 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48097 , H01L2224/48247 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/12041 , H01L2924/181 , H01L2924/00 , H01L2924/00015 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A semiconductor light emitting device has an outer lead disposed along an outer wall of a mold resin portion perpendicular to a light-emitting plane of a light emitting diode. An outer lead is also disposed at an outer wall of the mold resin portion parallel to and opposite to the light-emitting plane. The outer wall of the resin mold where the outer lead is disposed is taken as a mount face. Each outer wall of the mold resin portion constituting a mount face includes at least one outer lead for an anode and a cathode. According to the present configuration, there is provided a semiconductor light emitting device that allows selection of side-emission mounting or top-emission mounting with the same components on a mount substrate.
摘要翻译：半导体发光器件具有沿着垂直于发光二极管的发光面的模制树脂部分的外壁设置的外引线。外引线还设置在平行于发光平面并与发光平面相对的模制树脂部分的外壁上。将设置有外引线的树脂模具的外壁作为安装面。构成安装面的模制树脂部分的每个外壁包括用于阳极和阴极的至少一个外引线。根据本结构，提供了一种半导体发光器件，其允许在安装基板上选择具有相同部件的侧面发射安装或顶部发射安装。

3. 发明授权

US07759692B2 Semiconductor light emitting device 有权
标题翻译：半导体发光器件
公开(公告)号：US07759692B2
公开(公告)日：2010-07-20
申请号：US12365672
申请日：2009-02-04
申请人： Toshio Hata , Hisayuki Shinohara
发明人： Toshio Hata , Hisayuki Shinohara
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/54 , H01L25/0753 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00 , H01L2924/00014
摘要： A silver-plated metal member region on which a light emitting element is disposed, an extraction electrode having a copper plate pattern, and a convex resin portion separating the metal member region into a plurality of sections are provided on the bottom surface of a concave portion in a package of a semiconductor light emitting device. A covering resin is partially formed on the metal member region and a sealing resin is placed to cover the metal member region, the covering resin and the convex resin portion. According to this configuration, the area of contact is decreased between the sealing resin and the metal member region having the light emitting element placed thereon, to thereby prevent the light emitting element from falling off and being displaced from the metal member region, with the result that a semiconductor light emitting device of high reliability can be provided.
摘要翻译：设置有发光元件的镀银金属构件区域，具有铜版图案的引出电极和将金属构件区域分割成多个部分的凸形树脂部分设置在凹部的底面上在半导体发光器件的封装中。覆盖树脂部分地形成在金属构件区域上，并且设置密封树脂以覆盖金属构件区域，覆盖树脂和凸起的树脂部分。根据该结构，在密封树脂与放置有发光元件的金属构件区域之间的接触面积减小，从而防止发光元件脱落并从金属构件区域移位，结果可以提供高可靠性的半导体发光器件。

4. 发明申请

US20090194782A1 SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
标题翻译：半导体发光器件
公开(公告)号：US20090194782A1
公开(公告)日：2009-08-06
申请号：US12365672
申请日：2009-02-04
申请人： Toshio Hata , Hisayuki Shinohara
发明人： Toshio Hata , Hisayuki Shinohara
IPC分类号： H01L33/00
CPC分类号： H01L33/54 , H01L25/0753 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00 , H01L2924/00014
摘要： A silver-plated metal member region on which a light emitting element is disposed, an extraction electrode having a copper plate pattern, and a convex resin portion separating the metal member region into a plurality of sections are provided on the bottom surface of a concave portion in a package of a semiconductor light emitting device. A covering resin is partially formed on the metal member region and a sealing resin is placed to cover the metal member region, the covering resin and the convex resin portion. According to this configuration, the area of contact is decreased between the sealing resin and the metal member region having the light emitting element placed thereon, to thereby prevent the light emitting element from falling off and being displaced from the metal member region, with the result that a semiconductor light emitting device of high reliability can be provided.
摘要翻译：设置有发光元件的镀银金属构件区域，具有铜版图案的引出电极和将金属构件区域分割成多个部分的凸形树脂部分设置在凹部的底面上在半导体发光器件的封装中。覆盖树脂部分地形成在金属构件区域上，并且设置密封树脂以覆盖金属构件区域，覆盖树脂和凸起的树脂部分。根据该结构，在密封树脂与放置有发光元件的金属构件区域之间的接触面积减小，从而防止发光元件脱落并从金属构件区域移位，结果可以提供高可靠性的半导体发光器件。

5. 发明授权

US07173951B2 Semiconductor laser device with light receiving element 失效
标题翻译：具有光接收元件的半导体激光器件
公开(公告)号：US07173951B2
公开(公告)日：2007-02-06
申请号：US10777190
申请日：2004-02-13
申请人： Hisayuki Shinohara , Ayumi Yagi , Kazunori Matsubara , Tetsuyoshi Inoue
发明人： Hisayuki Shinohara , Ayumi Yagi , Kazunori Matsubara , Tetsuyoshi Inoue
IPC分类号： H01S3/04
CPC分类号： H01S5/02288 , G11B7/123 , H01L2224/48247 , H01L2224/49171 , H01S5/02216 , H01S5/02292
摘要： A semiconductor laser device includes a package having a front surface, a rear surface and an outer peripheral surface; a semiconductor laser element and a light receiving element provided on the front surface; a plurality of leads arranged in spaced relation on the front surface as extending outward from the package; and an optical element supported above the front surface with its optical axis perpendicular to the front surface for guiding a laser beam emitted from the semiconductor laser element toward an object and guiding light reflected on the object to the light receiving element; wherein the outer peripheral surface is configured so as to be fitted in a cylindrical hole having an axis parallel to the optical axis of the optical element, and has a recess extending from the front surface to the rear surface, and the leads are bent as extending from the front surface and passing through the recess with distal portions thereof extending along the optical axis of the optical element and with proximal ends thereof electrically connected to the semiconductor laser element and the light receiving element.
摘要翻译：半导体激光装置包括：具有前表面，后表面和外周面的封装; 半导体激光元件和设置在前表面上的光接收元件; 在前表面上以间隔开的方式布置成从包装向外延伸的多个引线; 以及支撑在前表面上的光学元件，其光轴垂直于前表面，用于将从半导体激光元件发射的激光束朝向物体引导并将在物体上反射的光引导到光接收元件; 其特征在于，所述外周面配置成具有与所述光学元件的光轴平行的轴的圆筒状孔，并且具有从所述前表面延伸到所述后表面的凹部，并且所述引线被弯曲成延伸从前表面通过凹部，其远端部分沿着光学元件的光轴延伸，并且其近端电连接到半导体激光元件和光接收元件。

6. 发明授权

US07812364B2 Semiconductor light emitting device 有权
标题翻译：半导体发光器件
公开(公告)号：US07812364B2
公开(公告)日：2010-10-12
申请号：US12053356
申请日：2008-03-21
申请人： Masahiro Seko , Hisayuki Shinohara
发明人： Masahiro Seko , Hisayuki Shinohara
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L24/45 , H01L24/48 , H01L25/0753 , H01L33/62 , H01L2224/05599 , H01L2224/05639 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48097 , H01L2224/48247 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/12041 , H01L2924/181 , H01L2924/00 , H01L2924/00015 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A semiconductor light emitting device has an outer lead disposed along an outer wall of a mold resin portion perpendicular to a light-emitting plane of a light emitting diode. An outer lead is also disposed at an outer wall of the mold resin portion parallel to and opposite to the light-emitting plane. The outer wall of the resin mold where the outer lead is disposed is taken as a mount face. Each outer wall of the mold resin portion constituting a mount face includes at least one outer lead for an anode and a cathode. According to the present configuration, there is provided a semiconductor light emitting device that allows selection of side-emission mounting or top-emission mounting with the same components on a mount substrate.
摘要翻译：半导体发光器件具有沿着垂直于发光二极管的发光面的模制树脂部分的外壁设置的外引线。外引线还设置在平行于发光平面并与发光平面相对的模制树脂部分的外壁上。将设置有外引线的树脂模具的外壁作为安装面。构成安装面的模制树脂部分的每个外壁包括用于阳极和阴极的至少一个外引线。根据本结构，提供了一种半导体发光器件，其允许在安装基板上选择具有相同部件的侧面发射安装或顶部发射安装。

7. 发明申请

US20070248133A1 Optical pickup device, semiconductor laser device and housing usable for the optical pickup device, and method of manufacturing semiconductor laser device 有权
标题翻译：可用于光学拾取装置的光学拾取装置，半导体激光装置和壳体以及半导体激光装置的制造方法
公开(公告)号：US20070248133A1
公开(公告)日：2007-10-25
申请号：US11812715
申请日：2007-06-21
申请人： Hisayuki Shinohara , Makoto Tsuji , Takashi Itoh , Nobuhiro Nishiyama
发明人： Hisayuki Shinohara , Makoto Tsuji , Takashi Itoh , Nobuhiro Nishiyama
IPC分类号： H01S5/022
CPC分类号： G11B7/127 , H01S5/005 , H01S5/02228 , H01S5/02236 , H01S5/02244 , H01S5/02248 , H01S5/02272 , H01S5/0683
摘要： A semiconductor laser device includes a first lead having a plate-like mounting portion on which a semiconductor laser chip is mounted and a lead portion extending from the mounting portion, a second lead extending along the lead portion of the first lead, and a retention portion made of an insulative material that integrally retains the first lead and the second lead. The mounting portion of the first lead has a back surface exposed from the retention portion, and the first lead further has a tie bar portion projecting from the mounting portion along the back surface of the mounting portion.
摘要翻译：半导体激光装置包括具有安装有半导体激光芯片的板状安装部和从安装部延伸的引导部的第一引线，沿着第一引线的引线部延伸的第二引线，以及保持部由一体地保持第一引线和第二引线的绝缘材料制成。第一引线的安装部分具有从保持部分露出的后表面，并且第一引线还具有从安装部分沿安装部分的后表面突出的拉杆部分。

8. 发明申请

US20050286581A1 Optical pickup device, semiconductor laser device and housing usable for the optical pickup device, and method of manufacturing semiconductor laser device 审中-公开
标题翻译：可用于光学拾取装置的光学拾取装置，半导体激光装置和壳体以及半导体激光装置的制造方法
公开(公告)号：US20050286581A1
公开(公告)日：2005-12-29
申请号：US11090182
申请日：2005-03-28
申请人： Hisayuki Shinohara , Makoto Tsuji , Takashi Itoh , Nobuhiro Nishiyama
发明人： Hisayuki Shinohara , Makoto Tsuji , Takashi Itoh , Nobuhiro Nishiyama
IPC分类号： H01S5/022 , G11B7/125 , H01S5/00 , H01S5/02 , H01S5/024 , H01S5/0683
CPC分类号： G11B7/127 , H01S5/005 , H01S5/02228 , H01S5/02236 , H01S5/02244 , H01S5/02248 , H01S5/02272 , H01S5/0683
摘要： A semiconductor laser device includes a first lead having a plate-like mounting portion on which a semiconductor laser chip is mounted and a lead portion extending from the mounting portion, a second lead extending along the lead portion of the first lead, and a retention portion made of an insulative material that integrally retains the first lead and the second lead. The mounting portion of the first lead has a back surface exposed from the retention portion, and the first lead further has a tie bar portion projecting from the mounting portion along the back surface of the mounting portion.
摘要翻译：半导体激光装置包括具有安装有半导体激光芯片的板状安装部和从安装部延伸的引导部的第一引线，沿着第一引线的引线部延伸的第二引线，以及保持部由一体地保持第一引线和第二引线的绝缘材料制成。第一引线的安装部分具有从保持部分露出的后表面，并且第一引线还具有从安装部分沿安装部分的后表面突出的拉杆部分。

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