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1. 发明申请

US20070128364A1 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD 审中-公开
公开(公告)号：US20070128364A1
公开(公告)日：2007-06-07
申请号：US11615640
申请日：2006-12-22
申请人： Hiroyuki Shinozaki , Norihiro Yamaguchi , Katsuhide Watanabe
发明人： Hiroyuki Shinozaki , Norihiro Yamaguchi , Katsuhide Watanabe
IPC分类号： B05D3/00 , B05C5/00 , C23C14/00
CPC分类号： H01L21/6831 , H01L21/67259
摘要： A substrate treatment apparatus is disclosed. The substrate treatment apparatus has an electrostatic chuck mechanism, a grounding mechanism, and an electron beam radiating mechanism. The electrostatic chuck mechanism electrostatically sucks and holds a substrate under treatment. The grounding mechanism freely contacts a predetermined film of a plurality of films formed on a treatment surface of the substrate under treatment sucked and held by the electrostatic chuck mechanism. The electron beam radiating mechanism radiates a resist film formed on the treatment surface side of the substrate under treatment with an electron beam.

2. 发明申请

US20070107656A1 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD 审中-公开
公开(公告)号：US20070107656A1
公开(公告)日：2007-05-17
申请号：US11615621
申请日：2006-12-22
申请人： Hiroyuki SHINOZAKI , Norihiro Yamaguchi , Katsuhide Watanabe
发明人： Hiroyuki SHINOZAKI , Norihiro Yamaguchi , Katsuhide Watanabe
IPC分类号： C23C14/00 , B05C11/00
CPC分类号： H01L21/6831 , H01L21/67259
摘要： A substrate treatment apparatus is disclosed. The substrate treatment apparatus has an electrostatic chuck mechanism, a grounding mechanism, and an electron beam radiating mechanism. The electrostatic chuck mechanism electrostatically sucks and holds a substrate under treatment. The grounding mechanism freely contacts a predetermined film of a plurality of films formed on a treatment surface of the substrate under treatment sucked and held by the electrostatic chuck mechanism. The electron beam radiating mechanism radiates a resist film formed on the treatment surface side of the substrate under treatment with an electron beam.

3. 发明申请

US20070111542A1 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD 审中-公开
标题翻译：基板处理装置和基板处理方法
公开(公告)号：US20070111542A1
公开(公告)日：2007-05-17
申请号：US11615676
申请日：2006-12-22
申请人： Hiroyuki Shinozaki , Norihiro Yamaguchi , Katsuhide Watanabe
发明人： Hiroyuki Shinozaki , Norihiro Yamaguchi , Katsuhide Watanabe
IPC分类号： B05C13/02 , H01L21/20 , H01L21/31
CPC分类号： H01L21/6831 , H01L21/67259
摘要： A substrate treatment apparatus is disclosed. The substrate treatment apparatus has an electrostatic chuck mechanism, a grounding mechanism, and an electron beam radiating mechanism. The electrostatic chuck mechanism electrostatically sucks and holds a substrate under treatment. The grounding mechanism freely contacts a predetermined film of a plurality of films formed on a treatment surface of the substrate under treatment sucked and held by the electrostatic chuck mechanism. The electron beam radiating mechanism radiates a resist film formed on the treatment surface side of the substrate under treatment with an electron beam.
摘要翻译：公开了一种基板处理装置。基板处理装置具有静电卡盘机构，接地机构和电子束照射机构。静电吸盘机构静电吸附并保持处理的基板。接地机构自由地接触由静电卡盘机构吸引并保持的处理的处理面上形成的多个膜的规定膜。电子束照射机构利用电子束照射形成在基板的处理面侧的抗蚀剂膜。

4. 发明申请

US20070111536A1 Substrate treatment apparatus and substrate treatment method 审中-公开
标题翻译：基板处理装置及基板处理方法
公开(公告)号：US20070111536A1
公开(公告)日：2007-05-17
申请号：US11599255
申请日：2006-11-15
申请人： Hiroyuki Shinozaki , Norihiro Yamaguchi , Katsuhide Watanabe
发明人： Hiroyuki Shinozaki , Norihiro Yamaguchi , Katsuhide Watanabe
IPC分类号： G03C5/00 , B05C13/00 , B05B5/025 , H01L21/31
CPC分类号： H01L21/6831 , H01L21/67259
摘要： A substrate treatment apparatus is disclosed. The substrate treatment apparatus has an electrostatic chuck mechanism, a grounding mechanism, and an electron beam radiating mechanism. The electrostatic chuck mechanism electrostatically sucks and holds a substrate under treatment. The grounding mechanism freely contacts a predetermined film of a plurality of films formed on a treatment surface of the substrate under treatment sucked and held by the electrostatic chuck mechanism. The electron beam radiating mechanism radiates a resist film formed on the treatment surface side of the substrate under treatment with an electron beam.
摘要翻译：公开了一种基板处理装置。基板处理装置具有静电卡盘机构，接地机构和电子束照射机构。静电吸盘机构静电吸附并保持处理的基板。接地机构自由地接触由静电卡盘机构吸引并保持的处理的处理面上形成的多个膜的规定膜。电子束照射机构利用电子束照射形成在基板的处理面侧的抗蚀剂膜。

5. 发明授权

US5397212A Robot with dust-free and maintenance-free actuators 失效
标题翻译：机器人具有无尘和免维护的执行器
公开(公告)号：US5397212A
公开(公告)日：1995-03-14
申请号：US19678
申请日：1993-02-19
申请人： Katsuhide Watanabe , Yoichi Kanemitsu , Hiroyuki Shinozaki , Naoji Hiraki , Shinichi Moriyama
发明人： Katsuhide Watanabe , Yoichi Kanemitsu , Hiroyuki Shinozaki , Naoji Hiraki , Shinichi Moriyama
IPC分类号： B25J9/04 , B25J9/12 , B25J18/04
CPC分类号： H01L21/67766 , B25J9/041 , B25J9/123 , B25J9/126 , F16C32/0465 , H01L21/67742
摘要： A robot with no mechanically contacting components are suitable for use in special environments such as semiconductor manufacturing processes where dust and lubrication are matters of important concern. The robot has a linear actuator composed of magnetic bearings and a linear motor for moving a robot arm linearly without mechanical contact, and a rotary actuator composed of magnetic bearings and a rotary motor for rotating a body which supports the linear actuator, around the rotary actuator without mechanical contact.
摘要翻译：没有机械接触部件的机器人适用于特殊环境，如半导体制造过程，其中灰尘和润滑是重要关注的问题。机器人具有由磁性轴承构成的线性致动器和用于在不机械接触的情况下线性地移动机器人手臂的线性电动机，以及由磁性轴承和用于使支撑线性致动器的主体旋转的旋转电动机，围绕旋转致动器无机械接触。

6. 外观设计

USD711330S1 Elastic membrane for semiconductor wafer polishing 有权
标题翻译：用于半导体晶片抛光的弹性膜
公开(公告)号：USD711330S1
公开(公告)日：2014-08-19
申请号：US29384219
申请日：2011-01-28
申请人： Makoto Fukushima , Hozumi Yasuda , Osamu Nabeya , Katsuhide Watanabe , Keisuke Namiki
设计人： Makoto Fukushima , Hozumi Yasuda , Osamu Nabeya , Katsuhide Watanabe , Keisuke Namiki

7. 发明申请

US20120058709A1 POLISHING APPARATUS AND METHOD 有权
标题翻译：抛光装置和方法
公开(公告)号：US20120058709A1
公开(公告)日：2012-03-08
申请号：US13226800
申请日：2011-09-07
申请人： Makoto FUKUSHIMA , Katsuhide Watanabe , Hozumi Yasuda , Satoru Yamaki
发明人： Makoto FUKUSHIMA , Katsuhide Watanabe , Hozumi Yasuda , Satoru Yamaki
IPC分类号： B24B49/00 , B24B41/06
CPC分类号： B24B37/005 , B24B37/015 , B24B37/10 , B24B37/30 , H01L21/67017 , H01L21/67092 , H01L21/6838
摘要： A polishing is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a substrate holding apparatus configured to hold the substrate and to press the substrate against the polishing surface, and a controller. The substrate holding apparatus includes an elastic membrane configured to form a substrate holding surface which is brought into contact with the substrate, a carrier provided above the elastic membrane, at least one pressure chamber formed between the elastic membrane and the carrier, and an infrared light detector configured to measure thermal energy from the elastic membrane. The controller calculates an estimate value of a temperature of the elastic membrane using a measured value of the infrared light detector.
摘要翻译：抛光用于将诸如半导体晶片的基板抛光到平面镜面。抛光装置包括具有抛光表面的抛光台，配置成保持基板并将基板压靠在抛光表面上的基板保持装置和控制器。基板保持装置包括：弹性膜，其构造成形成与基板接触的基板保持面，设置在弹性膜上方的载体，形成在弹性膜与载体之间的至少一个压力室，以及红外线检测器被配置为测量来自弹性膜的热能。控制器使用红外光检测器的测量值来计算弹性膜的温度的估计值。

8. 发明授权

US5720010A Control system for a linear actuator including magnetic bearings for levitating a robot arm 失效
标题翻译：用于线性致动器的控制系统，包括用于悬浮机器人臂的磁性轴承
公开(公告)号：US5720010A
公开(公告)日：1998-02-17
申请号：US699342
申请日：1996-08-19
申请人： Katsuhide Watanabe , Yoichi Kanemitsu , Shinichi Moriyama , Naoji Hiraki
发明人： Katsuhide Watanabe , Yoichi Kanemitsu , Shinichi Moriyama , Naoji Hiraki
IPC分类号： B25J13/00 , B25J9/18 , B25J18/02 , B25J19/00 , F16C32/04 , F16C39/06 , G05B19/19 , H02P25/06 , G05B15/00 , G05B19/00
CPC分类号： F16C32/0444 , G05B19/19 , F16C2300/62 , G05B2219/45083 , G05B2219/49271
摘要： A control system for controlling a linear actuator including magnetic bearings for levitating a robot arm and a pulse motor for linearly driving the arm in a non-contact manner is disclosed, which comprises a displacement detection unit including displacement sensors, first and second calculation units, moving amount detection unit and adding circuit. The displacement detection unit detects displacement values of the arm from a reference posture, the first calculation unit calculates guiding (y), levitation (z), roll (p), pitching (q), and yaw (r) control current values in response to the displacement values and provides guiding, levitation, roll, pitching, and yaw control current signals (, , , , ). The moving amount detecting circuit detects a moving amount (X.sub.0) of the arm from a reference position in response to an operation of the pulse motor, and provides a compensation current value (.DELTA.Iq") proportional to the moving amount, and the adding circuit adds the compensation current value (.DELTA.Iq") to the pitching control current signal (). The second calculation unit, in response to the guiding, levitation, roll and yaw control current signals (, , , ) and the added pitching control current signal (+.DELTA.Iq"), calculates drive current control values to compensate drive current flowing through the magnetic bearings.
摘要翻译：公开了一种用于控制线性致动器的控制系统，包括用于悬浮机器人臂的磁轴承和用于以非接触方式线性驱动臂的脉冲电机，其包括位移检测单元，其包括位移传感器，第一和第二计算单元，移动量检测单元和加法电路。位移检测单元从参考姿势检测臂的位移值，第一计算单元计算响应中的引导（y），悬浮（z），滚动（p），俯仰（q）和偏航（r）控制电流值提供位移值，并提供引导，悬挂，滚动，俯仰和偏航控制电流信号（+ Z，+ Z，+ Z，+ Z，+ Z）。移动量检测电路响应于脉冲电动机的操作从参考位置检测臂的移动量（X0），并且提供与移动量成比例的补偿电流值（DELTA Iq“），并且添加电路将补偿电流值（DELTA Iq“）添加到俯仰控制电流信号（+ Z）。第二计算单元响应于引导，悬挂，转向和偏转控制电流信号（+ Z，+ Z，+ Z，+ Z）和增加的俯仰控制电流信号（+ Z + DELTA Iq“），计算驱动电流控制值来补偿流经磁轴承的驱动电流。

9. 外观设计

USD633452S1 Elastic membrane for semiconductor wafer polishing apparatus 有权
公开(公告)号：USD633452S1
公开(公告)日：2011-03-01
申请号：US29356456
申请日：2010-02-25
申请人： Keisuke Namiki , Hozumi Yasuda , Osamu Nabeya , Makoto Fukushima , Shingo Togashi , Satoru Yamaki , Katsuhide Watanabe
设计人： Keisuke Namiki , Hozumi Yasuda , Osamu Nabeya , Makoto Fukushima , Shingo Togashi , Satoru Yamaki , Katsuhide Watanabe

10. 发明授权

US06437864B1 Stage positioning device 失效
标题翻译：舞台定位装置
公开(公告)号：US06437864B1
公开(公告)日：2002-08-20
申请号：US09355034
申请日：2000-05-18
申请人： Katsuhide Watanabe , Ichiju Satoh , Takahide Haga , Yoshinori Jouno
发明人： Katsuhide Watanabe , Ichiju Satoh , Takahide Haga , Yoshinori Jouno
IPC分类号： G01B1100
CPC分类号： G03F7/70758 , G03F7/70716 , G03F7/70816 , Y10S977/839
摘要： A micro-positioning apparatus enables stable and rapid positioning of a stage on which a specimen is placed. The apparatus has a stage for placing a specimen to be radiated with a beam, actuators for levitating the stage and controlling a movement of the stage, a first position sensor for measuring a relative displacement between the stage and the actuators, a second position sensor for measuring a relative displacement between an actual radiation position of the beam on the specimen and a target radiation position, and a controller for positioning the stage so as to decrease the relative displacement detected by the second sensor.
摘要翻译：微型定位装置能够稳定且快速地定位放置试样的载物台。该装置具有用于放置用光束辐射的样本的台阶，用于悬浮台架的致动器和控制台架的运动，用于测量台架和致动器之间的相对位移的第一位置传感器，用于测量样品上的光束的实际辐射位置与目标辐射位置之间的相对位移，以及用于定位该台的控制器，以便减小由第二传感器检测到的相对位移。

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