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1. 发明申请

US20070111542A1 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD 审中-公开
标题翻译：基板处理装置和基板处理方法
公开(公告)号：US20070111542A1
公开(公告)日：2007-05-17
申请号：US11615676
申请日：2006-12-22
申请人： Hiroyuki Shinozaki , Norihiro Yamaguchi , Katsuhide Watanabe
发明人： Hiroyuki Shinozaki , Norihiro Yamaguchi , Katsuhide Watanabe
IPC分类号： B05C13/02 , H01L21/20 , H01L21/31
CPC分类号： H01L21/6831 , H01L21/67259
摘要： A substrate treatment apparatus is disclosed. The substrate treatment apparatus has an electrostatic chuck mechanism, a grounding mechanism, and an electron beam radiating mechanism. The electrostatic chuck mechanism electrostatically sucks and holds a substrate under treatment. The grounding mechanism freely contacts a predetermined film of a plurality of films formed on a treatment surface of the substrate under treatment sucked and held by the electrostatic chuck mechanism. The electron beam radiating mechanism radiates a resist film formed on the treatment surface side of the substrate under treatment with an electron beam.
摘要翻译：公开了一种基板处理装置。基板处理装置具有静电卡盘机构，接地机构和电子束照射机构。静电吸盘机构静电吸附并保持处理的基板。接地机构自由地接触由静电卡盘机构吸引并保持的处理的处理面上形成的多个膜的规定膜。电子束照射机构利用电子束照射形成在基板的处理面侧的抗蚀剂膜。

2. 发明申请

US20070128364A1 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD 审中-公开
公开(公告)号：US20070128364A1
公开(公告)日：2007-06-07
申请号：US11615640
申请日：2006-12-22
申请人： Hiroyuki Shinozaki , Norihiro Yamaguchi , Katsuhide Watanabe
发明人： Hiroyuki Shinozaki , Norihiro Yamaguchi , Katsuhide Watanabe
IPC分类号： B05D3/00 , B05C5/00 , C23C14/00
CPC分类号： H01L21/6831 , H01L21/67259
摘要： A substrate treatment apparatus is disclosed. The substrate treatment apparatus has an electrostatic chuck mechanism, a grounding mechanism, and an electron beam radiating mechanism. The electrostatic chuck mechanism electrostatically sucks and holds a substrate under treatment. The grounding mechanism freely contacts a predetermined film of a plurality of films formed on a treatment surface of the substrate under treatment sucked and held by the electrostatic chuck mechanism. The electron beam radiating mechanism radiates a resist film formed on the treatment surface side of the substrate under treatment with an electron beam.

3. 发明申请

US20070111536A1 Substrate treatment apparatus and substrate treatment method 审中-公开
标题翻译：基板处理装置及基板处理方法
公开(公告)号：US20070111536A1
公开(公告)日：2007-05-17
申请号：US11599255
申请日：2006-11-15
申请人： Hiroyuki Shinozaki , Norihiro Yamaguchi , Katsuhide Watanabe
发明人： Hiroyuki Shinozaki , Norihiro Yamaguchi , Katsuhide Watanabe
IPC分类号： G03C5/00 , B05C13/00 , B05B5/025 , H01L21/31
CPC分类号： H01L21/6831 , H01L21/67259
摘要： A substrate treatment apparatus is disclosed. The substrate treatment apparatus has an electrostatic chuck mechanism, a grounding mechanism, and an electron beam radiating mechanism. The electrostatic chuck mechanism electrostatically sucks and holds a substrate under treatment. The grounding mechanism freely contacts a predetermined film of a plurality of films formed on a treatment surface of the substrate under treatment sucked and held by the electrostatic chuck mechanism. The electron beam radiating mechanism radiates a resist film formed on the treatment surface side of the substrate under treatment with an electron beam.
摘要翻译：公开了一种基板处理装置。基板处理装置具有静电卡盘机构，接地机构和电子束照射机构。静电吸盘机构静电吸附并保持处理的基板。接地机构自由地接触由静电卡盘机构吸引并保持的处理的处理面上形成的多个膜的规定膜。电子束照射机构利用电子束照射形成在基板的处理面侧的抗蚀剂膜。

4. 发明授权

US5397212A Robot with dust-free and maintenance-free actuators 失效
标题翻译：机器人具有无尘和免维护的执行器
公开(公告)号：US5397212A
公开(公告)日：1995-03-14
申请号：US19678
申请日：1993-02-19
申请人： Katsuhide Watanabe , Yoichi Kanemitsu , Hiroyuki Shinozaki , Naoji Hiraki , Shinichi Moriyama
发明人： Katsuhide Watanabe , Yoichi Kanemitsu , Hiroyuki Shinozaki , Naoji Hiraki , Shinichi Moriyama
IPC分类号： B25J9/04 , B25J9/12 , B25J18/04
CPC分类号： H01L21/67766 , B25J9/041 , B25J9/123 , B25J9/126 , F16C32/0465 , H01L21/67742
摘要： A robot with no mechanically contacting components are suitable for use in special environments such as semiconductor manufacturing processes where dust and lubrication are matters of important concern. The robot has a linear actuator composed of magnetic bearings and a linear motor for moving a robot arm linearly without mechanical contact, and a rotary actuator composed of magnetic bearings and a rotary motor for rotating a body which supports the linear actuator, around the rotary actuator without mechanical contact.
摘要翻译：没有机械接触部件的机器人适用于特殊环境，如半导体制造过程，其中灰尘和润滑是重要关注的问题。机器人具有由磁性轴承构成的线性致动器和用于在不机械接触的情况下线性地移动机器人手臂的线性电动机，以及由磁性轴承和用于使支撑线性致动器的主体旋转的旋转电动机，围绕旋转致动器无机械接触。

5. 发明授权

US06519273B2 Magnetic bearing and circulation fan apparatus 失效
标题翻译：磁轴承和循环风机
公开(公告)号：US06519273B2
公开(公告)日：2003-02-11
申请号：US09785304
申请日：2001-02-20
申请人： Shinichi Sekiguchi , Hiroyuki Shinozaki , Shunichi Aiyoshizawa , Toshimitsu Barada , Atsushi Ooyama
发明人： Shinichi Sekiguchi , Hiroyuki Shinozaki , Shunichi Aiyoshizawa , Toshimitsu Barada , Atsushi Ooyama
IPC分类号： H01S322
CPC分类号： F16C32/0465 , F16C32/0459 , F16C32/0468 , F16C32/047 , F16C2300/42
摘要： A magnetic bearing enables to rotatably support a levitated body non-contactingly disposed in a hermetically sealed container filled with a gaseous process substance of a corrosive nature, while without contaminating the gaseous environment and suffering from corrosion. The magnetic bearing has an electromagnet for supporting a levitated body, a displacement sensor for detecting a levitated position of the levitated body, and a controller for supplying signals and excitation currents to the displacement sensor and the electromagnet through cables. An electromagnet target of the magnetic bearing that generates variations in magnetic fields due to rotation of the levitated body, is constructed of a single piece of ferromagnetic material, and is provided with an electrical insulation structure oriented parallel to magnetic fluxes generated by the electromagnet.
摘要翻译：磁性轴承能够可旋转地支撑非接触地设置在填充有腐蚀性气体处理物质的气密密封容器中的悬浮体，同时不污染气体环境并遭受腐蚀。磁性轴承具有用于支撑悬浮体的电磁体，用于检测悬浮体的悬浮位置的位移传感器，以及通过电缆向位移传感器和电磁体提供信号和激励电流的控制器。磁悬浮轴承的电磁铁靶由于悬浮体的旋转产生磁场的变化，由单片铁磁材料构成，并具有与电磁铁产生的磁通平行取向的电绝缘结构。

6. 发明授权

US06464472B1 Circulation fan apparatus and circulation-fan driving motor 有权
标题翻译：循环风机和循环风机驱动电机
公开(公告)号：US06464472B1
公开(公告)日：2002-10-15
申请号：US09622367
申请日：2000-08-16
申请人： Shinichi Sekiguchi , Hiroyuki Shinozaki , Toshimitsu Barada , Toshiharu Nakazawa , Takeshi Kawamura
发明人： Shinichi Sekiguchi , Hiroyuki Shinozaki , Toshimitsu Barada , Toshiharu Nakazawa , Takeshi Kawamura
IPC分类号： F04B1700
CPC分类号： F04D29/058 , F04D25/06 , F16C32/047 , F16C32/0474 , F16C2300/42 , F16C2360/44
摘要： A circulation fan apparatus including a hermetic vessel 1 containing a corrosive process gas therein, and a circulation fan 2 installed in the hermetic vessel, rotors 2-1, 2-2 of the circulation fan are rotatably supported by bearings, wherein the bearings comprises control-type radial magnetic bearings 4, 5 and at least control-type axial magnetic bearing 6, 7, displacement sensor targets 4-1, 5-1, 6-1, and 7-1 and rotor-side magnetic poles 4-2, 5-2, 6-2, and 7-2 of radial magnetic bearings 4 and 5 and axial magnetic bearings 6 and 7 are fixed to the rotors 2-1 and 2-2 of the circulation fan 2 and are disposed in the hermetic space communicating with the hermetic vessel, and displacement sensors 4-3, 5-3, 6-3, and 7-3 and stator-side magnetic poles 4-4, 5-4, 6-4, and 7-4 opposing the displacement sensor targets and rotor-side magnetic poles are disposed outside of the hermetic vessel with cans 14, 15, 17, and 18 interposed therebetween, whereby even when the circulation fan 2 is rotated at a high speed and under a high load, the process gas is not contaminated, ensuring maintenance-free operation, and furthermore, an installation space can be reduced.
摘要翻译：一种循环风扇装置，包括其中含有腐蚀性工艺气体的密封容器1和安装在密封容器中的循环风扇2，循环风扇的转子2-1,2-2由轴承可旋转地支撑，其中轴承包括控制型径向磁轴承4,5和至少控制型轴向磁轴承6,7位移传感器目标4-1,5-1,6-1和7-1以及转子侧磁极4-2，径向磁轴承4和5以及轴向磁轴承6和7的5-2,6-2和7-2固定在循环风扇2的转子2-1和2-2上，并设置在密封空间与密封容器连通，以及位移传感器4-3,5-3,6-3和7-3以及与位移相反的定子侧磁极4-4,5-4,6-4和7-4 传感器靶和转子侧磁极设置在密封容器的外侧，其间插入有罐14,15,17和18，由此即使循环风扇2是旋转在高速和高负载下，处理气体不被污染，确保免维护操作，此外，可以减少安装空间。

7. 发明授权

US06366039B1 Excimer laser device 有权
标题翻译：准分子激光装置
公开(公告)号：US06366039B1
公开(公告)日：2002-04-02
申请号：US09553466
申请日：2000-04-19
申请人： Shinichi Sekiguchi , Hiroyuki Shinozaki , Toshimitsu Barada , Toshiharu Nakazawa
发明人： Shinichi Sekiguchi , Hiroyuki Shinozaki , Toshimitsu Barada , Toshiharu Nakazawa
IPC分类号： H01S302
CPC分类号： F16C32/047 , H01S3/036 , H01S3/225
摘要： An excimer laser device which is capable of keeping the rotational speed of a fan constant and uniformizing a laser gas flow between main discharge electrodes even when the pressure of a laser gas filled in a casing varies. The excimer laser device includes a casing filled with a laser gas; a pair of main discharge electrodes disposed in the casing for producing an electric discharge to discharge-pump the laser gas at a high repetition rate; a fan for producing a high-speed laser gas flow between the main discharge electrodes; bearings, the fan having a rotatable shaft rotatably supported by the bearings; a motor for actuating the fan; a rotational speed detecting device for detecting a rotational speed of the fan; and control device for controlling at least one of a voltage and a frequency to be supplied to the motor based on the rotational speed of the fan detected by the rotational speed detecting device, thereby to control the rotational speed of the fan at a constant level.
摘要翻译：即使在填充在壳体中的激光气体的压力变化的情况下，能够使风扇的旋转速度恒定并使主放电电极之间的激光气流均匀化的准分子激光装置。准分子激光装置包括填充有激光气体的壳体; 一对主放电电极，设置在壳体中，用于产生放电，以高重复率对激光气体进行泵浦; 用于在主放电电极之间产生高速激光气流的风扇; 所述风扇具有由所述轴承可旋转地支撑的可旋转轴; 用于致动风扇的电动机; 用于检测风扇的转速的转速检测装置; 以及控制装置，用于根据由转速检测装置检测到的风扇的转速来控制要提供给电动机的电压和频率中的至少一个，从而将风扇的转速控制在恒定水平。

8. 发明授权

US5728223A Reactant gas ejector head and thin-film vapor deposition apparatus 失效
标题翻译：反应物气体喷射头和薄膜蒸镀装置
公开(公告)号：US5728223A
公开(公告)日：1998-03-17
申请号：US662763
申请日：1996-06-10
申请人： Takeshi Murakami , Noriyuki Takeuchi , Hiroyuki Shinozaki , Kiwamu Tsukamoto , Yukio Fukunaga , Akihisa Hongo
发明人： Takeshi Murakami , Noriyuki Takeuchi , Hiroyuki Shinozaki , Kiwamu Tsukamoto , Yukio Fukunaga , Akihisa Hongo
IPC分类号： C23C16/44 , C23C16/448 , C23C16/455 , C30B25/14 , H01L21/205 , H01L21/31 , C23C16/00
CPC分类号： C23C16/45512 , C23C16/455 , C23C16/45565 , C23C16/4557 , C30B25/14
摘要： A reactant gas ejector head in a thin-film vapor deposition apparatus includes at least two reactant gas inlet passages for introducing reactant gases, a gas mixing chamber for mixing reactant gases introduced from the reactant gas inlet passages, and a nozzle disposed downstream of the gas mixing chamber for rectifying the mixed gases from the gas mixing chamber into a uniform flow and applying the uniform flow to a substrate.
摘要翻译：薄膜气相沉积设备中的反应气体喷射头包括至少两个用于引入反应气体的反应气体入口通道，用于混合从反应气体入口通道引入的反应气体的气体混合室和设置在气体下游的喷嘴混合室，用于将来自气体混合室的混合气体整流成均匀的流动并将均匀的流动施加到基底。

9. 发明授权

US09156122B2 Method and apparatus for monitoring a polishing surface of a polishing pad used in polishing apparatus 有权
标题翻译：用于监测抛光装置中使用的抛光垫的抛光表面的方法和装置
公开(公告)号：US09156122B2
公开(公告)日：2015-10-13
申请号：US13479575
申请日：2012-05-24
申请人： Hiroyuki Shinozaki , Takahiro Shimano , Akira Imamura , Nakamura Akira
发明人： Hiroyuki Shinozaki , Takahiro Shimano , Akira Imamura , Nakamura Akira
IPC分类号： B24B49/02 , B24B49/18 , B24B37/04 , B24B53/08
CPC分类号： B24B37/005 , B24B37/042 , B24B49/02 , B24B49/04 , B24B49/18 , B24B49/186 , B24B53/005 , B24B53/017 , B24B53/08
摘要： A method is capable of monitoring the polishing surface of the polishing pad without removing the polishing pad from the polishing table. The method includes: conditioning the polishing surface of the polishing pad by causing a rotating dresser to oscillate on the polishing surface; measuring a height of the polishing surface when the conditioning of the polishing surface is performed; calculating a position of a measuring point of the height on a two-dimensional surface defined on the polishing surface; and repeating the measuring of the height of the polishing surface and the calculating of the position of the measuring point to create height distribution in the polishing surface.
摘要翻译：一种方法能够监测抛光垫的抛光表面，而无需从研磨台上移除抛光垫。该方法包括：通过使旋转的修整器在抛光表面上振荡来调节抛光垫的抛光表面; 当执行抛光表面的调理时，测量抛光表面的高度; 计算在所述抛光表面上限定的二维表面上的所述高度的测量点的位置; 并且重复测量抛光表面的高度和计算测量点的位置以在抛光表面中产生高度分布。

10. 发明授权

US08517796B2 Dressing apparatus, dressing method, and polishing apparatus 有权
标题翻译：敷料装置，修整方法和抛光装置
公开(公告)号：US08517796B2
公开(公告)日：2013-08-27
申请号：US12791979
申请日：2010-06-02
申请人： Hiroyuki Shinozaki
发明人： Hiroyuki Shinozaki
IPC分类号： B24B49/00 , B24B55/00 , B24B5/00 , B24B1/00
CPC分类号： B24B53/017 , B24B49/08 , B24B49/16
摘要： A dressing apparatus is used in a polishing apparatus for polishing a substrate to planarize a surface of the substrate. The dressing apparatus includes a dresser disk, a dresser drive shaft coupled to the dresser disk, a pneumatic cylinder configured to press the dresser disk against the polishing pad through the dresser drive shaft, a pressure-measuring device configured to measure pressure of the gas supplied to the pneumatic cylinder, a load-measuring device configured to measure a load acting on the dresser drive shaft, and a pressure controller configured to control the pressure of the gas supplied to the pneumatic cylinder. The pressure controller is configured to establish a relationship between the pressure of the gas and a pressing force of the dresser disk against the polishing pad, based on measurement values of the pressure-measuring device and the load-measuring device.
摘要翻译：在用于抛光基板以使基板的表面平坦化的抛光装置中使用敷料装置。修整装置包括修整器盘，联接到修整器盘的修整器驱动轴，气动缸，构造成通过修整器驱动轴将修整器盘压靠在抛光垫上;压力测量装置，被配置为测量供应的气体的压力一个负载测量装置，被配置为测量作用在修整器驱动轴上的负载;以及压力控制器，被配置为控制供应到气缸的气体的压力。压力控制器被配置为基于压力测量装置和负载测量装置的测量值来建立气体的压力和修整器盘对抛光垫的按压力之间的关系。

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