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1. 发明授权

US5336761A Heat-developable diffusion transfer color photographic material 失效
标题翻译：热显影扩散转印彩色照相材料
公开(公告)号：US5336761A
公开(公告)日：1994-08-09
申请号：US845948
申请日：1992-03-04
申请人： Hiroyuki Ozaki , Takuya Yokokawa
发明人： Hiroyuki Ozaki , Takuya Yokokawa
IPC分类号： G03C1/498 , G03C8/08 , G03C8/40 , G03C5/54 , G03C5/16 , G03C7/20
CPC分类号： G03C8/08 , G03C1/49854 , G03C8/404 , G03C8/408 , Y10S430/145
摘要： Disclosed is a diffusion transfer color photographic material at least having a light-sensitive silver halide, a binder, a non-diffusive dye donor compound capable of releasing or forming a diffusive dye in correspondence or reverse correspondence with the reaction of reducing the silver halide to silver, and a non-diffusive filter dye, on a support, in which the filter dye is in the form of an emulsified dispersion along with the dye donor compound. The color separatability of the processed material is good and the discrimination of the formed image is also good. The raw film of the material is free from lowering of the filter effect after storage. Also disclosed is a heat-developable color photographic material having at least two layers of a light-sensitive layer B having a peak of color sensitivity to a light of from 720 to 780 nm and a light-sensitive layer A having a peak of color sensitivity to a light of from 790 to 860 nm, on a support, in which the maximum sensitivity of the light-sensitive layer B is same as or lower than the maximum sensitivity of the light-sensitive layer A. The material has excellent time-dependent raw film storage stability. It may be developed with little temperature dependence and water amount dependence to give an image of high sharpness.
摘要翻译：公开了一种扩散转印彩色照相材料，其至少具有感光卤化银，粘合剂，能够释放或形成扩散染料的非扩散染料供体化合物，其对应于或者与将卤化银还原为银和非扩散性过滤染料，其中过滤染料与染料供体化合物一起呈乳化分散体的形式。加工材料的颜色分离性良好，形成图像的辨别性也良好。储存后材料的原料膜不会降低过滤效果。还公开了一种可热显影的彩色照相材料，其具有至少两层感光层B，该感光层B具有对于720至780nm的光的颜色敏感度的峰值，以及具有色彩敏感度峰值的感光层A 在790〜860nm的光下，在感光层B的最大灵敏度与感光层A的最大灵敏度相同或更低的支持体上。该材料具有优异的时间依赖性生胶片储存稳定。可以开发出很少的温度依赖性和水量依赖性，以提供高锐度的图像。

2. 发明授权

US10854114B2 Cyphertext management method, cyphertext management apparatus, and program 有权
公开(公告)号：US10854114B2
公开(公告)日：2020-12-01
申请号：US16070423
申请日：2017-01-18
申请人： REAL TECHNOLOGY INC. , Hiroyuki Ozaki
发明人： Hiroyuki Ozaki
IPC分类号： G06F21/60 , G09C1/00 , H04L9/08 , G06F21/62
摘要： By introducing inequality to the information dispersal/sharing storage method, a ciphertext management method or the like is provided to support novel ciphertext data management. After the ciphertext and key data are each divided, pairs of the divided ciphertext and key data are generated. Specifically, they are one-to-one paired as with conventional techniques. Furthermore, additional one-to-many pairs are generated. The generated one-to-one pairs provide equality as with conventional techniques. When the number of the one-to-one pairs of the divided ciphertext and key data that can be used is equal to or greater than a threshold number, both the ciphertext data and the key data can be reconstructed, and accordingly, the secret data can be decoded. In contrast, even when the one-to-many pairs that can be used is equal to or greater than a threshold number, the ciphertext data and/or the key data cannot be reconstructed. This provides inequality.

3. 发明授权

US07700182B2 Microporous polyolefin membrane, its production method, and battery separator 有权
标题翻译：微孔聚烯烃膜，其制备方法和电池隔膜
公开(公告)号：US07700182B2
公开(公告)日：2010-04-20
申请号：US11383260
申请日：2006-05-15
申请人： Hiroyuki Ozaki , Kotaro Kimishima , Koichi Kono , Patrick Brant , Zerong Lin , Jeffery Lawrence Brinen
发明人： Hiroyuki Ozaki , Kotaro Kimishima , Koichi Kono , Patrick Brant , Zerong Lin , Jeffery Lawrence Brinen
IPC分类号： B32B3/26 , C06B21/00 , B29B55/00
CPC分类号： B29C55/005 , B01D67/0025 , B01D67/0027 , B01D69/02 , B01D71/26 , B01D2325/20 , B01D2325/22 , B01D2325/24 , B29K2023/00 , B29K2105/0061 , B29K2105/04 , Y10T428/249953 , Y10T428/249978
摘要： A microporous polyolefin membrane comprising a polyethylene resin, and polypropylene having a weight-average molecular weight of 6×105 or more and a heat of fusion of 90 J/g or more (measured by a differential scanning calorimeter), a fraction having a molecular weight of 1.8×106 or more being 10% or more by mass of the polypropylene.
摘要翻译：包含聚乙烯树脂和重均分子量为6×10 5以上，熔融热为90J / g以上（通过差示扫描量热计测定）的聚丙烯的微孔性聚烯烃膜，具有分子量 1.8×10 6以上的聚丙烯的重量为10质量％以上。

4. 发明授权

US07166926B2 Method for producing semiconductor device and semiconductor device 有权
标题翻译：半导体器件和半导体器件的制造方法
公开(公告)号：US07166926B2
公开(公告)日：2007-01-23
申请号：US10959437
申请日：2004-10-07
申请人： Kenichi Hayashi , Hisashi Kawafuji , Tatsuyuki Takeshita , Nobuhito Funakoshi , Hiroyuki Ozaki
发明人： Kenichi Hayashi , Hisashi Kawafuji , Tatsuyuki Takeshita , Nobuhito Funakoshi , Hiroyuki Ozaki
IPC分类号： H01L23/28
CPC分类号： H01L23/49575 , H01L21/565 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/4903 , H01L2224/49051 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The method of producing a semiconductor device in which chips are resin-molded, including steps of: preparing frames having front and back surfaces and die pads; preparing an insulation resin sheet having a first and a second surfaces; preparing a resin-sealing metal mold having cap pins; mounting the resin sheet inside the resin-sealing metal mold in such a manner that the second surface of the resin sheet contacts an inner bottom surface of the resin-sealing metal mold; mounting power chips on the surfaces of the die pads; positioning the frames on the first surface of the resin sheet in such a manner that the back surfaces of the die pads contact the first surface of the resin sheet; pressing the die pads toward the resin sheet using the cap pins and fixing the die pads; injecting a sealing resin in the resin-sealing metal mold and hardening the sealing resin; and removing the semiconductor device in which the power chips are molded with the sealing resin out from the resin-sealing metal mold. The resin sheet may include a metal foil which is disposed to the second surface.
摘要翻译：制造芯片是树脂模制的半导体器件的方法，包括以下步骤：制备具有正面和背面的芯片和芯片焊盘; 制备具有第一和第二表面的绝缘树脂片; 制备具有盖销的树脂密封金属模具; 以树脂片的第二面接触树脂密封金属模的内底面的方式将树脂片安装在树脂密封金属模具内; 将功率芯片安装在芯片焊盘的表面上; 将框架定位在树脂片的第一表面上，使得芯片焊盘的背面与树脂片的第一表面接触; 使用所述盖销将所述管芯焊盘朝向所述树脂片挤压并固定所述管芯焊盘; 在树脂密封金属模具中注入密封树脂并使密封树脂硬化; 并且用密封树脂从树脂密封金属模具中取出其中模制功率芯片的半导体器件。树脂片可以包括设置在第二表面上的金属箔。

5. 发明授权

US06653430B1 Butadiene polymers and process for producing conjugated diene polymers 失效
标题翻译：丁二烯聚合物和共轭二烯聚合物的制备方法
公开(公告)号：US06653430B1
公开(公告)日：2003-11-25
申请号：US09601469
申请日：2001-06-18
申请人： Kazuo Soga , Michihiko Asai , Yasuzo Suzuki , Akira Miyazawa , Kenji Tsuchihara , Masahide Murata , Hiroyuki Ozaki , Masanao Kawabe , Yoshifumi Fukui , Jizhy Jin , Hideaki Hagihara , Toshio Kase
发明人： Kazuo Soga , Michihiko Asai , Yasuzo Suzuki , Akira Miyazawa , Kenji Tsuchihara , Masahide Murata , Hiroyuki Ozaki , Masanao Kawabe , Yoshifumi Fukui , Jizhy Jin , Hideaki Hagihara , Toshio Kase
IPC分类号： C08F3606
CPC分类号： C08C19/44 , C08F36/06 , C08F4/642
摘要： A butadiene polymer (i) having a cis bond unit content of at least 50% based on the total butadiene units, a number average molecular weight (Mn) of 1,000 to 10,000,000, and at least 80%, based on the total molecular chains, of living chains containing a transition metal of group IV of the Periodic table at a terminal thereof; a polymer (ii) obtained by modifying terminals of the polymer (i); and a polymer (iii) obtained by coupling the polymers (i). These polymers (i), (ii) and (iii) are obtained by polymerizing a conjugated diene monomer alone or with a copolymerizable monomer at a specific temperature in the presence of a catalyst comprising a compound (A) of a transition metal of group IV of the periodic table having a cyclopentadienyl structure and a co-catalyst (B) selected from organoaluminum-oxy compound (a) and others and optionally further by contacting the resultant polymer with a terminal modifier or a coupling agent.
摘要翻译：丁二烯聚合物（i）基于总的丁二烯单元具有至少50％的顺式键单元含量，基于总分子链的数均分子量（Mn）为1,000至10,000,000，和至少80％的含有周期表第IV族过渡金属末端的活链; 通过改性聚合物（i）的末端获得的聚合物（ii）; 和通过偶联聚合物（i）获得的聚合物（iii）。这些聚合物（ⅰ），（ⅱ）和（ⅲ）是通过在包含IV族过渡金属的化合物（A）的催化剂存在下，在特定温度下单独或与可共聚单体共聚而获得的具有环戊二烯基结构的周期表和选自有机铝 - 氧化合物（a）等的助催化剂（B），任选地进一步通过使所得聚合物与末端改性剂或偶联剂接触。

6. 发明授权

US5747595A Catalyst for the polymerization of olefines and processes for the polymerization of olefines using the same 失效
标题翻译：用于烯烃聚合的催化剂和使用其的烯烃的聚合方法
公开(公告)号：US5747595A
公开(公告)日：1998-05-05
申请号：US622751
申请日：1996-03-27
申请人： Toshiya Saito , Takayuki Taki , Masashi Nakajima , Kunihiko Imanishi , Masahide Murata , Hiroyuki Ozaki , Kazukiyo Aiba , Masatoshi Ookura , Satoshi Ueki
发明人： Toshiya Saito , Takayuki Taki , Masashi Nakajima , Kunihiko Imanishi , Masahide Murata , Hiroyuki Ozaki , Kazukiyo Aiba , Masatoshi Ookura , Satoshi Ueki
IPC分类号： C08F4/649 , C08F10/00 , C08F10/06
CPC分类号： C08F10/00 , Y10S526/904
摘要： A catalyst for the polymerization of olefines comprises a solid catalytic component obtained by pre-polymerizing propylene in the presence of (A) a solid component containing magnesium, titanium, halogen and an electron-donating compound, (B) an organoaluminum compound, and (C) an alkylalkoxysilane represented by the formula, R.sup.1 Si(OR.sup.2)(OCH.sub.3).sub.2, wherein R.sup.1 represents a branched or cyclic alkyl group having 3 to 6 carbon atoms, and R.sup.2 represents a branched alkyl, alkenyl or alkinyl group having 3 to 6 carbon atoms; (B) an organoaluminum compound; and (D) an alkyltrialkoxysilane represented by the formula, R.sup.3 Si(OR.sup.4).sub.2 (OCH.sub.3), wherein R.sup.3 represents a linear alkyl group having 3 to 6 carbon atoms, and R.sup.4 represents a branched alkyl, alkenyl or alkinyl group having 3 to 5 carbon atoms.
摘要翻译：用于烯烃聚合的催化剂包括通过在（A）含有镁，钛，卤素和给电子化合物的固体组分（B）有机铝化合物和（A）的有机铝化合物的存在下将丙烯预聚合而获得的固体催化组分， C）由式R1Si（OR2）（OCH3）2表示的烷基烷氧基硅烷，其中R1表示碳原子数为3〜6的支链或环状烷基，R2表示碳原子数为3〜6的支链烷基，烯基或炔基原子（B）有机铝化合物; 和（D）由式R 3 Si（OR 4）2（OCH 3）表示的烷基三烷氧基硅烷，其中R 3表示具有3至6个碳原子的直链烷基，R 4表示具有3至5个碳原子的支链烷基，烯基或炔基原子

7. 发明授权

US5047310A Photographic process of heating during development after image exposure with a conductive layer containing carbon black 失效
标题翻译：在用含有炭黑的导电层进行图像曝光之后，在显影过程中加热的照相过程
公开(公告)号：US5047310A
公开(公告)日：1991-09-10
申请号：US942958
申请日：1986-12-16
申请人： Hiroyuki Ozaki , Hideki Naito , Satoru Sawada
发明人： Hiroyuki Ozaki , Hideki Naito , Satoru Sawada
IPC分类号： G03C1/00 , G03C1/85 , G03C7/00 , G03C8/40
CPC分类号： G03C1/85 , G03C1/853 , Y10S430/114
摘要： A photographic material is disclosed, which comprises a support having provided thereon at least one electrically conductive layer, said conductive layer comprising carbon black having a dibutyl phthalate absorption capability of at least 80 cc/100 g and a hydrophilic binder.
摘要翻译：公开了一种照相材料，其包括其上设置有至少一个导电层的载体，所述导电层包含具有至少80cc / 100g的邻苯二甲酸二丁酯吸收能力的炭黑和亲水性粘合剂。

8. 发明授权

US4761361A Method for forming an image employing acetylene silver compounds 失效
标题翻译：使用乙炔银化合物形成图像的方法
公开(公告)号：US4761361A
公开(公告)日：1988-08-02
申请号：US895063
申请日：1986-08-11
申请人： Hiroyuki Ozaki , Hiroyuki Hirai , Ken Kawata
发明人： Hiroyuki Ozaki , Hiroyuki Hirai , Ken Kawata
IPC分类号： G03C7/00 , G03C8/40 , G03C5/54
CPC分类号： G03C8/404 , G03C8/4013
摘要： A method for forming an image comprising heating a light-sensitive material comprising a support having thereon at least a light-sensitive silver halide, a dye providing substance, a binder, and an acetylene silver compound, simultaneously with or after imagewise exposure thereof in the presence of water and at least one of a base and a base precursor, thereby transferring a diffusible dye thus formed or released to a dye fixing layer.
摘要翻译：一种用于形成图像的方法，包括在其中在至少一种感光卤化银，染料提供物质，粘合剂和乙炔银化合物上加热包含其上的载体的感光材料，存在水和碱和基质前体中的至少一种，从而将由此形成或释放的可扩散染料转移到染料固定层。

9. 发明授权

US08507124B2 Multi-layer, microporous membrane, battery separator and battery 有权
标题翻译：多层，微孔膜，电池分离器和电池
公开(公告)号：US08507124B2
公开(公告)日：2013-08-13
申请号：US11940223
申请日：2007-11-14
申请人： Koichi Kono , Kohtaro Kimishima , Hiroyuki Ozaki , Patrick Brant , Jeffrey L. Brinen , Zerong Lin
发明人： Koichi Kono , Kohtaro Kimishima , Hiroyuki Ozaki , Patrick Brant , Jeffrey L. Brinen , Zerong Lin
IPC分类号： H01M2/16
CPC分类号： C08J5/2231 , B29C47/0004 , B29C47/0021 , B29C47/06 , B29C47/14 , B29C47/40 , B29C47/8805 , B29C47/8845 , B29K2023/06 , B29K2023/12 , B29K2105/256 , B29L2009/00 , B29L2031/3468 , B29L2031/755 , C08J2323/00 , H01M2/1653 , H01M10/0525 , Y10T428/249978 , Y10T428/24998
摘要： The invention relates to a multi-layer, microporous membrane having appropriate permeability, pin puncture strength, shutdown temperature, shutdown speed, meltdown temperature, and thickness uniformity. The invention also relates to a battery separator formed by such multi-layer, microporous membrane, and a battery comprising such a separator. Another aspect of the invention relates to a method for making the multi-layer, microporous polyolefin membrane, a method for making a battery using such a membrane as a separator, and a method for using such a battery.
摘要翻译：本发明涉及具有适当渗透性，针穿刺强度，停机温度，停机速度，熔化温度和厚度均匀性的多层微孔膜。本发明还涉及由这种多层微孔膜形成的电池隔膜以及包括这种隔膜的电池。本发明的另一方面涉及一种制造多层微孔聚烯烃膜的方法，使用这种膜作隔膜制造电池的方法以及使用这种电池的方法。

10. 发明授权

US07671453B2 Semiconductor device and method for producing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07671453B2
公开(公告)日：2010-03-02
申请号：US10946470
申请日：2004-09-22
申请人： Kenichi Hayashi , Hisashi Kawafuji , Tatsuyuki Takeshita , Nobuhito Funakoshi , Hiroyuki Ozaki , Kazuhiro Tada
发明人： Kenichi Hayashi , Hisashi Kawafuji , Tatsuyuki Takeshita , Nobuhito Funakoshi , Hiroyuki Ozaki , Kazuhiro Tada
IPC分类号： H01L23/495 , H01L23/28 , H01L23/29
CPC分类号： H01L21/565 , H01L23/4334 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49113 , H01L2924/00014 , H01L2924/01079 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor device in which chips are resin-molded, including: frames having front and back surfaces and die pads; power chips mounted on the surfaces of the die pads; an insulation resin sheet having a first and a second surfaces which are opposed against each other, the resin sheet being disposed such that the back surfaces of the die pads contact the first surface of the resin sheet; and a mold resin applied on the first surface of the resin sheet so as to seal up the power chips. The thermal conductivity of the resin sheet is larger than that of the mold resin.
摘要翻译：一种半导体器件，其中芯片是树脂模制的，包括：具有前表面和后表面的框架和芯片焊盘; 功率芯片安装在芯片的表面上; 具有彼此相对的第一和第二表面的绝缘树脂片，所述树脂片被设置成使得所述芯片焊盘的背面接触所述树脂片的所述第一表面; 以及在树脂片的第一表面上施加以密封功率芯片的模制树脂。树脂片的导热率大于模制树脂的热导率。

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