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1. 发明授权

US5518542A Double-sided substrate cleaning apparatus 失效
标题翻译：双面基板清洗装置
公开(公告)号：US5518542A
公开(公告)日：1996-05-21
申请号：US336213
申请日：1994-11-04
申请人： Hiroyuki Matsukawa , Akira Yonemizu , Michiaki Matsushita , Akihiro Fujimoto , Takashi Takekuma , Hidetami Yaegashi , Takahide Fukuda
发明人： Hiroyuki Matsukawa , Akira Yonemizu , Michiaki Matsushita , Akihiro Fujimoto , Takashi Takekuma , Hidetami Yaegashi , Takahide Fukuda
IPC分类号： H01L21/304 , B08B1/04 , B08B3/04 , B08B3/12 , H01L21/00 , H01L21/311 , H01L21/677 , B05C1/00
CPC分类号： H01L21/67173 , B08B1/007 , B08B1/04 , B08B3/04 , B08B3/12 , H01L21/31116 , H01L21/67028 , H01L21/67046 , H01L21/67051 , H01L21/6715 , H01L21/67178 , B08B2203/0288 , Y10S134/902 , Y10S414/136 , Y10S414/141
摘要： There is provided a double-sided substrate cleaning apparatus including a carrier station for loading/unloading a carrier in which objects to be processed are stored, a convey mechanism for conveying an object taken out from the carrier station, at least one cleaning mechanism, arranged along a convey path on which the convey mechanism conveys the object, for cleaning the object, and an object reversing mechanism, arranged along the convey path, for reversing the object.
摘要翻译：提供了一种双面基板清洁装置，包括用于装载/卸载其中存储有待处理物体的载体的承载站，用于传送从承载站取出的物体的传送机构，至少一个清洁机构，布置沿着传送机构传送物体的传送路径，用于清洁物体，以及沿着传送路径布置的用于反转物体的物体反转机构。

2. 发明授权

US5964954A Double-sided substrate cleaning apparatus and cleaning method using the same 失效
标题翻译：双面基板清洗装置及使用其的清洗方法
公开(公告)号：US5964954A
公开(公告)日：1999-10-12
申请号：US890996
申请日：1997-07-10
申请人： Hiroyuki Matsukawa , Akira Yonemizu , Michiaki Matsushita , Akihiro Fujimoto , Takashi Takekuma , Hidetami Yaegashi , Takahide Fukuda
发明人： Hiroyuki Matsukawa , Akira Yonemizu , Michiaki Matsushita , Akihiro Fujimoto , Takashi Takekuma , Hidetami Yaegashi , Takahide Fukuda
IPC分类号： H01L21/304 , B08B1/04 , B08B3/04 , B08B3/12 , H01L21/00 , H01L21/311 , H01L21/677 , B08B7/00 , B08B7/04
CPC分类号： H01L21/67173 , B08B1/007 , B08B1/04 , B08B3/04 , B08B3/12 , H01L21/31116 , H01L21/67028 , H01L21/67046 , H01L21/67051 , H01L21/6715 , H01L21/67178 , B08B2203/0288 , Y10S134/902 , Y10S414/136 , Y10S414/141
摘要： There is provided a double-sided substrate cleaning apparatus including a carrier station for loading/unloading a carrier in which objects to be processed are stored, a convey mechanism for conveying an object taken out from the carrier station, at least one cleaning mechanism, arranged along a convey path on which the convey mechanism conveys the object, for cleaning the object, and an object reversing mechanism, arranged along the convey path, for reversing the object.
摘要翻译：提供了一种双面基板清洁装置，包括用于装载/卸载其中存储有待处理物体的载体的承载站，用于传送从载体台取出的物体的传送机构，至少一个清洁机构，沿着传送机构传送物体的传送路径，用于清洁物体，以及沿着传送路径布置的用于反转物体的物体反转机构。

3. 发明授权

US5686143A Resist treating method 失效
标题翻译：抗蚀剂处理方法
公开(公告)号：US5686143A
公开(公告)日：1997-11-11
申请号：US597536
申请日：1996-02-02
申请人： Hiroyuki Matsukawa , Akira Yonemizu , Michiaki Matsushita , Akihiro Fujimoto , Takashi Takekuma , Hidetami Yaegashi , Takahide Fukuda
发明人： Hiroyuki Matsukawa , Akira Yonemizu , Michiaki Matsushita , Akihiro Fujimoto , Takashi Takekuma , Hidetami Yaegashi , Takahide Fukuda
IPC分类号： H01L21/304 , B08B1/04 , B08B3/04 , B08B3/12 , H01L21/00 , H01L21/311 , H01L21/677 , B05D3/00
CPC分类号： H01L21/67173 , B08B1/007 , B08B1/04 , B08B3/04 , B08B3/12 , H01L21/31116 , H01L21/67028 , H01L21/67046 , H01L21/67051 , H01L21/6715 , H01L21/67178 , B08B2203/0288 , Y10S134/902 , Y10S414/136 , Y10S414/141
摘要： There is provided a double-sided substrate cleaning apparatus including a carrier station for loading/unloading a carrier in which objects to be processed are stored, a convey mechanism for conveying an object taken out from the carrier station, at least one cleaning mechanism, arranged along a convey path on which the convey mechanism conveys the object, for cleaning the object, and an object reversing mechanism, arranged along the convey path, for reversing the object.
摘要翻译：提供了一种双面基板清洁装置，包括用于装载/卸载其中存储有待处理物体的载体的承载站，用于传送从承载站取出的物体的传送机构，至少一个清洁机构，布置沿着传送机构传送物体的传送路径，用于清洁物体，以及沿着传送路径布置的用于反转物体的物体反转机构。

4. 发明授权

US6054181A Method of substrate processing to form a film on multiple target objects 失效
标题翻译：在多个目标物体上形成膜的基板处理方法
公开(公告)号：US6054181A
公开(公告)日：2000-04-25
申请号：US692286
申请日：1996-08-05
申请人： Mitsuhiro Nanbu , Naruaki Iida , Hideaki Gotou , Masanori Tateyama , Yuji Yoshimoto , Tomoko Ishimoto , Hidetami Yaegashi , Yasunori Kawakami , Takahide Fukuda , Akihiro Fujimoto , Takashi Takekuma , Hiroyuki Matsukawa
发明人： Mitsuhiro Nanbu , Naruaki Iida , Hideaki Gotou , Masanori Tateyama , Yuji Yoshimoto , Tomoko Ishimoto , Hidetami Yaegashi , Yasunori Kawakami , Takahide Fukuda , Akihiro Fujimoto , Takashi Takekuma , Hiroyuki Matsukawa
IPC分类号： H01L21/00 , H01L21/677 , B05D3/12
CPC分类号： H01L21/67265 , H01L21/67173 , H01L21/67766 , H01L21/67778 , Y10S134/902 , Y10S414/135 , Y10S414/136 , Y10S414/137 , Y10S414/141
摘要： A method of subjecting a plurality of wafers to coating and beating treatments where a first boat is placed on a stage arranged in an interface section. The first boat is capable of containing the wafers stacked at intervals in a vertical direction. The stage is capable of moving in a horizontal direction, and has a plurality of positions for respectively placing a plurality of boats. The wafers are conveyed from a supply section to a coating section, and are subjected to a coating treatment one by one. The wafers, which have undergone the coating treatment, are conveyed to the interface section. The wafers, which have undergone the coating treatment, are loaded into the first boat placed on the stage, in the interface section. The first boat containing the wafers, which have undergone the coating treatment, is located at a transfer position by moving the stage. The first boat, located at a transfer position by moving the stage. The first boat, located at the transfer position, is conveyed from the stage into a heating section, and the wafers, which have undergone the coating treatment, are subjected to a heating treatment simultaneously and all together.
摘要翻译：一种将多个晶片进行涂覆和打浆处理的方法，其中第一个船被放置在布置在界面部分中的台上。第一艘船能够容纳沿垂直方向间隔堆叠的晶片。舞台能够沿水平方向移动，并且具有用于分别放置多个船的多个位置。将晶片从供给部输送到涂布部，并逐个进行涂布处理。已经经过涂覆处理的晶片被输送到界面部分。已经进行了涂覆处理的晶片被装载到接口部分中放置在载物台上的第一个舟皿中。包含经过涂覆处理的晶片的第一艘船通过移动台架位于转移位置。第一艘船，通过移动舞台位于转移位置。位于转移位置的第一个船从载物台输送到加热部分，并且经过涂覆处理的晶片同时进行加热处理。

5. 发明授权

US5565034A Apparatus for processing substrates having a film formed on a surface of the substrate 失效
标题翻译：用于处理在基板的表面上形成有膜的基板的装置
公开(公告)号：US5565034A
公开(公告)日：1996-10-15
申请号：US331083
申请日：1994-10-28
申请人： Mitsuhiro Nanbu , Naruaki Iida , Hideaki Gotou , Masanori Tateyama , Yuji Yoshimoto , Tomoko Ishimoto , Hidetami Yaegashi , Yasunori Kawakami , Takahide Fukuda , Akihiro Fujimoto , Takashi Takekuma , Hiroyuki Matsukawa
发明人： Mitsuhiro Nanbu , Naruaki Iida , Hideaki Gotou , Masanori Tateyama , Yuji Yoshimoto , Tomoko Ishimoto , Hidetami Yaegashi , Yasunori Kawakami , Takahide Fukuda , Akihiro Fujimoto , Takashi Takekuma , Hiroyuki Matsukawa
IPC分类号： H01L21/00 , H01L21/677 , B05C5/00
CPC分类号： H01L21/67265 , H01L21/67173 , H01L21/67766 , H01L21/67778 , Y10S134/902 , Y10S414/135 , Y10S414/136 , Y10S414/137 , Y10S414/141
摘要： A substrate processing apparatus according to this invention includes an interface section having a first transfer member for transferring an object from a coating process section for applying a process solution to the object in accordance with a single sheet process to an object holding member, and a moving member for detachably supplying a plurality of object holding member and simultaneously moving the plurality of object holding member, and a heat-treatment section having a second transfer member for transferring the object placed on the object holding member to a heat-treatment section for heat-treating the plurality of objects, which have undergone the coating process, in accordance with a batch process.
摘要翻译：根据本发明的基板处理装置包括接口部分，其具有第一传送部件，用于从涂覆处理部分传送物体，用于根据单个片材处理将物体施加到物体上，并将物体保持部件移动用于可拆卸地供给多个物体保持部件并同时移动多个物体保持部件的部件，以及具有用于将放置在物体保持部件上的物体转印到热处理部的热转印部件的热处理部，根据分批处理对经过涂覆处理的多个物体进行处理。

6. 发明授权

US5725664A Semiconductor wafer processing apparatus including localized humidification between coating and heat treatment sections 失效
标题翻译：半导体晶片处理装置包括涂层和热处理部之间的局部加湿
公开(公告)号：US5725664A
公开(公告)日：1998-03-10
申请号：US692436
申请日：1996-08-05
申请人： Mitsuhiro Nanbu , Naruaki Iida , Hideaki Gotou , Masanori Tateyama , Yuji Yoshimoto , Tomoko Ishimoto , Hidetami Yaegashi , Yasunori Kawakami , Takahide Fukuda , Akihiro Fujimoto , Takashi Takekuma , Hiroyuki Matsukawa
发明人： Mitsuhiro Nanbu , Naruaki Iida , Hideaki Gotou , Masanori Tateyama , Yuji Yoshimoto , Tomoko Ishimoto , Hidetami Yaegashi , Yasunori Kawakami , Takahide Fukuda , Akihiro Fujimoto , Takashi Takekuma , Hiroyuki Matsukawa
IPC分类号： H01L21/00 , H01L21/677 , B05C5/00
CPC分类号： H01L21/67265 , H01L21/67173 , H01L21/67766 , H01L21/67778 , Y10S134/902 , Y10S414/135 , Y10S414/136 , Y10S414/137 , Y10S414/141
摘要： An apparatus for subjecting a plurality of wafers to coating and heating treatments, including a coating section for subjecting the wafers to a coating treatment one by one, a heating section for subjecting wafers which have undergone the coating treatment to a heating treatment all together, and an interface section arranged between the coating section and the heating section. The wafers are heat-treated in the heat treatment section while the wafers are stacked at intervals in a vertical direction in a boat. The wafers which have undergone the coating treatment are loaded into the boat by a conveying member in the interface section. The conveying member and the boat are surrounded by a surrounding space formed by a casing at the interface section. A circulation line is combined with an air supply and exhaust system, for circulating air in the surrounding space. A dehumidifier is arranged on the circulation line for dehumidifying air in the circulation line to provide localized dehumidification of the surrounding space formed by the casing.
摘要翻译：一种用于对多个晶片进行涂覆和加热处理的设备，包括用于对晶片进行一次涂覆处理的涂布部分，将经过涂覆处理的晶片全部进行加热处理的加热部分一起进行加热处理;以及布置在涂覆部分和加热部分之间的界面部分。在热处理部分中对晶片进行热处理，同时晶片在船上沿垂直方向间隔堆叠。已经经过涂覆处理的晶片通过接口部分中的传送部件装载到船中。输送构件和舟皿由在界面部分处由壳体形成的周围空间包围。循环管线与供气和排气系统结合，用于在周围空间循环空气。在循环管线上设置除湿器，用于对循环管线中的空气进行除湿，以提供由壳体形成的周围空间的局部除湿。

7. 发明授权

US07063589B2 Remote control toy top 有权
公开(公告)号：US07063589B2
公开(公告)日：2006-06-20
申请号：US10413118
申请日：2003-04-14
申请人： Hiroyuki Matsukawa , Tatsuya Hocho , Jintei Choh
发明人： Hiroyuki Matsukawa , Tatsuya Hocho , Jintei Choh
IPC分类号： A63H1/06
CPC分类号： A63H30/04 , A63H1/04
摘要： A remote control toy top, which is capable of remotely controlling performance characteristics of a toy top spinning on a stadium and freely changing performance characteristics, is provided. The remote control toy top is composed of the toy top and a remote controller device for remotely controlling the performance characteristics of the toy top. The toy top is provided with a motor, and regular and reverse rotation of the motor is controlled by a control signal generated from the remote controller device, and a shaft body of the toy top is rotated in cooperation with a motor shaft of the motor.

8. 发明授权

US06746300B1 Toy top 失效
标题翻译：玩具顶
公开(公告)号：US06746300B1
公开(公告)日：2004-06-08
申请号：US10428715
申请日：2003-05-03
申请人： Hiroyuki Matsukawa
发明人： Hiroyuki Matsukawa
IPC分类号： A63H100
CPC分类号： A63H1/06
摘要： A toy top includes a toy body having a main spring power device therein, the main spring power device being rotatively linked with a revolving shaft provided on a center of a bottom surface of the toy body. The main spring power device includes latch means for maintaining a winding-up position when a main spring is wound up and a button for releasing the latch means so as to release a revolving force of the main spring. The toy body is provided with a press mechanism for pressing the button according to a rise or a reduction in a centrifugal force during the revolution of the toy body.
摘要翻译：玩具顶部包括其中具有主弹簧动力装置的玩具主体，主弹簧动力装置与设置在玩具本体的底面中心的旋转轴旋转地连接。主弹簧动力装置包括用于当主弹簧被卷绕时保持卷绕位置的闩锁装置和用于释放闩锁装置的按钮以释放主弹簧的旋转力。玩具本体设置有按钮机构，该按压机构根据玩具主体的旋转期间的离心力的升高或减小而按压按钮。

9. 发明授权

US06739939B2 Toy top game unit 失效
标题翻译：玩具顶级游戏单位
公开(公告)号：US06739939B2
公开(公告)日：2004-05-25
申请号：US10136724
申请日：2002-04-30
申请人： Hiroyuki Matsukawa
发明人： Hiroyuki Matsukawa
IPC分类号： A63H100
CPC分类号： A63F3/00895 , A63F7/0088 , A63F9/16 , A63F2003/00274 , A63F2003/00343 , A63F2007/301 , A63F2007/3637 , A63F2007/4056 , A63F2007/4068 , A63H1/04 , A63H33/26
摘要： A toy top game unit is provided, the unit comprising a toy top, driving means for rotating said toy top, a game board for receiving said toy top thereon, means for interacting the toy top and the game with each other, and for imparting a change to an operational mode of the toy top on said game board. The interacting means include first magnet means arranged on the toy top and second magnet means arranged on the game board.
摘要翻译：提供了一种玩具顶级游戏单元，该单元包括玩具顶部，用于旋转玩具顶部的驱动装置，用于接收所述玩具顶部的游戏板，用于将玩具顶部和游戏相互作用的装置，改变为所述游戏板上的玩具顶部的操作模式。相互作用装置包括布置在玩具顶部的第一磁体装置和布置在游戏板上的第二磁体装置。

10. 发明授权

US06583555B2 Flat fluorescent lamp and optical fixing device 失效
公开(公告)号：US06583555B2
公开(公告)日：2003-06-24
申请号：US09933831
申请日：2001-08-22
申请人： Hiroyuki Matsukawa , Nobuo Katsuma , Yoshihiro Yamaguchi , Hiroshi Fukuda , Satoru Ikeya , Akihiko Machida
发明人： Hiroyuki Matsukawa , Nobuo Katsuma , Yoshihiro Yamaguchi , Hiroshi Fukuda , Satoru Ikeya , Akihiko Machida
IPC分类号： H01J6304
CPC分类号： H01J63/04
摘要： A flat fluorescent lamp has a vessel or housing including first and second substrates opposed to each other at a small distance, and having discharge gas enclosed therein. A first planar electrode layer being transparent is disposed on an inner surface of the first substrate. A second planar electrode layer is disposed on an inner surface of the second substrate, for electrical discharge in cooperation with the first planar electrode layer. First and second dielectric layers are disposed on respectively the inner surfaces of the first and second substrates to cover the first and second planar electrode layers. First and second fluorescent layers are overlaid on respectively inner surfaces of the first and second dielectric layers, for emitting electromagnetic rays upon the electrical discharge between the first and second planar electrode layers. A pattern of plural projections is formed with the inner surface of the second dielectric layer.

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