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1. 发明申请

US20090020318A1 Circuit board, and semiconductor device 审中-公开
标题翻译：电路板和半导体器件
公开(公告)号：US20090020318A1
公开(公告)日：2009-01-22
申请号：US12283043
申请日：2008-09-09
申请人： Hiroyuki Imamura , Nobuyuki Koutani , Yoshifumi Nakamura , Kenshi Tokushima
发明人： Hiroyuki Imamura , Nobuyuki Koutani , Yoshifumi Nakamura , Kenshi Tokushima
IPC分类号： H05K1/00
CPC分类号： H01L23/4985 , H01L23/49811 , H01L23/49838 , H01L2224/05573 , H01L2224/16 , H01L2924/01078 , H05K1/111 , H05K1/189 , H05K2201/0367 , H05K2201/09781 , H05K2201/10674 , Y02P70/611
摘要： A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconductor chip is provided. The circuit board further includes an auxiliary conductive wiring positioned at an outermost corner of the region for mounting the semiconductor chip, being adjacent to and an outside the outermost conductive wiring, and an auxiliary bump formed on the auxiliary conductive wiring in line with the bumps on the conductive wirings. One end portion of the auxiliary conductive wiring is terminated at a position in the outside vicinity of the auxiliary bump in an outward direction of the region for mounting the semiconductor chip, and the auxiliary conductive wiring is bent at the other end portion positioned inside the auxiliary bump in an inward direction of the region for mounting the semiconductor chip, and connected to an end of the adjacent outermost conductive wiring. A break in the outermost conductive wiring, which is caused by concentrated stress at the time of joining the bumps of the circuit board and electrode pads of the semiconductor chip, can be suppressed.
摘要翻译：提供一种电路板，包括柔性绝缘基板，在柔性绝缘基板上成对排列的多个导电布线，以及设置在位于用于安装半导体芯片的区域中的各个导电布线的端部处的凸块。电路板还包括一个辅助导电布线，其位于用于安装半导体芯片的区域的最外角处，邻近于最外面的导电布线和外部的最外面的导电布线，以及形成在辅助导电布线上的辅助凸起，导电布线。辅助导电布线的一个端部在辅助凸块的外侧附近的位置处终止于用于安装半导体芯片的区域的向外方向上，并且辅助导电布线在位于辅助导体的内部的另一端部处弯曲在用于安装半导体芯片的区域的向内方向上突起，并且连接到相邻的最外面的导电布线的端部。可以抑制在接合电路板的凸块和半导体芯片的电极焊盘时的集中应力引起的最外面的导电布线的断裂。

2. 发明授权

US07439611B2 Circuit board with auxiliary wiring configuration to suppress breakage during bonding process 有权
标题翻译：具有辅助配线配置的电路板，可抑制接合过程中的破损
公开(公告)号：US07439611B2
公开(公告)日：2008-10-21
申请号：US11534288
申请日：2006-09-22
申请人： Hiroyuki Imamura , Nobuyuki Koutani , Yoshifumi Nakamura , Kenshi Tokushima
发明人： Hiroyuki Imamura , Nobuyuki Koutani , Yoshifumi Nakamura , Kenshi Tokushima
IPC分类号： H01L23/495
CPC分类号： H01L23/4985 , H01L23/49811 , H01L23/49838 , H01L2224/05573 , H01L2224/16 , H01L2924/01078 , H05K1/111 , H05K1/189 , H05K2201/0367 , H05K2201/09781 , H05K2201/10674 , Y02P70/611
摘要： A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconductor chip is provided. The circuit board further includes an auxiliary conductive wiring positioned at an outermost corner of the region for mounting the semiconductor chip, being adjacent to and an outside the outermost conductive wiring, and an auxiliary bump formed on the auxiliary conductive wiring in line with the bumps on the conductive wirings. One end portion of the auxiliary conductive wiring is terminated at a position in the outside vicinity of the auxiliary bump in an outward direction of the region for mounting the semiconductor chip, and the auxiliary conductive wiring is bent at the other end portion positioned inside the auxiliary bump in an inward direction of the region for mounting the semiconductor chip, and connected to an end of the adjacent outermost conductive wiring. A break in the outermost conductive wiring, which is caused by concentrated stress at the time of joining the bumps of the circuit board and electrode pads of the semiconductor chip, can be suppressed.
摘要翻译：提供一种电路板，包括柔性绝缘基板，在柔性绝缘基板上成对排列的多个导电布线，以及设置在位于用于安装半导体芯片的区域中的各个导电布线的端部处的凸块。电路板还包括一个辅助导电布线，其位于用于安装半导体芯片的区域的最外角处，邻近于最外面的导电布线和外部的最外面的导电布线，以及形成在辅助导电布线上的辅助凸起，导电布线。辅助导电布线的一个端部在辅助凸块的外侧附近的位置处终止于用于安装半导体芯片的区域的向外方向上，并且辅助导电布线在位于辅助导体的内部的另一端部处弯曲在用于安装半导体芯片的区域的向内方向上突起，并且连接到相邻的最外面的导电布线的端部。可以抑制在接合电路板的凸块和半导体芯片的电极焊盘时的集中应力引起的最外面的导电布线的断裂。

3. 发明授权

US07294532B2 Method for manufacturing semiconductor device 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US07294532B2
公开(公告)日：2007-11-13
申请号：US11146610
申请日：2005-06-07
申请人： Hiroyuki Imamura , Nobuyuki Koutani
发明人： Hiroyuki Imamura , Nobuyuki Koutani
IPC分类号： H01L21/44
CPC分类号： H01L21/4853 , H01L23/49811 , H01L23/49816 , H01L23/4985 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/3025 , H05K1/111 , H05K3/243 , H05K2201/0367 , H05K2201/09727 , H05K2201/098 , H05K2201/0989 , H05K2201/10674 , Y02P70/611 , H01L2924/00 , H01L2224/05599
摘要： A method for manufacturing a semiconductor device that includes mounting a semiconductor chip on a circuit board having an insulating substrate, a plurality of wiring layers arranged on the insulating substrate, and bumps formed on the wiring layers respectively, in which the bump is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer and contact a surface of the insulating substrate, without a stepped portion formed on a surface of the bump, and a cross sectional shape of the bump taken in a width direction of the wiring layer is such that a central portion is higher than both side portions. The method also includes connecting electrode pads of the semiconductor chip to the bumps, thereby achieving connection between the electrode pads of the semiconductor chip and the wiring layers via the bumps.
摘要翻译：一种半导体器件的制造方法，其包括将半导体芯片安装在具有绝缘基板的电路板上，布置在所述绝缘基板上的多个布线层以及分别形成在所述布线层上的凸块，相对应的一个布线层的纵向方向延伸到布线层的两侧的区域上并与绝缘基板的表面接触，而不形成在凸起的表面上的阶梯部分，并且横截面形状在布线层的宽度方向上取得的隆起部使得中央部高于两侧部。该方法还包括将半导体芯片的电极焊盘连接到凸块，从而通过凸块实现半导体芯片的电极焊盘与布线层之间的连接。

4. 发明申请

US20080173477A1 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same 审中-公开
标题翻译：电路板及其制造方法以及半导体装置及其制造方法
公开(公告)号：US20080173477A1
公开(公告)日：2008-07-24
申请号：US11901371
申请日：2007-09-17
申请人： Hiroyuki Imamura , Nobuyuki Koutani
发明人： Hiroyuki Imamura , Nobuyuki Koutani
IPC分类号： H01L23/48
CPC分类号： H01L21/4853 , H01L23/49811 , H01L23/49816 , H01L23/4985 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/3025 , H05K1/111 , H05K3/243 , H05K2201/0367 , H05K2201/09727 , H05K2201/098 , H05K2201/0989 , H05K2201/10674 , Y02P70/611 , H01L2924/00 , H01L2224/05599
摘要： A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer above the insulating substrate, and a cross sectional shape of the bump taken in the width direction of the wiring layer is such that a central portion is higher than portions on both sides of the central portion. Accordingly, the bumps formed on the wiring layers can be held with strength sufficient for practical use against the force applied in the lateral direction.
摘要翻译：电路板包括薄膜基板，在薄膜基板上依次布置的多个布线层和分别形成在布线层上的凸起。每个凸块跨越相应的一个布线层的纵向方向设置，以便在绝缘基板上方的布线层的两侧的区域上延伸，并且沿宽度方向的凸起的横截面形状布线层的中心部分高于中央部分两侧的部分。因此，形成在布线层上的突起可以抵抗在横向施加的力而实际使用的强度。

5. 发明申请

US20050218496A1 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same 失效
标题翻译：电路板及其制造方法以及半导体装置及其制造方法
公开(公告)号：US20050218496A1
公开(公告)日：2005-10-06
申请号：US11146802
申请日：2005-06-07
申请人： Hiroyuki Imamura , Nobuyuki Koutani
发明人： Hiroyuki Imamura , Nobuyuki Koutani
IPC分类号： H05K3/34 , H01L21/48 , H01L21/60 , H01L23/495 , H01L23/498 , H05K1/02 , H05K1/11 , H05K3/24
CPC分类号： H01L21/4853 , H01L23/49811 , H01L23/49816 , H01L23/4985 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/3025 , H05K1/111 , H05K3/243 , H05K2201/0367 , H05K2201/09727 , H05K2201/098 , H05K2201/0989 , H05K2201/10674 , Y02P70/611 , H01L2924/00 , H01L2224/05599
摘要： A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer above the insulating substrate, and a cross sectional shape of the bump taken in the width direction of the wiring layer is such that a central portion is higher than portions on both sides of the central portion. Accordingly, the bumps formed on the wiring layers can be held with strength sufficient for practical use against the force applied in the lateral direction.
摘要翻译：电路板包括薄膜基板，在薄膜基板上依次布置的多个布线层和分别形成在布线层上的凸起。每个凸块跨越相应的一个布线层的纵向方向设置，以便在绝缘基板上方的布线层的两侧的区域上延伸，并且沿宽度方向的凸起的横截面形状布线层的中心部分高于中央部分两侧的部分。因此，形成在布线层上的突起可以抵抗在横向施加的力而实际使用的强度。

6. 发明授权

US07442074B2 Wiring board and method for producing the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US07442074B2
公开(公告)日：2008-10-28
申请号：US11558706
申请日：2006-11-10
申请人： Nozomi Shimoishizaka , Nobuyuki Koutani , Kouichi Nagao , Michiharu Torii , Yoshifumi Nakamura , Takayuki Tanaka
发明人： Nozomi Shimoishizaka , Nobuyuki Koutani , Kouichi Nagao , Michiharu Torii , Yoshifumi Nakamura , Takayuki Tanaka
IPC分类号： H01R12/24
CPC分类号： H05K3/242 , H01L2924/0002 , H05K3/0097 , H05K2201/094 , H05K2203/1545 , H01L2924/00
摘要： A wiring board includes first and second feeding electrodes (2, 3) provided along both sides of an insulating substrate (1), feeding bus lines (4) extending in a traverse direction and connected to both the feeding electrodes, and conductor wirings (6, 8, 12) having one side terminals forming inner leads having protruding electrodes (9, 11, 13) and the other side terminals connected to the feeding bus lines. The inner leads in each unit region are arranged in two lines extending in the traverse direction. The inner leads of a first group are arranged with a dense wiring pitch, and the inner leads of a second group include a dense pitch region in which a wiring pitch is the same as that of the inner leads of the first group, and a sparse pitch region in which a wiring pitch is longer than that of the inner leads of the first group. The inner leads (6) of the first group and the inner leads (12) in the dense pitch region of the second group are connected to the feeding bus line on one side of each region, and the inner leads (8) in the sparse pitch region of the second group are connected to the feeding bus line on the other side of each unit region. Non-uniformity of heights of the protruding electrodes due to a difference in the wiring pitches of the inner leads can be suppressed easily.
摘要翻译：布线板包括沿着绝缘基板（1）的两侧设置的第一和第二馈送电极（2,3），馈送沿横向方向延伸并连接到馈电电极的总线（4）和导体布线（6），8,12），其一个端子形成具有突出电极（9,11,13）的内部引线，另一个侧端子连接到馈电总线。每个单元区域中的内引线布置成沿横向方向延伸的两条线。第一组的内部引线布置成具有致密的布线间距，并且第二组的内部引线包括密集的间距区域，其中布线间距与第一组的内部引线相同，并且稀疏其中布线间距比第一组的内引线长的间距区域。第一组的内部引线（6）和第二组的密集间隔区域中的内部引线（12）在每个区域的一侧连接到馈电总线，并且内部引线（8）在稀疏第二组的音调区域连接到每个单元区域的另一侧的馈送总线。可以容易地抑制由于内部引线的布线间距的差异导致的突出电极的高度的不均匀性。

7. 发明授权

US07288729B2 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same 失效
公开(公告)号：US07288729B2
公开(公告)日：2007-10-30
申请号：US11146802
申请日：2005-06-07
申请人： Hiroyuki Imamura , Nobuyuki Koutani
发明人： Hiroyuki Imamura , Nobuyuki Koutani
IPC分类号： H01L23/48
CPC分类号： H01L21/4853 , H01L23/49811 , H01L23/49816 , H01L23/4985 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/3025 , H05K1/111 , H05K3/243 , H05K2201/0367 , H05K2201/09727 , H05K2201/098 , H05K2201/0989 , H05K2201/10674 , Y02P70/611 , H01L2924/00 , H01L2224/05599
摘要： A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer above the insulating substrate, and a cross sectional shape of the bump taken in the width direction of the wiring layer is such that a central portion is higher than portions on both sides of the central portion. Accordingly, the bumps formed on the wiring layers can be held with strength sufficient for practical use against the force applied in the lateral direction.

8. 发明申请

US20050218485A1 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same 失效
公开(公告)号：US20050218485A1
公开(公告)日：2005-10-06
申请号：US11146610
申请日：2005-06-07
申请人： Hiroyuki Imamura , Nobuyuki Koutani
发明人： Hiroyuki Imamura , Nobuyuki Koutani
IPC分类号： H05K3/34 , H01L21/48 , H01L21/60 , H01L23/495 , H01L23/498 , H05K1/02 , H05K1/11 , H05K3/24
CPC分类号： H01L21/4853 , H01L23/49811 , H01L23/49816 , H01L23/4985 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/3025 , H05K1/111 , H05K3/243 , H05K2201/0367 , H05K2201/09727 , H05K2201/098 , H05K2201/0989 , H05K2201/10674 , Y02P70/611 , H01L2924/00 , H01L2224/05599
摘要： A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer above the insulating substrate, and a cross sectional shape of the bump taken in the width direction of the wiring layer is such that a central portion is higher than portions on both sides of the central portion. Accordingly, the bumps formed on the wiring layers can be held with strength sufficient for practical use against the force applied in the lateral direction.

9. 发明申请

US20100265665A1 ELECTRONIC DEVICE HAVING A HEAT SINK 审中-公开
标题翻译：具有散热器的电子设备
公开(公告)号：US20100265665A1
公开(公告)日：2010-10-21
申请号：US12760219
申请日：2010-04-14
申请人： Yukihiro Kozaka , Nobuyuki Koutani , Hiroyuki Imamura , Masanori Minamio
发明人： Yukihiro Kozaka , Nobuyuki Koutani , Hiroyuki Imamura , Masanori Minamio
IPC分类号： H05K7/20
CPC分类号： H05K7/20963 , H01L24/01 , H01L2924/01322 , H01L2924/00
摘要： The electronic device includes: a heat sink including a front surface having a concave portion; a heat conductive component placed in the concave portion, in contact with the heat sink; a semiconductor element placed in the concave portion, in contact with the heat conductive component; a flexible base plate electrically connected to the semiconductor element and placed on the surface of the heat sink; and a chassis member having a front surface on which the heat sink is fixed so as to come in contact with the heat sink at the back surface opposite to the front surface.
摘要翻译：电子设备包括：散热器，其包括具有凹部的前表面; 放置在所述凹部中的与所述散热器接触的导热部件; 放置在所述凹部中的与所述导热部件接触的半导体元件; 电连接到半导体元件并放置在散热器的表面上的柔性基板; 以及底板部件，其具有前表面，散热器固定在该前表面上，以便在与前表面相对的后表面与散热器接触。

10. 发明授权

US07285734B2 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same 失效
标题翻译：电路板及其制造方法以及半导体装置及其制造方法
公开(公告)号：US07285734B2
公开(公告)日：2007-10-23
申请号：US10833972
申请日：2004-04-27
申请人： Hiroyuki Imamura , Nobuyuki Koutani
发明人： Hiroyuki Imamura , Nobuyuki Koutani
IPC分类号： H01L23/48
CPC分类号： H01L21/4853 , H01L23/49811 , H01L23/49816 , H01L23/4985 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/3025 , H05K1/111 , H05K3/243 , H05K2201/0367 , H05K2201/09727 , H05K2201/098 , H05K2201/0989 , H05K2201/10674 , Y02P70/611 , H01L2924/00 , H01L2224/05599
摘要： A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer above the insulating substrate, and a cross sectional shape of the bump taken in the width direction of the wiring layer is such that a central portion is higher than portions on both sides of the central portion. Accordingly, the bumps formed on the wiring layers can be held with strength sufficient for practical use against the force applied in the lateral direction.
摘要翻译：电路板包括薄膜基板，在薄膜基板上依次布置的多个布线层和分别形成在布线层上的凸起。每个凸块跨越相应的一个布线层的纵向方向设置，以便在绝缘基板上方的布线层的两侧的区域上延伸，并且沿宽度方向的凸起的横截面形状布线层的中心部分高于中央部分两侧的部分。因此，形成在布线层上的突起可以抵抗在横向施加的力而实际使用的强度。

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