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1. 发明申请

US20070075439A1 CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE 有权
标题翻译：电路板和半导体器件
公开(公告)号：US20070075439A1
公开(公告)日：2007-04-05
申请号：US11534288
申请日：2006-09-22
申请人： Hiroyuki IMAMURA , Nobuyuki KOUTANI , Yoshifumi NAKAMURA , Kenshi TOKUSHIMA
发明人： Hiroyuki IMAMURA , Nobuyuki KOUTANI , Yoshifumi NAKAMURA , Kenshi TOKUSHIMA
IPC分类号： H01L23/48
CPC分类号： H01L23/4985 , H01L23/49811 , H01L23/49838 , H01L2224/05573 , H01L2224/16 , H01L2924/01078 , H05K1/111 , H05K1/189 , H05K2201/0367 , H05K2201/09781 , H05K2201/10674 , Y02P70/611
摘要： A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconductor chip is provided. The circuit board further includes an auxiliary conductive wiring positioned at an outermost corner of the region for mounting the semiconductor chip, being adjacent to and an outside the outermost conductive wiring, and an auxiliary bump formed on the auxiliary conductive wiring in line with the bumps on the conductive wirings. One end portion of the auxiliary conductive wiring is terminated at a position in the outside vicinity of the auxiliary bump in an outward direction of the region for mounting the semiconductor chip, and the auxiliary conductive wiring is bent at the other end portion positioned inside the auxiliary bump in an inward direction of the region for mounting the semiconductor chip, and connected to an end of the adjacent outermost conductive wiring. A break in the outermost conductive wiring, which is caused by concentrated stress at the time of joining the bumps of the circuit board and electrode pads of the semiconductor chip, can be suppressed.
摘要翻译：提供一种电路板，包括柔性绝缘基板，在柔性绝缘基板上成对排列的多个导电布线，以及设置在位于用于安装半导体芯片的区域中的各个导电布线的端部处的凸块。电路板还包括一个辅助导电布线，其位于用于安装半导体芯片的区域的最外角处，邻近于最外面的导电布线和外部的最外面的导电布线，以及形成在辅助导电布线上的辅助凸起，导电布线。辅助导电布线的一个端部在辅助凸块的外侧附近的位置处终止于用于安装半导体芯片的区域的向外方向上，并且辅助导电布线在位于辅助导体的内部的另一端部处弯曲在用于安装半导体芯片的区域的向内方向上突起，并且连接到相邻的最外面的导电布线的端部。可以抑制在接合电路板的凸块和半导体芯片的电极焊盘时的集中应力引起的最外面的导电布线的断裂。

2. 发明申请

US20090020318A1 Circuit board, and semiconductor device 审中-公开
标题翻译：电路板和半导体器件
公开(公告)号：US20090020318A1
公开(公告)日：2009-01-22
申请号：US12283043
申请日：2008-09-09
申请人： Hiroyuki Imamura , Nobuyuki Koutani , Yoshifumi Nakamura , Kenshi Tokushima
发明人： Hiroyuki Imamura , Nobuyuki Koutani , Yoshifumi Nakamura , Kenshi Tokushima
IPC分类号： H05K1/00
CPC分类号： H01L23/4985 , H01L23/49811 , H01L23/49838 , H01L2224/05573 , H01L2224/16 , H01L2924/01078 , H05K1/111 , H05K1/189 , H05K2201/0367 , H05K2201/09781 , H05K2201/10674 , Y02P70/611
摘要： A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconductor chip is provided. The circuit board further includes an auxiliary conductive wiring positioned at an outermost corner of the region for mounting the semiconductor chip, being adjacent to and an outside the outermost conductive wiring, and an auxiliary bump formed on the auxiliary conductive wiring in line with the bumps on the conductive wirings. One end portion of the auxiliary conductive wiring is terminated at a position in the outside vicinity of the auxiliary bump in an outward direction of the region for mounting the semiconductor chip, and the auxiliary conductive wiring is bent at the other end portion positioned inside the auxiliary bump in an inward direction of the region for mounting the semiconductor chip, and connected to an end of the adjacent outermost conductive wiring. A break in the outermost conductive wiring, which is caused by concentrated stress at the time of joining the bumps of the circuit board and electrode pads of the semiconductor chip, can be suppressed.
摘要翻译：提供一种电路板，包括柔性绝缘基板，在柔性绝缘基板上成对排列的多个导电布线，以及设置在位于用于安装半导体芯片的区域中的各个导电布线的端部处的凸块。电路板还包括一个辅助导电布线，其位于用于安装半导体芯片的区域的最外角处，邻近于最外面的导电布线和外部的最外面的导电布线，以及形成在辅助导电布线上的辅助凸起，导电布线。辅助导电布线的一个端部在辅助凸块的外侧附近的位置处终止于用于安装半导体芯片的区域的向外方向上，并且辅助导电布线在位于辅助导体的内部的另一端部处弯曲在用于安装半导体芯片的区域的向内方向上突起，并且连接到相邻的最外面的导电布线的端部。可以抑制在接合电路板的凸块和半导体芯片的电极焊盘时的集中应力引起的最外面的导电布线的断裂。

3. 发明授权

US07439611B2 Circuit board with auxiliary wiring configuration to suppress breakage during bonding process 有权
标题翻译：具有辅助配线配置的电路板，可抑制接合过程中的破损
公开(公告)号：US07439611B2
公开(公告)日：2008-10-21
申请号：US11534288
申请日：2006-09-22
申请人： Hiroyuki Imamura , Nobuyuki Koutani , Yoshifumi Nakamura , Kenshi Tokushima
发明人： Hiroyuki Imamura , Nobuyuki Koutani , Yoshifumi Nakamura , Kenshi Tokushima
IPC分类号： H01L23/495
CPC分类号： H01L23/4985 , H01L23/49811 , H01L23/49838 , H01L2224/05573 , H01L2224/16 , H01L2924/01078 , H05K1/111 , H05K1/189 , H05K2201/0367 , H05K2201/09781 , H05K2201/10674 , Y02P70/611
摘要： A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconductor chip is provided. The circuit board further includes an auxiliary conductive wiring positioned at an outermost corner of the region for mounting the semiconductor chip, being adjacent to and an outside the outermost conductive wiring, and an auxiliary bump formed on the auxiliary conductive wiring in line with the bumps on the conductive wirings. One end portion of the auxiliary conductive wiring is terminated at a position in the outside vicinity of the auxiliary bump in an outward direction of the region for mounting the semiconductor chip, and the auxiliary conductive wiring is bent at the other end portion positioned inside the auxiliary bump in an inward direction of the region for mounting the semiconductor chip, and connected to an end of the adjacent outermost conductive wiring. A break in the outermost conductive wiring, which is caused by concentrated stress at the time of joining the bumps of the circuit board and electrode pads of the semiconductor chip, can be suppressed.
摘要翻译：提供一种电路板，包括柔性绝缘基板，在柔性绝缘基板上成对排列的多个导电布线，以及设置在位于用于安装半导体芯片的区域中的各个导电布线的端部处的凸块。电路板还包括一个辅助导电布线，其位于用于安装半导体芯片的区域的最外角处，邻近于最外面的导电布线和外部的最外面的导电布线，以及形成在辅助导电布线上的辅助凸起，导电布线。辅助导电布线的一个端部在辅助凸块的外侧附近的位置处终止于用于安装半导体芯片的区域的向外方向上，并且辅助导电布线在位于辅助导体的内部的另一端部处弯曲在用于安装半导体芯片的区域的向内方向上突起，并且连接到相邻的最外面的导电布线的端部。可以抑制在接合电路板的凸块和半导体芯片的电极焊盘时的集中应力引起的最外面的导电布线的断裂。

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