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    • 3. 发明授权
    • Electron beam exposure system
    • 电子束曝光系统
    • US4543512A
    • 1985-09-24
    • US309780
    • 1981-10-08
    • Mamoru NakasujiHirotsugu Wada
    • Mamoru NakasujiHirotsugu Wada
    • H01J37/304H01J29/58
    • H01J37/3174B82Y10/00B82Y40/00H01J37/304
    • An electron beam exposure system has first and second apertures through which is passed an electron beam emitted from an electron gun. A rectangular image formed by superposition of the images formed by the first and second apertures is projected onto a target plane through a third aperture by condenser lenses and projection lenses. When a crossover of the electron beam drifts in the direction perpendicular to the axis of the lens system, the current of the electron beam projected on the target plate decreases. The electron beam current is detected by a faraday cup, and the locus of the electron beam is corrected by a coil assembly interposed between the second and third apertures so that the faraday cup may detect the maximum beam current.
    • 电子束曝光系统具有第一和第二孔,通过该孔使从电子枪发射的电子束通过。 通过由第一和第二孔形成的图像叠加形成的矩形图像通过聚光透镜和投影透镜通过第三孔投影到目标平面上。 当电子束的交叉在与透镜系统的轴线垂直的方向上漂移时,投射在靶板上的电子束的电流减小。 电子束电流由法拉第杯检测,电子束的轨迹由介于第二和第三孔之间的线圈组件校正,以便法拉第杯可以检测最大束电流。
    • 4. 发明授权
    • Target body position measuring method for charged particle beam fine
pattern exposure system
    • 带电粒子束精细图案曝光系统的目标体位置测量方法
    • US4558225A
    • 1985-12-10
    • US527486
    • 1983-08-29
    • Mineo GotouRyoichi YoshikawaToru TojoHirotsugu Wada
    • Mineo GotouRyoichi YoshikawaToru TojoHirotsugu Wada
    • G01B15/00H01J37/304H01L21/027H01L21/30G03F9/00
    • H01J37/3045H01L21/30
    • Disclosed is a method for measuring the position of a silicon wafer as a workpiece to be exposed. The method is suitably used in an electron beam exposure system. A wafer has a plurality of chip alignment marks which respectively designate a plurality of chip field areas, included in a dicing line area. When the wafer is contained ion a holder and is fixed in the exposure system, edge portions of the wafer are partially scanned with the electron beam to roughly measure the position of the wafer. In accordance with this wafer position data, a wafer surface portion required for detecting only the marks is defined within the dicing line area. In the mark detection with the electron beam, the electron beam irradiates only the defined wafer surface portion of the wafer surface, thereby providing highly precise measurement of the wafer position and avoiding undesirable irritation of the circuit formation area.
    • 公开了一种用于测量作为待曝光的工件的硅晶片的位置的方法。 该方法适用于电子束曝光系统。 晶片具有分别指定在切割线区域中的多个芯片场区域的多个芯片对准标记。 当晶片被包含在保持器上并固定在曝光系统中时,晶片的边缘部分被电子束部分地扫描以粗略地测量晶片的位置。 根据该晶片位置数据,在切割线区域内限定仅检测标记所需的晶片表面部分。 在用电子束进行的标记检测中,电子束仅照射晶片表面的限定的晶片表面部分,从而提供对晶片位置的高精度测量,并避免对电路形成区域的不期望的刺激。
    • 9. 发明授权
    • Method of evaluating shaped beam of charged beam writer and method of
forming pattern
    • 充电光束写入器的成形光束的评估方法和形成图案的方法
    • US5843603A
    • 1998-12-01
    • US701614
    • 1996-08-22
    • Atsushi AndoHitoshi SunaoshiHirotsugu WadaKazuyoshi Sugihara
    • Atsushi AndoHitoshi SunaoshiHirotsugu WadaKazuyoshi Sugihara
    • G03F7/20H01J37/302H01J37/317G03F9/00
    • B82Y10/00B82Y40/00G03F7/2059H01J37/3026H01J37/3174H01J2237/31776Y10S430/143
    • A method of evaluating a shaped beam generated by a charged beam writer, comprises the steps of: a first step of shaping line beams by dividing into 1/n one side of the shaped beam having a dimension "a" in an x direction and a dimension "b" in a y direction perpendicular to the x direction, where n is the number of divisions; a second step of irradiating the shaped line beam upon a surface of the sample or the movable stage for a constant time or longer; a third step of shaping a beam by adding a bias value .delta. to each line beam width in the divided direction; a fourth step of irradiating the line beam obtained by adding the bias value to the shaped line beam upon a photosensitive substance on the sample surface for a constant time for exposure; a fifth step of repeating the fourth step exposure (n-1) times by shifting the line beam obtained by adding the bias value to the line beam, in the direction that one side of the shaped beam is divided into 1/n, and developing the photosensitive substance, to obtain a pattern width .theta.; a sixth step of repeating the above first to fifth steps by changing the number of divisions n and the bias value .delta.; and a seventh step of obtaining a change rate .DELTA..theta./.DELTA.n of the pattern width .theta. relative to the number of divisions n for each bias value .delta., to obtain an offset drift rate on the basis of the obtained change rate and the bias value. The method can evaluate a beam offset drift rate between the set beam dimension and the actual beam dimension, so that a microscopic pattern can be formed at a high precision.
    • 一种评估由带电光束写入器产生的成形光束的方法,包括以下步骤:通过在x方向上划分成具有尺寸“a”的成形光束的1 / n的一侧来对线束进行成形的第一步骤,以及 尺寸“b”垂直于x方向的方向,其中n是分割数; 将成形线束照射在样品或可移动台的表面上恒定时间或更长的第二步骤; 第三步骤,通过在分割方向上的每个线束宽度上增加偏置值δ来对波束进行成形; 第四步骤,通过将所述成形线束的偏置值加到所述样品表面上的感光物质上以恒定时间曝光而获得的线束; 通过将通过将偏置值添加到线束而获得的线束在成形光束的一侧被划分为1 / n的方向上,并且显影(n-1)倍重复第四步曝光(n-1)次的第五步骤 感光物质,以获得图案宽度θ; 通过改变分割数n和偏差值δ来重复上述第一至第五步骤的第六步骤; 以及第七步骤,针对每个偏差值delta获得相对于分割数n的图案宽度θ的变化率DELTAθ/ DELTA n,以基于获得的变化率和偏置值获得偏移漂移率 。 该方法可以评估设定光束尺寸和实际光束尺寸之间的光束偏移漂移率,从而可以高精度地形成微观图案。
    • 10. 发明授权
    • Aperture stop
    • 孔径停止
    • US4269653A
    • 1981-05-26
    • US91037
    • 1979-11-05
    • Hirotsugu WadaToshiaki Shinozaki
    • Hirotsugu WadaToshiaki Shinozaki
    • C23F1/04C25D1/08G02B5/00H01J37/09H01L21/027B23P15/16
    • G03F1/20C23F1/04C25D1/08G02B5/005H01J37/09
    • A method of manufacturing an aperture stop with a rectangular aperture for an electron beam exposure device, comprising the steps of: preparing a single-crystal silicon substrate with one side having a (100) face; providing a mask on said side of the substrate; selectively etching the substrate through the mask from said side to form a projecting portion of rectangular cross section by anisotropic etching; forming an aperture layer by covering said one side of the etched substrate with a high-melting-point metal having good electric conductivity, thereby surrounding said projecting portion; and forming in said aperture layer a rectangular aperture with a cross section corresponding to the cross section of said projecting portion by removing said substrate from the aperture layer.
    • 一种制造具有用于电子束曝光装置的矩形孔径的孔径光阑的方法,包括以下步骤:制备具有(100)面的一侧的单晶硅衬底; 在所述基板的所述侧面上设置掩模; 通过所述侧面通过所述掩模选择性地蚀刻所述衬底,以通过各向异性蚀刻形成矩形横截面的突出部分; 通过用具有良好导电性的高熔点金属覆盖所述蚀刻的基板的所述一侧来形成开口层,从而包围所述突出部分; 以及通过从所述孔层移除所述基底,在所述孔层中形成具有对应于所述突出部分的横截面的横截面的矩形孔。