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    • 7. 发明授权
    • Highly thermally conductive resin molded article
    • 高导热性树脂成型品
    • US08394489B2
    • 2013-03-12
    • US12922686
    • 2009-02-23
    • Kazuaki MatsumotoYasushi Kakehashi
    • Kazuaki MatsumotoYasushi Kakehashi
    • B32B27/00B29C45/00
    • H01L23/295B29C45/0013B29K2995/0013C08L77/00C09K5/14H01L2924/0002H01L2924/00
    • An object of the present invention is to industrially easily mold a molded article which is excellent in thermal conductivity, electric insulation property, low density, and an injection moldability and has a thermal conduction anisotropy. The present invention relates to a highly thermally conductive resin molded article having a thermal diffusion anisotropy, the highly thermally conductive resin molded article comprising a resin composition, the resin composition containing at least resin (A) and plate-like hexagonal boron nitride powder (B) in a (A)/(B) volume ratio falling within a range of 90/10 to 30/70, the resin (A) including a thermoplastic polyester resin and/or a thermoplastic polyamide resin, the highly thermally conductive resin molded article having a thickness of not more than 1.3 mm in a part of or all over a three-dimensional shape of the highly thermally conductive resin molded article, a thermal diffusivity measured in a plane direction of the highly thermally conductive resin molded article, being (i) two or more times higher than a thermal diffusivity measured in a thickness direction of the highly thermally conductive resin molded article and (ii) not less than 0.5 mm2/sec.
    • 本发明的目的是在工业上容易地模制导热性,电绝缘性,低密度和注模成型性优异并且具有导热各向异性的成型体。 本发明涉及具有热扩散各向异性的高导热性树脂成形体,高导热性树脂成型体含有树脂组合物,该树脂组合物至少含有树脂(A)和板状六方氮化硼粉末(B )的(A)/(B)体积比在90/10〜30/70的范围内,包含热塑性聚酯树脂和/或热塑性聚酰胺树脂的树脂(A),高导热性树脂成型品 在高导热性树脂成型品的三维形状的一部分或全部具有不大于1.3mm的厚度,在高导热性树脂成型体的平面方向上测量的热扩散率为(i )比在高导热性树脂成形体的厚度方向测定的热扩散率高两倍以上,(ii)不小于0.5mm 2 /秒。
    • 10. 发明申请
    • Thermoplastic Resin Composition with High Thermal Conductivity
    • 具有高导热性的热塑性树脂组合物
    • US20080277619A1
    • 2008-11-13
    • US12085389
    • 2006-12-07
    • Kazuaki MatsumotoTatsushi Yoshida
    • Kazuaki MatsumotoTatsushi Yoshida
    • F16L59/00
    • C08L33/04C08K3/22C08K3/28C08L25/06C08L25/16C08L55/02C08L67/00C08L67/02C08L69/00C08L101/00C08L2666/02C08L2666/18
    • There are provided an inorganic compound-containing thermoplastic resin composition that practically retains various properties of a general-purpose resin such as mechanical properties and moldability and has excellent thermal conductivity, and a highly thermally conductive molded article molded using the resin composition.In a polymer alloy comprising a thermoplastic resin excluding a thermoplastic polyester resin, a thermoplastic polyester resin and a highly thermally conductive inorganic compound, the thermoplastic polyester resin forms a continuous phase and the highly thermally conductive inorganic compound is preferentially present in a phase other than the thermoplastic resin excluding a thermoplastic polyester resin. Therefore, the composition and the highly thermally conductive molded article molded using the resin composition can have a thermal conductivity improved only by adding a relatively small amount of the highly thermally conductive inorganic compound.
    • 提供了一种实际上保持诸如机械性能和成型性等通用树脂的各种性能并且具有优异导热性的无机化合物的热塑性树脂组合物,以及使用该树脂组合物模制的高导热性模塑制品。 在包含除了热塑性聚酯树脂,热塑性聚酯树脂和高导热性无机化合物之外的热塑性树脂的聚合物合金中,热塑性聚酯树脂形成连续相,并且高导热性无机化合物优先存在于除 不包括热塑性聚酯树脂的热塑性树脂。 因此,使用该树脂组合物成型的组合物和高导热性成型体只能通过添加相对少量的高导热性无机化合物而具有改善的导热性。