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    • 5. 发明授权
    • Thermoplastic resin with high thermal conductivity
    • 热塑性树脂具有高导热性
    • US08637630B2
    • 2014-01-28
    • US13641939
    • 2011-04-14
    • Shusuke YoshiharaToshiaki EzakiKazuaki Matsumoto
    • Shusuke YoshiharaToshiaki EzakiKazuaki Matsumoto
    • C08G64/00C08G63/02
    • C08G63/20C08G63/193
    • Provided is a thermoplastic resin having excellent thermal conductivity, in which thermoplastic resin a change in number average molecular mass caused by progress of polymerization occurring when the thermoplastic resin material is melted and a change in thermal conductivity caused by the change in number average molecular mass are low. The thermoplastic resin has (A) a specific structure and (B) ends of molecular chains sealed by a monofunctional low molecular weight compound. The resin itself has excellent thermal conductivity. The change in number average molecular mass becomes small during melting of the thermoplastic resin material, so that the change in thermal conductivity of the resin itself becomes small.
    • 本发明提供一种导热性优异的热塑性树脂,其中热塑性树脂在热塑性树脂材料熔融时发生的聚合过程引起的数均分子量的变化和由数均分子量的变化导致的导热率的变化是 低。 热塑性树脂具有(A)特定结构,(B)由单官能低分子量化合物密封的分子链末端。 树脂本身具有优良的导热性。 在热塑性树脂材料的熔融期间,数均分子量的变化变小,因此树脂本身的热导率的变化变小。
    • 7. 发明申请
    • THERMALLY-CONDUCTIVE ORGANIC ADDITIVE, RESIN COMPOSITION, AND CURED PRODUCT
    • 导热有机添加剂,树脂组合物和固化产品
    • US20120175549A1
    • 2012-07-12
    • US13395914
    • 2010-04-26
    • Shusuke YoshiharaKazuaki Matsumoto
    • Shusuke YoshiharaKazuaki Matsumoto
    • C09K5/00C07C69/78C07C291/08C07C69/353
    • C08L67/02C09K5/14C09K19/3804F28F21/06
    • The present invention provides a thermally-conductive organic additive which (i) is an organic polymer, unlike a thermally-conductive inorganic filler such as ceramic, metal and a carbon material, (ii) is capable of imparting thermal conductivity to plastic by being added thereto, (iii) can reduce the weight of a composition even when added to a resin in a large amount, without causing abrasion on molds and deteriorating an electrical insulation property of the composition, and (iv) provides the composition with excellent molding processability. The present thermally-conductive organic additive includes a liquid crystalline thermoplastic resin which has a mainly-chain structure, wherein a main chain of the liquid crystalline thermoplastic resin contains mainly a repeating unit represented by the general formula (1): -M-Sp-  (1) wherein M represents a mesogenic group; and Sp represents a spacer, the liquid crystalline thermoplastic resin itself having thermal conductivity of not less than 0.45 W/(m·K).
    • 本发明提供一种导热性有机添加剂,其与(i)为有机聚合物不同于陶瓷,金属和碳材料等导热性无机填料,(ii)能够通过添加赋予塑料导热性 (iii)即使在大量添加到树脂中也可以降低组合物的重量,而不会造成模具磨损并降低组合物的电绝缘性,(iv)提供具有优异成型加工性的组合物。 本发明的导热性有机添加剂包括具有主链结构的液晶性热塑性树脂,其中液晶热塑性树脂的主链主要包含由通式(1)表示的重复单元:-M-Sp- (1)其中M表示介晶基团; Sp表示间隔物,液晶热塑性树脂本身的导热率不低于0.45W /(m·K)。