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    • 4. 发明申请
    • POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 功率半导体器件及其制造方法
    • US20120061721A1
    • 2012-03-15
    • US13229203
    • 2011-09-09
    • Kiyoshi KIMURAYasuto SUMIHiroshi OHTAHiroyuki IRIFUNE
    • Kiyoshi KIMURAYasuto SUMIHiroshi OHTAHiroyuki IRIFUNE
    • H01L27/082H01L21/331
    • H01L29/0634H01L29/0638H01L29/0696H01L29/0878H01L29/1095H01L29/402H01L29/66712H01L29/7395H01L29/7802H01L29/7811H01L29/872
    • A power semiconductor device includes a first semiconductor layer of a first conductivity type, a first drift layer, and a second drift layer. The first drift layer includes a first epitaxial layer of the first conductivity type, a plurality of first first-conductivity-type pillar layers, and a plurality of first second-conductivity-type pillar layers. The second drift layer is formed on the first drift layer and includes a second epitaxial layer of the first conductivity type, a plurality of second second-conductivity-type pillar layers, a plurality of second first-conductivity-type pillar layers, a plurality of third second-conductivity-type pillar layers, and a plurality of third first-conductivity-type pillar layers. The plurality of second second-conductivity-type pillar layers are connected to the first second-conductivity-type pillar layers. The plurality of second first-conductivity-type pillar layers are connected to the first first-conductivity-type pillar layers. The plurality of third second-conductivity-type pillar layers are arranged on the first epitaxial layer.
    • 功率半导体器件包括第一导电类型的第一半导体层,第一漂移层和第二漂移层。 第一漂移层包括第一导电类型的第一外延层,多个第一第一导电型柱层和多个第一第二导电型柱层。 第二漂移层形成在第一漂移层上,并且包括第一导电类型的第二外延层,多个第二第二导电型柱层,多个第二第一导电型柱层,多个第二导电型柱层 第三第二导电型柱层和多个第三第一导电型柱层。 多个第二第二导电型柱层与第一第二导电型柱层连接。 多个第二第一导电型柱层与第一第一导电型柱层连接。 多个第三第二导电型柱层布置在第一外延层上。
    • 6. 发明申请
    • POWER SEMICONDUCTOR DEVICE
    • 功率半导体器件
    • US20100038712A1
    • 2010-02-18
    • US12540192
    • 2009-08-12
    • Miho WATANABEMasaru IZUMISAWAYasuto SUMIHiroshi OHTAWataru SEKINEWataru SAITOSyotaro ONONana HATANO
    • Miho WATANABEMasaru IZUMISAWAYasuto SUMIHiroshi OHTAWataru SEKINEWataru SAITOSyotaro ONONana HATANO
    • H01L29/78
    • H01L29/7811H01L29/0634H01L29/1095H01L29/7802
    • A semiconductor device according to an embodiment of the present invention includes a device part and a terminal part. The device includes a first semiconductor layer, and second and third semiconductor layers formed on the first semiconductor layer, and alternately arranged along a direction parallel to a surface of the first semiconductor layer, wherein the device part is provided with a first region and a second region, each of which includes at least one of the second semiconductor layers and at least one of the third semiconductor layers, and with regard to a difference value ΔN (=NA−NB) obtained by subtracting an impurity amount NB per unit length of each of the third semiconductor layers from an impurity amount NA per unit length of each of the second semiconductor layers, a difference value ΔNC1 which is the difference value ΔN in the first region of the device part, a difference value ΔNC2 which is the difference value ΔN in the second region of the device part, and a difference value ΔNT which is the difference value ΔN in the terminal part satisfy a relationship of ΔNC1>ΔNT>ΔNC2.
    • 根据本发明实施例的半导体器件包括器件部分和端子部分。 该器件包括第一半导体层,以及形成在第一半导体层上的第二和第三半导体层,并且沿着与第一半导体层的表面平行的方向交替布置,其中器件部分设置有第一区域和第二半导体层 区域,其中每一个包括第二半导体层和至少一个第三半导体层中的至少一个,并且关于通过从每单位长度减去杂质量NB获得的差值Dgr; N(= NA-NB) 从每个第二半导体层的每单位长度的杂质量NA中的每个第三半导体层的差分值&Dgr; NC1,其是器件部分的第一区域中的差值&Dgr; N,差值&Dgr ;作为装置部分的第二区域中的差值Dgr; N的NC2,作为终端部分中的差值Dgr; N的差值&Dgr; NT满足关系 的&Dgr; NC1>&Dgr; NT>&Dgr; NC2。
    • 9. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20110233656A1
    • 2011-09-29
    • US13049634
    • 2011-03-16
    • Hiroshi OHTAYasuto SumiKlyoshi Kimura
    • Hiroshi OHTAYasuto SumiKlyoshi Kimura
    • H01L29/78H01L21/425
    • H01L29/7802H01L29/0634H01L29/0696H01L29/0878H01L29/66712
    • According to one embodiment, a semiconductor device includes a semiconductor layer of a first conductivity type, first semiconductor pillar regions of the first conductivity type and second semiconductor pillar regions of a second conductivity type, a semiconductor region of the first conductivity type, a base region of the second conductivity type, a source region, a first main electrode, a second main electrode and a control electrode. The second semiconductor pillar region includes a plurality of semiconductor regions of the second conductivity type. A difference is provided between peak values of impurity concentration profiles of an uppermost and a lowermost semiconductor regions of the plurality of semiconductor regions, and in the alternately arranging direction of the first and second semiconductor pillar regions, maximum width of the uppermost semiconductor region is generally equal to or narrower than maximum width of the lowermost semiconductor region.
    • 根据一个实施例,半导体器件包括第一导电类型的半导体层,第一导电类型的第一半导体柱区域和第二导电类型的第二半导体柱区域,第一导电类型的半导体区域,基极区域 的第二导电类型,源极区,第一主电极,第二主电极和控制电极。 第二半导体柱区域包括第二导电类型的多个半导体区域。 在多个半导体区域的最上半导体区域和最下半导体区域的杂质浓度分布的峰值之间,在第一和第二半导体柱区域的交替排列方向上,最上半导体区域的最大宽度一般是 等于或窄于最低半导体区域的最大宽度。