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1. 发明授权

US5087658A Heat-resistant resin paste and integrated circuit device produced by using the heat-resistant resin paste 失效
标题翻译：使用耐热树脂生产的耐热树脂胶浆和集成电路设备
公开(公告)号：US5087658A
公开(公告)日：1992-02-11
申请号：US452520
申请日：1989-12-18
申请人： Hiroshi Nishizawa , Kenji Suzuki , Yoshiyuki Mukoyama , Tohru Kikuchi , Hidetaka Sato
发明人： Hiroshi Nishizawa , Kenji Suzuki , Yoshiyuki Mukoyama , Tohru Kikuchi , Hidetaka Sato
IPC分类号： H01B3/30 , H01L23/29 , H01L23/31 , H01L23/498 , H01L23/532 , H05K1/00 , H05K3/28 , H05K3/46
CPC分类号： H01B3/303 , H01L23/293 , H01L23/3135 , H01L23/49894 , H01L23/5329 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L24/48 , H01L2924/00014 , H01L2924/01019 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H05K3/285 , H05K3/4664 , H05K3/4676
摘要： A heat-resistant resin paste consisting essentially of a first organic liquid (A.sub.1), a second organic liquid (A.sub.2), a heat-resistant resin (B) which is soluble in an organic liquid mixture consisting essentially of the first organic liquid (A.sub.1) and the second organic liquid (A.sub.2), and fine particles of a heat-resistant resin (C) which are soluble in the first organic liquid (A.sub.1), but insoluble in the second organic liquid (A.sub.2). The first organic liquid (A.sub.1), the second organic liquid (A.sub.2), and the heat-resistant resin (B) are brought into a solution in which the fine particles of a heat-resistant resin (C) are dispersed. The heat-resistant resin paste may be suitably used for screen process printing to provide integrated circuit devices with insulator layers or surface protecting layers. The heat-resistant resin paste is suitable for forming insulator layers or surface protecting layers in integrated circuit devices by employing screen process printing.

2. 发明授权

US5164816A Integrated circuit device produced with a resin layer produced from a heat-resistant resin paste 失效
标题翻译：由耐热树脂浆料制成的树脂层制成的集成电路装置
公开(公告)号：US5164816A
公开(公告)日：1992-11-17
申请号：US739829
申请日：1991-08-02
申请人： Hiroshi Nishizawa , Kenji Suzuki , Yoshiyuki Mukoyama , Tohru Kikuchi , Hidetaka Sato
发明人： Hiroshi Nishizawa , Kenji Suzuki , Yoshiyuki Mukoyama , Tohru Kikuchi , Hidetaka Sato
IPC分类号： H01B3/30 , H01L23/29 , H01L23/31 , H01L23/498 , H01L23/532 , H05K1/00 , H05K3/28 , H05K3/46
CPC分类号： H01B3/303 , H01L23/293 , H01L23/3135 , H01L23/49894 , H01L23/5329 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01019 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H05K3/285 , H05K3/4664 , H05K3/4676
摘要： An integrated circuit device wherein layer insulation is attained by at least one of (i) an insulator layer interposed between two adjacent conductor layers, and (ii) a surface protecting layer fixedly covering the surface of the semiconductor chip, each of the insulator layer and the surface protecting layer being made of a heat-resistant resin obtainable by heating a heat-resistant resin paste. Said paste consists essentially of a first organic liquid, a second organic liquid, a heat-resistant resin (B) which is soluble in an organic liquid mixture consisting of the first organic liquid and the second organic liquid, and fine particles of a heat-resistant resin (C) which is soluble in the first organic liquid but insoluble in the second organic liquid. The first organic liquid, the second organic liquid and the heat-resistant resin (B) are brought into a solution in which the fine particles of a heat-resistant resin (C) are dispersed.
摘要翻译：一种集成电路器件，其中通过以下中的至少一个获得层间绝缘：（i）插入在两个相邻的导体层之间的绝缘体层，以及（ii）固定地覆盖半导体芯片的表面的表面保护层，绝缘体层和表面保护层由耐热树脂浆料加热得到的耐热树脂制成。所述糊基本上由第一有机液体，第二有机液体，可溶于由第一有机液体和第二有机液体组成的有机液体混合物中的耐热树脂（B）可溶于第一有机液体但不溶于第二有机液体的耐热树脂（C）。将第一有机液体，第二有机液体和耐热性树脂（B）置于分散有耐热性树脂（C）的微粒子的溶液中。

3. 发明授权

US4958001A Dicyclohexyl-3,4,3',4'-tetracarboxylic acid or dianhydride thereof and polyamide-acid and polyimide obtained therefrom 失效
标题翻译：二环己基-3,4,3'，4'-四羧酸或其二酐和由其获得的聚酰胺 - 酸和聚酰亚胺
公开(公告)号：US4958001A
公开(公告)日：1990-09-18
申请号：US252608
申请日：1988-10-03
申请人： Tohru Kikuchi , Toshiyuki Fujita , Takayuki Saito , Mitsumasa Kojima , Hidetaka Sato , Hiroshi Suzuki
发明人： Tohru Kikuchi , Toshiyuki Fujita , Takayuki Saito , Mitsumasa Kojima , Hidetaka Sato , Hiroshi Suzuki
IPC分类号： C07C61/12 , C08G73/10
CPC分类号： C08G73/1021 , C07C61/12 , C08G73/1028 , C08G73/106 , Y10T428/1018 , Y10T428/1023
摘要： A polyimide obtained from a polyamide-acid or polyamide-acid ester prepared by reacting dicyclohexyl-3,4,3', 4'-tetracarboxylic acid or dinanhydride with a diamine is excellent in transparency, heat resistance and mechanical properties, said polyimide being able to be obtained at a lower temperature, and particularly suitable for an orientation film used in a liquid crystal display device.

4. 发明授权

US08594001B2 Packet communication system and its communication method, base station, and mobile station 有权
标题翻译：分组通信系统及其通信方法，基站和移动台
公开(公告)号：US08594001B2
公开(公告)日：2013-11-26
申请号：US11771627
申请日：2007-06-29
申请人： Tohru Kikuchi
发明人： Tohru Kikuchi
IPC分类号： H04B7/00
CPC分类号： H04W72/1231 , H04W64/00
摘要： A packet communication system for packet communication between a base station and plural mobile stations is provided. The system includes: a base station including a reception quality obtaining unit which obtains reception quality of uplink signals or reception quality of downlink signals, location information obtaining unit which obtains location information of a mobile station, a location information data base in which certainty is registered as weighting coefficient, where the certainty of reception quality is obtained from combination of the prescribed location within moving range of a mobile station and propagation environment for the location, and a mobile station selection unit which selects a mobile station intended to transmit or receive signals based on a result of multiplying reception quality obtained by reception quality obtaining unit, by weighting coefficient corresponding to location information of a mobile station which is obtained from the location information data base.
摘要翻译：提供了一种用于基站与多个移动台之间的分组通信的分组通信系统。该系统包括：基站，包括获得上行链路信号的接收质量或下行链路信号的接收质量的接收质量获取单元，获取移动站的位置信息的位置信息获取单元，确定性被登记的位置信息数据库作为加权系数，其中从移动台的移动范围内的规定位置和该位置的传播环境的组合获得接收质量的确定性，以及选择旨在发送或接收信号的移动台的移动台选择单元通过将由接收质量获取单元获得的接收质量相乘的加权系数与从位置信息数据库获得的移动站的位置信息相对应的结果。

5. 发明授权

US5258139A Epoxy resin and adhesive composition containing the same 失效
标题翻译：环氧树脂和含有它的粘合剂组合物
公开(公告)号：US5258139A
公开(公告)日：1993-11-02
申请号：US687639
申请日：1991-04-19
申请人： Nobuo Ichimura , Mitsuo Yamazaki , Kohei Fujita , Hidetaka Satou , Yasuo Miyamoto , Masao Kawasumi , Tohru Kikuchi
发明人： Nobuo Ichimura , Mitsuo Yamazaki , Kohei Fujita , Hidetaka Satou , Yasuo Miyamoto , Masao Kawasumi , Tohru Kikuchi
IPC分类号： C08G59/12 , C08G59/32 , H01B1/22 , H01B1/24 , H01B1/02
CPC分类号： H01B1/22 , C08G59/12 , C08G59/3254 , H01B1/24
摘要： An adhesive composition comprising (a) an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubustituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups and (b) a curing agent is suitable for bonding semiconductor chips to a copper frame with a small warpage of the chips.
摘要翻译：一种粘合剂组合物，其包含（a）通过使1,3-双（二羧基苯基）-1,1,3,3-四取代的二硅氧烷二酐与醇或醇衍生物反应获得的环氧树脂，然后与具有两个或更多的环氧基，或通过使1,3-双（二羧基苯基）-1,1,3,3-四取代二硅氧烷与具有两个或更多个环氧基的环氧化合物反应获得的环氧树脂和（b）固化剂适合于将半导体芯片接合到具有小的翘曲的芯片的铜框架上。

6. 发明申请

US20080242243A1 Transmission Directional Antenna Control System, Base Station, And Transmission Directional Antenna Control Method Used For System And Base Station 审中-公开
标题翻译：传输方向天线控制系统，基站和传输方向天线控制方法用于系统和基站
公开(公告)号：US20080242243A1
公开(公告)日：2008-10-02
申请号：US10586589
申请日：2005-01-18
申请人： Tohru Kikuchi
发明人： Tohru Kikuchi
IPC分类号： H04B7/02
CPC分类号： H04W52/42 , H01Q3/2605 , H04B1/707 , H04B7/0617
摘要： To provide a base station capable of selecting an optimum beam from among transmitted ones of multi-beams. In the arrangement, a beam power determining part (4) determines M received signal powers of multi-beams, and a beam output selecting part (5) selects, based on the information of the received powers from the beam power determining part (4), a beam of the largest power from among M outputs of beam formers (31-3M), and receives the selected beam. A transmission weight generating part (6) selects, based on the received information, a beam corresponding to the signal of a spread code selected by a mobile station and also selects another any beam to notify their respective transmission weighting coefficients. A transmitted beam forming part (7) weights transmitted data corresponding to transmission array antenna elements (91-9N) with the transmission weighting coefficients. Spreaders (81,82) use respective different spread codes to spread input signals, and the transmission array antenna elements (91-9N) send the beam-formed signals.
摘要翻译：提供能够从发射的多波束中选择最佳波束的基站。在该配置中，光束功率决定部（4）确定多光束的M个接收信号功率，光束输出选择部（5）根据来自光束功率决定部（4）的接收功率的信息，，从波束形成器（31-3M）的M个输出中的最大功率的波束，并且接收所选择的波束。发送权重生成部（6）基于接收到的信息，选择与移动台选择的扩频码的信号对应的波束，并且还选择另一个波束来通知各自的发送加权系数。发送波束形成部分（7）用与发送加权系数相对应的传输阵列天线元件（91-9N）加权发送数据。扩展器（81,82）使用各自不同的扩展码来扩展输入信号，并且发送阵列天线元件（91-9N）发送波束形成的信号。

7. 发明授权

US5242917A Tetracarboxylic acid dianhydride having disiloxane linkage and process for producing the same 失效
标题翻译：具有二硅氧烷键的四羧酸二酐及其制造方法
公开(公告)号：US5242917A
公开(公告)日：1993-09-07
申请号：US668170
申请日：1991-03-13
申请人： Tohru Kikuchi , Koichi Kamijima , Takayuki Saito
发明人： Tohru Kikuchi , Koichi Kamijima , Takayuki Saito
IPC分类号： C07F7/08 , C08G59/42
CPC分类号： C08G59/423 , C07F7/0852
摘要： 1-(2,3-Dicarboxyphenyl)-3-(3,4-dicarboxyphenyl)-1,1,3,3-tetramethyldisiloxane dianhydride is useful as a curing agent for epoxy resins.
摘要翻译： 1-（2,3-二羧基苯基）-3-（3,4-二羧基苯基）-1,1,3,3-四甲基二硅氧烷二酐可用作环氧树脂的固化剂。

8. 发明授权

US4912233A Para- or meta-terphenyltetracarboxylic acid, dianhydride thereof and process for preparing the same 失效
标题翻译：对 - 或间三联苯四甲酸，其二酐及其制备方法
公开(公告)号：US4912233A
公开(公告)日：1990-03-27
申请号：US262220
申请日：1988-10-21
申请人： Tohru Kikuchi , Toshiyuki Fujita , Takayuki Saito
发明人： Tohru Kikuchi , Toshiyuki Fujita , Takayuki Saito
IPC分类号： C07C63/331
CPC分类号： C07C63/331
摘要： Disclosed are a para- or meta-terphenyl-3,4,3",4"-tetracarboxylic acid or a dianhydride and a process for preparing the same. The para- or meta-terphenyl-3,4,3",4"-tetracarboxylic acid or a dianhydride thereof according to the present invention is a novel compound which is useful as a raw material for a polyimide having higher heat resistance and so on.
摘要翻译：公开了对 - 或间 - 三联苯-3,4,3'，4“ - 四羧酸或二酐及其制备方法。根据本发明的对 - 或间 - 三联苯-3,4,3'，4“ - 四羧酸或其二酐是一种新型化合物，其可用作具有较高耐热性的聚酰亚胺的原料，所以。

9. 发明授权

US5262277A Photosensitive resin composition and photosensitive element using the same 失效
标题翻译：感光树脂组合物和使用其的感光元件
公开(公告)号：US5262277A
公开(公告)日：1993-11-16
申请号：US824088
申请日：1992-01-22
申请人： Kuniaki Sato , Yasunori Kojima , Shigeo Tachiki , Tohru Kikuchi , Toshiaki Ishimaru , Nobuyuki Hayashi , Mitsumasa Kojima
发明人： Kuniaki Sato , Yasunori Kojima , Shigeo Tachiki , Tohru Kikuchi , Toshiaki Ishimaru , Nobuyuki Hayashi , Mitsumasa Kojima
IPC分类号： C08G69/42 , C08G73/10 , C08G77/54 , G03F7/038 , G03F7/075 , G03C1/725
CPC分类号： G03F7/0387 , C08G69/42 , C08G73/1039 , C08G73/106 , C08G77/54 , G03F7/0757
摘要： A photosensitive resin composition comprising (A) a polymer obtained by reacting an isocyanate compound having an ethylenic unsaturated group with a polymer which is a reaction product of a tetracarboxylic acid dianhydride and a diamine, and (B) a photoinitiator, can provide a thick film excellent in heat resistant, adhesiveness, flexibility, electrical and mechanical properties, and is particularly suitable for producing a photosensitive element.
摘要翻译：一种光敏树脂组合物，其包含（A）通过使具有烯属不饱和基团的异氰酸酯化合物与作为四羧酸二酐与二胺的反应产物的聚合物与（B）光引发剂反应而得到的聚合物，可以提供厚膜耐热性，粘合性，柔韧性，电气和机械性能优异，特别适用于制造光敏元件。

10. 发明授权

US5102962A Phenolic polymer and production thereof 失效
标题翻译：酚醛聚合物及其生产
公开(公告)号：US5102962A
公开(公告)日：1992-04-07
申请号：US499701
申请日：1990-03-27
申请人： Tohru Kikuchi , Hiroyuki Kawakami , Takayuki Saito
发明人： Tohru Kikuchi , Hiroyuki Kawakami , Takayuki Saito
IPC分类号： C07C37/16 , C08G61/02
CPC分类号： C08G61/02 , C07C37/14 , C07C37/16
摘要： A phenolic polymer obtained by reacting a phenolic compound with a bis(hydroxyalkyl)benzene, followed by alkylation of ortho positions or para position with respect to the hydroxyl group of the terminal phenol groups of the produced polymer is suitable for use as a heat resistant antioxidant for thermoplastic resins.
摘要翻译：通过使酚类化合物与双（羟烷基）苯反应，然后相对于所制备的聚合物的末端苯酚基团的羟基进行邻位烷基化或对位而获得的酚醛聚合物适合用作耐热抗氧化剂用于热塑性树脂。

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