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1. 发明申请

US20050003556A1 Probe Beads for affirnity reaction and detection system 审中-公开
标题翻译：探针珠用于感染反应和检测系统
公开(公告)号：US20050003556A1
公开(公告)日：2005-01-06
申请号：US10493017
申请日：2002-10-31
申请人： Hiroshi Nagasawa , Masayoshi Hirose , Akira Fukunaga
发明人： Hiroshi Nagasawa , Masayoshi Hirose , Akira Fukunaga
IPC分类号： G01N33/53 , C12M1/00 , C12N15/09 , C12Q1/68 , G01N33/552 , G01N33/566 , G01N33/543
CPC分类号： C12Q1/6834 , C12Q2563/149
摘要： The present invention discloses affinity reaction probe beads having a structure comprising probe molecules immobilized on porous bead carriers provided with one or more individual identification signals among individual identification signals including optical signals such as digital signals using optical graphics, for example, bar codes or dot matrix bar codes, and color signals based on color information; and radio or electronic signals which issue individual information, such as IC tags, or tuning circuits or oscillation circuits for radio waves or electricity, a method for producing the affinity reaction probe beads, and an analyte detection system using the affinity reaction probe beads. By using the affinity reaction probe beads, the invention provides a reaction detection system which can be utilized for various physiological function diagnoses such as a diagnosis of single-nucleotide polymorphism (SNPs).
摘要翻译：本发明公开了具有包含固定在多孔珠载体上的探针分子的结构的亲和反应探针珠，所述探针分子在包括诸如使用光学图形的数字信号的光信号（例如条形码或点阵）的各个识别信号之间提供一个或多个个体识别信号条形码和基于颜色信息的彩色信号; 发出诸如IC标签的个人信息的无线电或电子信号，或用于无线电波或电的调谐电路或振荡电路，生成亲和反应探针珠的方法和使用亲和反应探针珠的分析物检测系统。通过使用亲和反应探针珠，本发明提供了可用于各种生理功能诊断如单核苷酸多态性（SNP）诊断的反应检测系统。

2. 发明申请

US20050191699A1 Reactive probe chip, composite substrate and method for fabrication of the same 审中-公开
标题翻译：反应性探针芯片，复合基板及其制造方法
公开(公告)号：US20050191699A1
公开(公告)日：2005-09-01
申请号：US11118357
申请日：2005-05-02
申请人： Hiroshi Nagasawa , Akira Fukunaga , Masayoshi Hirose
发明人： Hiroshi Nagasawa , Akira Fukunaga , Masayoshi Hirose
IPC分类号： C12Q1/68 , C40B40/06 , C40B60/14 , G01N33/543 , G01N33/545 , G01N33/552 , C12M1/34
CPC分类号： G01N33/54346 , B01J2219/00317 , B01J2219/00497 , B01J2219/00527 , B01J2219/00585 , B01J2219/0059 , B01J2219/00596 , B01J2219/00605 , B01J2219/00608 , B01J2219/0061 , B01J2219/00612 , B01J2219/00617 , B01J2219/00621 , B01J2219/00626 , B01J2219/0063 , B01J2219/00637 , B01J2219/00641 , B01J2219/00644 , B01J2219/00659 , B01J2219/00722 , C40B40/06 , C40B60/14 , G01N33/545 , G01N33/552
摘要： A reaction probe chip which is prepared by loading a reactive probe on fine pieces of carrier such as particles, tile-like plates and then arraying and immobilizing the reactive probe-loaded carrier on a base material. The carrier fine pieces such as particles, tile-like plates and the like are porous or have a reactive surface, and the base material is preferably a thin inorganic plate or a thin organic plate is disclosed. The inorganic base material is preferably a glass slide or silicon wafer, and the organic base material is preferably a polyester film or polyethylene film. In case the porous carrier pieces are used, the reactivity of the inner surfaces of the porous carrier pores should be maintained during array or immobilization process of the reactive probe-loaded carrier. A composite substrate characterized in that on at least a section of the surface thereof, a plurality of porous regions are orderly arranged as compartments by non-porous regions, or a plurality of non-porous regions are orderly arranged as compartments by porous regions is also disclosed. The porous solid is preferably porous glass or porous ceramic, the porous glass is preferably split-phase porous glass, and the surface is preferably flattened by a process such as polishing.
摘要翻译：反应探针芯片，其通过将反应性探针载载在诸如颗粒，瓦片状平板的细小载体上，然后将反应性探针负载的载体排列并固定在基材上来制备。诸如颗粒，瓦片状板等的载体细片是多孔的或具有反应性表面，并且基材优选为薄的无机板或薄的有机板。无机基材优选为玻璃载玻片或硅晶片，有机基材优选为聚酯膜或聚乙烯膜。在使用多孔载体片的情况下，多孔载体孔的内表面的反应性应保持在反应性探针负载的载体的阵列或固定过程中。一种复合基板，其特征在于，在其表面的至少一部分上，多个多孔区域通过非多孔区域有序地布置为隔室，或者多个非多孔区域通过多孔区域有序地布置为隔室也是披露多孔固体优选为多孔玻璃或多孔陶瓷，多孔玻璃优选为分相多孔玻璃，优选通过抛光等方法使表面变平。

3. 发明授权

US06897021B2 Reactive probe chip, composite substrate and method for fabrication of the same 有权
公开(公告)号：US06897021B2
公开(公告)日：2005-05-24
申请号：US09820778
申请日：2001-03-30
申请人： Hiroshi Nagasawa , Akira Fukunaga , Masayoshi Hirose
发明人： Hiroshi Nagasawa , Akira Fukunaga , Masayoshi Hirose
IPC分类号： C12Q1/68 , C40B40/06 , C40B60/14 , G01N33/543 , G01N33/545 , G01N33/552 , C07H21/04 , G01N33/53
CPC分类号： G01N33/54346 , B01J2219/00317 , B01J2219/00497 , B01J2219/00527 , B01J2219/00585 , B01J2219/0059 , B01J2219/00596 , B01J2219/00605 , B01J2219/00608 , B01J2219/0061 , B01J2219/00612 , B01J2219/00617 , B01J2219/00621 , B01J2219/00626 , B01J2219/0063 , B01J2219/00637 , B01J2219/00641 , B01J2219/00644 , B01J2219/00659 , B01J2219/00722 , C40B40/06 , C40B60/14 , G01N33/545 , G01N33/552
摘要： A reaction probe chip which is prepared by loading a reactive probe on fine pieces of carrier such as particles, tile-like plates and then arraying and immobilizing the reactive probe-loaded carrier on a base material. The carrier fine pieces such as particles, tile-like plates and the like are porous or have a reactive surface, and the base material is preferably a thin inorganic plate or a thin organic plate is disclosed.The inorganic base material is preferably a glass slide or silicon wafer, and the organic base material is preferably a polyester film or polyethylene film. In case the porous carrier pieces are used, the reactivity of the inner surfaces of the porous carrier pores should be maintained during array or immobilization process of the reactive probe-loaded carrier.A composite substrate characterized in that on at least a section of the surface thereof, a plurality of porous regions are orderly arranged as compartments by non-porous regions, or a plurality of non-porous regions are orderly arranged as compartments by porous regions is also disclosed. The porous solid is preferably porous glass or porous ceramic, the porous glass is preferably split-phase porous glass, and the surface is preferably flattened by a process such as polishing.

4. 发明授权

US06972256B2 Method and apparatus for forming thin film of metal 失效
标题翻译：用于形成金属薄膜的方法和装置
公开(公告)号：US06972256B2
公开(公告)日：2005-12-06
申请号：US09890330
申请日：2000-11-29
申请人： Akira Fukunaga , Kuniaki Horie , Naoaki Ogure , Takao Kato , Hiroshi Nagasawa , Shinji Kajita , Makoto Kubota
发明人： Akira Fukunaga , Kuniaki Horie , Naoaki Ogure , Takao Kato , Hiroshi Nagasawa , Shinji Kajita , Makoto Kubota
IPC分类号： C23C18/14 , H01L21/288 , H01L21/768 , H05K3/10 , H01L21/44
CPC分类号： H05K3/105 , C23C18/14 , H01L21/288 , H01L21/76885
摘要： The present invention relates to a method of and an apparatus for forming a thin metal film of copper, silver, or the like on a surface of a semiconductor or another substrate. A method of forming a thin metal film, comprises preparing a dispersed liquid having a metal-containing organic compound dispersed in a predetermined solvent, coating the dispersed liquid on a surface of a substrate and evaporating the solvent to form a coating layer, and applying an energy beam to the coating layer to decompose away an organic substance contained in the coating layer in an area irradiated with the energy beam and bond metal contained in the coating layer.According to the present invention, it is possible to form a thin metal film of good quality efficiently and stably. The thin metal film used as metal interconnects in highly integrated semiconductor circuits contributes to the progress of a process of fabricating semiconductor devices.
摘要翻译：本发明涉及在半导体或其他基板的表面上形成铜，银等薄金属膜的方法和装置。一种形成薄金属膜的方法包括制备分散在预定溶剂中的含金属有机化合物的分散液体，将分散的液体涂布在基材表面上并蒸发溶剂以形成涂层，能量束到涂层，以分解被包含在涂层中的能量束和接合金属的区域中的包覆层中的有机物质。根据本发明，可以形成薄膜金属膜高质量，高稳定地品质。在高度集成的半导体电路中用作金属互连的金属薄膜有助于制造半导体器件的工艺的进展。

5. 发明授权

US06709555B1 Plating method, interconnection forming method, and apparatus for carrying out those methods 失效
标题翻译：电镀方法，互连形成方法以及用于实施这些方法的装置
公开(公告)号：US06709555B1
公开(公告)日：2004-03-23
申请号：US09868524
申请日：2001-06-19
申请人： Naoaki Ogure , Akira Fukunaga , Hiroshi Nagasawa
发明人： Naoaki Ogure , Akira Fukunaga , Hiroshi Nagasawa
IPC分类号： C25D1700
CPC分类号： H01L21/76843 , C23C18/06 , C23C18/08 , C23C18/1653 , H01L21/288 , H01L21/67034 , H01L21/67103 , H01L21/67109 , H01L21/6715 , H01L21/76873 , H01L21/76877 , H01L23/53238 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a plating method for use in forming a liner for plating in a conductor-embedding fine recess that is defined in a surface of a semiconductor substrate, and an interconnection forming method for use in forming an interconnection using such a liner, and characterized by reducing an organic metal compound in a nonaqueous solvent to plate a surface of a base material with metal. The plating method can easily be used similarly to an aqueous electroless plating process and is capable of forming a defect-free sound metal plated layer on the surface of a substrate which has a fine recess or the like for embedding a conductor therein, and the interconnection forming method is capable of forming an embedded interconnection that comprises a defect-free sound electric conductor in a fine recess.
摘要翻译：本发明涉及一种用于形成在半导体衬底的表面中限定的导体嵌入微细凹槽中的电镀衬层的电镀方法，以及用于使用这种衬垫形成互连的互连形成方法，其特征在于，在非水溶剂中还原有机金属化合物，用金属对基材的表面进行平版化。电镀方法可以容易地与含水化学镀方法相同地使用，并且能够在具有用于将导体嵌入其中的细凹槽等的基板的表面上形成无缺陷的金属电镀层，并且互连形成方法能够在细凹槽中形成包括无缺陷声导体的嵌入式互连。

6. 发明授权

US07179503B2 Method of forming thin metal films on substrates 失效
标题翻译：在基材上形成薄金属薄膜的方法
公开(公告)号：US07179503B2
公开(公告)日：2007-02-20
申请号：US10464551
申请日：2003-06-19
申请人： Akira Fukunaga , Hiroshi Nagasawa , Takao Kato
发明人： Akira Fukunaga , Hiroshi Nagasawa , Takao Kato
IPC分类号： B05D5/12 , B05D3/02
CPC分类号： B22F1/0022 , B22F1/0014 , B22F1/0018 , B22F1/0059 , B22F1/0062 , B22F2998/00 , B82Y30/00 , C23C4/123 , C23C24/08 , C23C26/00 , H01L21/288 , H01L21/6715 , H01L21/76877 , H01L21/76882 , H01L23/53228 , H01L23/53238 , H01L23/5328 , H01L2924/0002 , H01L2924/00
摘要： A solution containing a metal component of composite ultrafine metal particles each having a core substantially made of metal component and a covering layer made of an organic compound chemically bonded to the core having an average diameter ranging from 1 to 10 nm, uniformly dispersed in a solvent, forms a thin metal film on the surface of a transfer sheet, after which the transfer sheet, after which the transfer sheet is thermally decomposed to transfer the thin metal film to a substrate.
摘要翻译：包含复合超细金属颗粒的金属组分的溶液，每个金属组分均具有基本上由金属组分制成的芯和由化学键合到具有1-10nm平均直径的芯的有机化合物制成的覆盖层，均匀分散在溶剂中在转印片的表面上形成薄金属膜，然后转印片材，然后转印片材被热分解以将薄金属膜转印到基底上。

7. 发明授权

US06730596B1 Method of and apparatus for forming interconnection 失效
标题翻译：形成互连的方法和装置
公开(公告)号：US06730596B1
公开(公告)日：2004-05-04
申请号：US09868140
申请日：2001-06-15
申请人： Akira Fukunaga , Kuniaki Horie , Naoaki Ogure , Takao Kato , Akihisa Hongo , Hiroshi Nagasawa
发明人： Akira Fukunaga , Kuniaki Horie , Naoaki Ogure , Takao Kato , Akihisa Hongo , Hiroshi Nagasawa
IPC分类号： H01L214763
CPC分类号： H05K3/4061 , B05C11/08 , C23C18/02 , C23C18/08 , H01L21/288 , H01L21/6715 , H01L21/76877 , H01L23/53238 , H01L2924/0002 , H05K1/0306 , H05K3/045 , H05K3/102 , H05K2201/0257 , H01L2924/00
摘要： The present invention relates particularly to a method of and an apparatus for forming a fine interconnection in a highly integrated circuit formed on a semiconductor substrate. The method has the steps of preparing a substrate having fine recesses formed in a surface thereof, dispersing ultrafine particles made at least partly of a metal in a predetermined solvent, producing an ultrafine particle dispersed liquid, supplying the ultrafine particle dispersed liquid to the fine recesses of the substrate, heating the substrate to melt and bond the metal, and chemical mechanical polishing the surface of the substrate to remove an excessively attached metal therefrom. According to the present invention, it is possible to stably deposit an interconnection metal of good quality using an inexpensive material.
摘要翻译：本发明尤其涉及形成在半导体衬底上的高度集成电路中形成精细互连的方法和装置。该方法具有如下步骤：制备在其表面形成有微细凹槽的基材，将至少部分由金属制成的超微粒子分散在预定溶剂中，制备超细颗粒分散液体，将超细颗粒分散液体供应到细小凹槽加热衬底以熔融和粘合金属，并化学机械抛光衬底的表面以从中除去过量附着的金属。根据本发明，可以使用便宜的材料稳定地沉积质量好的互连金属。

8. 发明授权

US06743395B2 Composite metallic ultrafine particles and process for producing the same 失效
公开(公告)号：US06743395B2
公开(公告)日：2004-06-01
申请号：US09811581
申请日：2001-03-20
申请人： Akira Fukunaga , Hiroshi Nagasawa , Kaori Kagoshima , Makiko Emoto
发明人： Akira Fukunaga , Hiroshi Nagasawa , Kaori Kagoshima , Makiko Emoto
IPC分类号： C22C3200
CPC分类号： H01L21/67167 , B01J13/0043 , B22F1/0018 , B22F1/0059 , B22F1/0062 , B22F9/24 , B22F2998/00 , B82Y30/00 , H01L21/02074 , H01L21/02087 , H01L21/0209 , H01L21/288 , H01L21/3212 , H01L21/67034 , H01L21/67051 , H01L21/6715 , H01L21/67161 , H01L21/67173 , H01L21/67219 , H01L21/76877 , H05K3/102 , Y10T428/2998
摘要： The present invention relates to composite metallic ultrafine particles which have excellent dispersion stability and can be produced on an industrial scale, and a process for producing the same, and a method and an apparatus for forming an interconnection with use of the same. A surface of a core metal produced from a metallic salt, a metallic oxide, or a metallic hydroxide and having a particle diameter of 1 to 100 nm is covered with an organic compound including a functional group having chemisorption capability onto the surface of the core metal.

9. 发明授权

US06740242B2 Plating apparatus and method of managing plating liquid composition 失效
标题翻译：电镀液组成的电镀装置和方法
公开(公告)号：US06740242B2
公开(公告)日：2004-05-25
申请号：US09994755
申请日：2001-11-28
申请人： Akira Fukunaga , Hiroshi Nagasawa
发明人： Akira Fukunaga , Hiroshi Nagasawa
IPC分类号： B01D1508
CPC分类号： C25D21/14 , C25D7/123 , C25D17/001 , C25D21/12 , G01N30/461 , B01D15/34 , B01D15/327
摘要： A plating apparatus comprises a plating unit having a plating bath for holding a plating liquid therein, and a planting monitoring unit having a liquid chromatography device and an arithmetical unit. The liquid chromatography device serves to separate and quantify an additive in a sample of the planting liquid. The arithmetical unit serves to compare a quantified value of the additive with a given concentration predetermined for the additive and to produce an output signal representing the compare result. The plating apparatus further comprises an additive replenishing unit for adding a solution including the additive from an additive tank to the plating liquid in the planting bath based on the output signal from the arithmetical unit in the plating liquid monitoring unit.
摘要翻译：电镀装置包括具有用于保持电镀液的电镀液的电镀单元，以及具有液相色谱装置和算术单元的种植监视单元。液相色谱装置用于分离和定量种植液样品中的添加剂。算术单元用于将添加剂的量化值与为添加剂预定的给定浓度进行比较，并产生表示比较结果的输出信号。电镀装置还包括添加剂补充单元，其基于来自电镀液监测单元中的算术单元的输出信号，将来自添加剂槽的添加剂的溶液与种植槽中的电镀液相加。

10. 发明申请

US20070141251A1 Method of forming thin metal films on substrates 审中-公开
标题翻译：在基材上形成薄金属薄膜的方法
公开(公告)号：US20070141251A1
公开(公告)日：2007-06-21
申请号：US11707122
申请日：2007-02-16
申请人： Akira Fukunaga , Hiroshi Nagasawa , Takao Kato
发明人： Akira Fukunaga , Hiroshi Nagasawa , Takao Kato
IPC分类号： B05D3/02
CPC分类号： B22F1/0022 , B22F1/0014 , B22F1/0018 , B22F1/0059 , B22F1/0062 , B22F2998/00 , B82Y30/00 , C23C4/123 , C23C24/08 , C23C26/00 , H01L21/288 , H01L21/6715 , H01L21/76877 , H01L21/76882 , H01L23/53228 , H01L23/53238 , H01L23/5328 , H01L2924/0002 , H01L2924/00
摘要： A solution containing a metal component of composite ultrafine metal particles each having a core substantially made of metal component and a covering layer made of an organic compound chemically bonded to the core having an average diameter ranging from 1 to 10 nm, uniformly dispersed in a solvent, forms a thin metal film on the surface of a transfer sheet, after which the transfer sheet is thermally decomposed to transfer the thin metal film to a substrate.
摘要翻译：包含复合超细金属颗粒的金属组分的溶液，每个金属组分均具有基本上由金属组分制成的芯和由化学键合到具有1-10nm平均直径的芯的有机化合物制成的覆盖层，均匀分散在溶剂中在转印片的表面上形成薄金属膜，然后将转印片热分解，将薄金属膜转印到基板上。

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