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1. 发明申请

US20060030076A1 Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：US20060030076A1
公开(公告)日：2006-02-09
申请号：US11246267
申请日：2005-10-11
申请人： Hiroshi Kobayashi , Naoki Ishikawa , Kenji Kobae , Hidehiko Kira , Norio Kainuma , Shuichi Takeuchi , Takayoshi Matsumura
发明人： Hiroshi Kobayashi , Naoki Ishikawa , Kenji Kobae , Hidehiko Kira , Norio Kainuma , Shuichi Takeuchi , Takayoshi Matsumura
IPC分类号： H01L21/48 , H01L21/44 , H01L21/50
CPC分类号： H01L24/29 , H01L21/563 , H01L24/11 , H01L24/13 , H01L2224/05568 , H01L2224/05573 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13139 , H01L2224/13147 , H01L2224/13644 , H01L2224/13664 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/83192 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2224/13099 , H01L2924/00 , H01L2224/05599
摘要： The semiconductor device of the present invention is capable of restricting alloying metals and improving electrical connection between a semiconductor chip and a mount board. The semiconductor device comprises: the semiconductor chip having terminal sections; and bumps for electrical connection, the bumps being formed at the terminal sections. Each of the bumps is made of a two-layer wire, which includes a core member and a jacket member, and formed by a stud bump bonding process.
摘要翻译：本发明的半导体器件能够限制合金化金属和改善半导体芯片和安装基板之间的电连接。半导体器件包括：具有端子部分的半导体芯片; 以及用于电连接的凸块，在端子部分处形成凸点。每个凸块由包括芯构件和护套构件的双层线制成，并且通过柱凸块接合工艺形成。

2. 发明授权

US06458237B1 Mounting method of semiconductor device 失效
标题翻译：半导体器件的安装方法
公开(公告)号：US06458237B1
公开(公告)日：2002-10-01
申请号：US09045115
申请日：1998-03-20
申请人： Kazuhisa Tsunoi , Hidehiko Kira , Shunji Baba , Akira Fujii , Toshihiro Kusagaya , Kenji Kobae , Norio Kainuma , Naoki Ishikawa , Satoshi Emoto
发明人： Kazuhisa Tsunoi , Hidehiko Kira , Shunji Baba , Akira Fujii , Toshihiro Kusagaya , Kenji Kobae , Norio Kainuma , Naoki Ishikawa , Satoshi Emoto
IPC分类号： B32B700
CPC分类号： H01L24/81 , H01L21/563 , H01L24/11 , H01L24/29 , H01L24/75 , H01L2224/1134 , H01L2224/11822 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/81001 , H01L2224/81203 , H01L2224/81801 , H01L2224/83101 , H01L2224/83192 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01079 , H01L2924/07802 , H01L2924/07811 , H01L2924/00
摘要： A method of mounting a semiconductor device having bumps on a board having pads so that each of the bumps is joined to a corresponding one of the pads is provided. Adhesive to be hardened by heat is provided between the semiconductor device and the board. The method includes the steps of pressing the bumps of the semiconductor device on the pads of the board, and heating a portion in which each of the bumps and a corresponding one of the pads are in contact with each other. A pressure of the bumps to the pads reaches a predetermined value before a temperature of the adhesive to which heat is supplied in the above step reaches a temperature at which the adhesive is hardened.
摘要翻译：提供了一种将具有凸块的半导体器件安装在具有焊盘的板上，使得每个凸起接合到相应的一个焊盘的方法。在半导体器件和电路板之间提供通过加热硬化的粘合剂。该方法包括以下步骤：将半导体器件的凸起按压在板的焊盘上，并且加热其中每个凸块和相应的一个焊盘彼此接触的部分。在上述步骤中供应热量的粘合剂的温度达到粘合剂硬化的温度之前，焊盘的凸块的压力达到预定值。

3. 发明授权

US06240634B1 Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board 有权
标题翻译：一种多芯片封装模块的制造方法，其中将粗间距和细间距芯片安装在板上
公开(公告)号：US06240634B1
公开(公告)日：2001-06-05
申请号：US09460727
申请日：1999-12-14
申请人： Hidehiko Kira , Kenji Kobae , Norio Kainuma , Naoki Ishikawa , Satoshi Emoto
发明人： Hidehiko Kira , Kenji Kobae , Norio Kainuma , Naoki Ishikawa , Satoshi Emoto
IPC分类号： H05K330
CPC分类号： H01L24/83 , H01L21/563 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/75 , H01L24/81 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/743 , H01L2224/75 , H01L2224/75252 , H01L2224/75743 , H01L2224/75745 , H01L2224/81191 , H01L2224/81801 , H01L2224/83192 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , Y10T29/4913 , Y10T29/49137 , Y10T29/49144 , Y10T29/53178 , H01L2924/00
摘要： In a method of production of a multichip package module, rough-pitch bare chips are positioned at first locations on a printed-circuit board, and the rough-pitch bare chips are temporarily attached to the board at the first locations. The rough-pitch bare chips are mounted on the board at the same time by applying heat and pressure to the rough-pitch bare chips simultaneously. A respective one of fine-pitch bare chips is positioned at a respective one of second locations on the board other than the first locations, and the respective one of the fine-pitch bare chips is mounted on the board by applying heat and pressure to the fine-pitch bare chips individually, in order to produce the multichip package module.
摘要翻译：在制造多芯片封装模块的方法中，将粗间距裸芯片定位在印刷电路板上的第一位置处，并且在第一位置将粗糙间距裸芯片暂时附接到板上。通过同时向粗糙的裸芯片施加热量和压力，同时将粗糙的裸芯片安装在板上。微细间距裸芯片中的相应一个位于除了第一位置之外的板上的第二位置中的相应一个处，并且通过向第一位置施加热和压力将精细间距裸芯片中的相应一个安装在板上单芯片的裸芯片，以生产多芯片封装模块。

4. 发明授权

US6122823A Apparatus to produce a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board 有权
标题翻译：一种用于制造多芯片封装模块的装置，其中将粗间距和细间距芯片安装在板上
公开(公告)号：US6122823A
公开(公告)日：2000-09-26
申请号：US401985
申请日：1999-09-23
申请人： Hidehiko Kira , Kenji Kobae , Norio Kainuma , Naoki Ishikawa , Satoshi Emoto
发明人： Hidehiko Kira , Kenji Kobae , Norio Kainuma , Naoki Ishikawa , Satoshi Emoto
IPC分类号： H01L21/56 , H01L21/58 , H01L21/60 , H01L21/603 , H01L25/04 , H01L25/18 , H05K3/34
CPC分类号： H01L24/83 , H01L21/563 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/75 , H01L24/81 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/743 , H01L2224/75 , H01L2224/75252 , H01L2224/75743 , H01L2224/75745 , H01L2224/81191 , H01L2224/81801 , H01L2224/83192 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , Y10T29/4913 , Y10T29/49137 , Y10T29/49144 , Y10T29/53178
摘要： In a method of production of a multichip package module, rough-pitch bare chips are positioned at first locations on a printed-circuit board, and the rough-pitch bare chips are temporarily attached to the board at the first locations. The rough-pitch bare chips are mounted on the board at the same time by applying heat and pressure to the rough-pitch bare chips simultaneously. A respective one of fine-pitch bare chips is positioned at a respective one of second locations on the board other than the first locations, and the respective one of the fine-pitch bare chips is mounted on the board by applying heat and pressure to the fine-pitch bare chips individually, in order to produce the multichip package module.
摘要翻译：在制造多芯片封装模块的方法中，将粗间距裸芯片定位在印刷电路板上的第一位置处，并且在第一位置将粗糙间距裸芯片临时附接到板上。通过同时向粗糙的裸芯片施加热量和压力，同时将粗糙的裸芯片安装在板上。微细间距裸芯片中的相应一个位于除了第一位置之外的板上的第二位置中的相应一个处，并且通过向第一位置施加热和压力将精细间距裸芯片中的相应一个安装在板上单芯片的裸芯片，以生产多芯片封装模块。

5. 发明授权

US6006426A Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board 失效
标题翻译：一种多芯片封装模块的制造方法，其中将粗间距和细间距芯片安装在板上
公开(公告)号：US6006426A
公开(公告)日：1999-12-28
申请号：US26490
申请日：1998-02-19
申请人： Hidehiko Kira , Kenji Kobae , Norio Kainuma , Naoki Ishikawa , Satoshi Emoto
发明人： Hidehiko Kira , Kenji Kobae , Norio Kainuma , Naoki Ishikawa , Satoshi Emoto
IPC分类号： H01L21/56 , H01L21/58 , H01L21/60 , H01L21/603 , H01L25/04 , H01L25/18 , H05K3/30
CPC分类号： H01L24/83 , H01L21/563 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/75 , H01L24/81 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/743 , H01L2224/75 , H01L2224/75252 , H01L2224/75743 , H01L2224/75745 , H01L2224/81191 , H01L2224/81801 , H01L2224/83192 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , Y10T29/4913 , Y10T29/49137 , Y10T29/49144 , Y10T29/53178
摘要： In a method of production of a multichip package module, rough-pitch bare chips are positioned at first locations on a printed-circuit board, and the rough-pitch bare chips are temporarily attached to the board at the first locations. The rough-pitch bare chips are mounted on the board at the same time by applying heat and pressure to the rough-pitch bare chips simultaneously. A respective one of fine-pitch bare chips is positioned at a respective one of second locations on the board other than the first locations, and the respective one of the fine-pitch bare chips is mounted on the board by applying heat and pressure to the fine-pitch bare chips individually, in order to produce the multichip package module.
摘要翻译：在制造多芯片封装模块的方法中，将粗间距裸芯片定位在印刷电路板上的第一位置处，并且在第一位置将粗糙间距裸芯片临时附接到板上。通过同时向粗糙的裸芯片施加热量和压力，同时将粗糙的裸芯片安装在板上。微细间距裸芯片中的相应一个位于除了第一位置之外的板上的第二位置中的相应一个处，并且通过向第一位置施加热和压力将精细间距裸芯片中的相应一个安装在板上单芯片的裸芯片，以生产多芯片封装模块。

6. 发明授权

US06787925B2 Mounting method of semiconductor device 有权
标题翻译：半导体器件的安装方法
公开(公告)号：US06787925B2
公开(公告)日：2004-09-07
申请号：US09805559
申请日：2001-03-14
申请人： Kazuhisa Tsunoi , Hidehiko Kira , Shunji Baba , Akira Fujii , Toshihiro Kusagaya , Kenji Kobae , Norio Kainuma , Naoki Ishikawa , Satoshi Emoto
发明人： Kazuhisa Tsunoi , Hidehiko Kira , Shunji Baba , Akira Fujii , Toshihiro Kusagaya , Kenji Kobae , Norio Kainuma , Naoki Ishikawa , Satoshi Emoto
IPC分类号： H01L2348
CPC分类号： H01L24/81 , H01L21/563 , H01L24/11 , H01L24/29 , H01L24/75 , H01L2224/1134 , H01L2224/11822 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/81001 , H01L2224/81203 , H01L2224/81801 , H01L2224/83101 , H01L2224/83192 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01079 , H01L2924/07802 , H01L2924/07811 , H01L2924/00
摘要： A method of mounting a semiconductor device having bumps on a board having pads so that each of the bumps is joined to a corresponding one of the pads is provided. Adhesive to be hardened by heat is provided between the semiconductor device and the board. The method includes the steps of pressing the bumps of the semiconductor device on the pads of the board, and heating a portion in which each of the bumps and a corresponding one of the pads are in contact with each other. A pressure of the bumps to the pads reaches a predetermined value before a temperature of the adhesive to which heat is supplied in the above step reaches a temperature at which the adhesive is hardened.
摘要翻译：提供了一种将具有凸块的半导体器件安装在具有焊盘的板上，使得每个凸起接合到相应的一个焊盘的方法。在半导体器件和电路板之间提供通过加热硬化的粘合剂。该方法包括以下步骤：将半导体器件的凸起按压在板的焊盘上，并且加热其中每个凸块和相应的一个焊盘彼此接触的部分。在上述步骤中供应热量的粘合剂的温度达到粘合剂硬化的温度之前，焊盘的凸块的压力达到预定值。

7. 发明授权

US07581309B2 Method of assembling a carriage assembly 失效
标题翻译：组装滑架组件的方法
公开(公告)号：US07581309B2
公开(公告)日：2009-09-01
申请号：US11375210
申请日：2006-03-15
申请人： Takayoshi Matsumura , Naoki Ishikawa , Hiroshi Kobayashi , Yasuo Moriya , Hidehiko Kira
发明人： Takayoshi Matsumura , Naoki Ishikawa , Hiroshi Kobayashi , Yasuo Moriya , Hidehiko Kira
IPC分类号： G11B5/48 , B23P11/00
CPC分类号： G11B5/4813 , Y10T29/49025 , Y10T29/49027 , Y10T29/49915 , Y10T29/49934 , Y10T29/49938 , Y10T29/53165
摘要： A method of assembling a carriage assembly is capable of suppressing deformation of spacer portions when suspensions are attached to carriage arms. The method of assembling a carriage assembly aligns fitting holes provided in front end portions of carriage arms and spacer holes provided in spacer portions of suspensions and places the suspensions onto the carriage arms, and then presses a ball with a diameter equal to or greater than an inner diameter of the spacer holes with a pressure-applying member to pass the ball through the spacer holes, thereby crimping spacer hole edge portions of the spacer portions and attaching the suspensions to the front end portions of the carriage arms. By applying ultrasonic vibration from two axial directions to the pressure-applying member, the pressure-applying member is caused to vibrate on a two-dimensional movement path on a predetermined plane and passes the ball through the spacer holes while causing the ball to rotate.
摘要翻译：一种组装滑架组件的方法能够在将悬架连接到滑架臂时抑制间隔部分的变形。组装滑架组件的方法将设置在滑架臂的前端部分的设置孔和设置在悬架的间隔部分中的间隔孔对准，并将悬架放置在滑架臂上，然后将直径等于或大于具有加压构件的间隔孔的内径使球通过间隔孔，由此压接间隔件部分的间隔孔边缘部分并将悬架附接到托架臂的前端部。通过将两个轴向的超声波振动施加到施加压力的构件，使压力施加构件在预定平面上的二维运动路径上振动，并使球通过间隔孔，同时使球旋转。

8. 发明申请

US20070186410A1 Method of assembling a carriage assembly 失效
标题翻译：组装滑架组件的方法
公开(公告)号：US20070186410A1
公开(公告)日：2007-08-16
申请号：US11442935
申请日：2006-05-30
申请人： Naoki Ishikawa , Hidehiko Kira , Hiroshi Kobayashi , Takayoshi Matsumura
发明人： Naoki Ishikawa , Hidehiko Kira , Hiroshi Kobayashi , Takayoshi Matsumura
IPC分类号： G11B5/48
CPC分类号： G11B5/4833 , Y10T29/49025 , Y10T29/49027 , Y10T29/4903 , Y10T29/49032
摘要： When crimping suspensions to carriage arms using a metal ball by applying ultrasonic vibration to a crimping tool, the suspensions can be crimped to the carriage arms without causing deformation to the suspensions and the like. A method of assembling a carriage assembly aligns attachment holes provided in front ends of carriage arms and crimping portions provided on suspensions to set the suspensions on the carriage arms and then presses a ball through crimping holes provided in the crimping portions while applying ultrasonic vibration to the crimping tool to crimp the suspensions to the carriage arms. When doing so, a ball, such as a ball whose surface has been subjected to a dimpling process, for which a load that acts on the ball when the ball passes through the crimping holes is low compared to a spherical ball is used to crimp the suspensions to the carriage arms.
摘要翻译：当通过对压接工具施加超声波振动将金属球通过金属球压接到支架臂上时，可以将悬架卷曲到托架臂而不会使悬架等变形。组装滑架组件的方法将设置在滑架臂的前端的设置孔和设置在悬架上的压接部对准，以将悬架设置在滑架臂上，然后通过设置在压接部分中的压接孔将球压入同时向超声波振动施加超声波振动压接工具将悬架压接到托架臂上。当这样做时，使用诸如球表面已经进行了凹坑处理的球，当球通过压接孔时作用在球上的负载与球形球相比较低，悬挂在托架臂上。

9. 发明申请

US20070126104A1 Method of assembling a carriage assembly and assembling apparatus 失效
标题翻译：组装支架组件和组装装置的方法
公开(公告)号：US20070126104A1
公开(公告)日：2007-06-07
申请号：US11363199
申请日：2006-02-28
申请人： Takayoshi Matsumura , Naoki Ishikawa , Hiroshi Kobayashi , Hidehiko Kira
发明人： Takayoshi Matsumura , Naoki Ishikawa , Hiroshi Kobayashi , Hidehiko Kira
IPC分类号： H01L23/02
CPC分类号： G11B5/5569 , Y10T29/49025 , Y10T29/49027 , Y10T29/4903 , Y10T29/49032
摘要： A method of assembling a carriage assembly and an assembling apparatus that uses the same are capable of suppressing fluctuation in the crimped (deformed) states of spacer portions when suspensions are attached to carriage arms. The method of assembling a carriage assembly aligns fitting holes 10a provided in carriage arms 10 with spacer holes 12b of suspensions 12 and then passes a ball 20 with a diameter equal to or greater than an inner diameter of the spacer holes 12b through the spacer holes 12b to crimp edge portions of the spacer holes 12b in spacer portions 12a and thereby attach the suspensions 12 to the carriage arms 10. While the ball 20 is being pressed and sandwiched from both sides of the spacer holes 12b by two pressure-applying members 40a, 40b and ultrasonic vibration is applied to the two pressure-applying members 40a, 40b, the two pressure applying members 40a, 40b are moved so as to pass the ball 20 through the spacer holes 12b.
摘要翻译：组装滑架组件的方法和使用该组件的组装装置能够抑制当悬架被附接到滑架臂时间隔部分的卷曲（变形）状态的波动。组装滑架组件的方法将设置在托架臂10中的装配孔10a与悬架12的间隔孔12b对齐，然后将直径等于或大于间隔孔12b的内径的球20通过间隔孔12b将间隔孔12b的边缘部分压接在间隔部分12a中，从而将悬架12附接到托架臂10上。当通过两个压力施加构件40a，40b将两个压力施加构件40a和40b以及超声波振动施加到两个压力施加构件40a，40b上时，球20被压制并夹在间隔孔12b的两侧，移动施加构件40a，40b以使球20穿过间隔孔12b。

10. 发明授权

US07506427B2 Method of assembling a carriage assembly 失效
标题翻译：组装滑架组件的方法
公开(公告)号：US07506427B2
公开(公告)日：2009-03-24
申请号：US11363199
申请日：2006-02-28
申请人： Takayoshi Matsumura , Naoki Ishikawa , Hiroshi Kobayashi , Hidehiko Kira
发明人： Takayoshi Matsumura , Naoki Ishikawa , Hiroshi Kobayashi , Hidehiko Kira
IPC分类号： G11B5/127 , H04R31/00
CPC分类号： G11B5/5569 , Y10T29/49025 , Y10T29/49027 , Y10T29/4903 , Y10T29/49032
摘要： A method of assembling a carriage assembly is disclosed. The method is are capable of suppressing fluctuation in the crimped (deformed) states of spacer portions when suspensions are attached to carriage arms. The method aligns fitting holes 10a provided in carriage arms 10 with spacer holes 12b of suspensions 12. Then the method passes a ball 20 with a diameter equal to or greater than an inner diameter of the spacer holes 12b through the spacer holes 12b to crimp edge portions of the spacer holes 12b in spacer portions 12a and thereby attach the suspensions 12 to the carriage arms 10. While the ball 20 is being pressed and sandwiched from both sides of the spacer holes 12b by two pressure-applying members 40a, 40b an ultrasonic vibration is applied to the two pressure-applying members 40a, 40b, the two pressure applying members 40a, 40b are moved so as to pass the ball 20 through the spacer holes 12b.
摘要翻译：公开了一种组装滑架组件的方法。该方法能够抑制当悬架附接到托架臂时间隔部分的卷曲（变形）状态的波动。该方法将设置在托架臂10中的装配孔10a与悬架12的间隔孔12b对准。然后，该方法将直径等于或大于间隔孔12b的内径的球20通过间隔孔12b传递到卷边隔离部分12a中的间隔孔12b的部分，从而将悬架12附接到托架臂10.当通过两个加压构件40a，40b将球20挤压并夹在隔离孔12b的两侧时，超声波对两个施压部件40a，40b施加振动，使两个加压部件40a，40b移动，使球20通过间隔孔12b。

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