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    • 3. 发明授权
    • Mandrel for production of rubber hose
    • 用于生产橡胶软管的心轴
    • US4938910A
    • 1990-07-03
    • US195358
    • 1988-05-16
    • Shunji AbeHiromi Shigemoto
    • Shunji AbeHiromi Shigemoto
    • B29C33/40B29C33/50B29C33/62B29C33/76B29K21/00B29K105/24C08L15/00C08L23/14C08L23/16C08L23/18C08L23/20C08L23/22
    • C08L15/00B29C33/40C08L23/16C08L23/20B29C33/62B29C33/76B29K2823/06C08L23/14C08L23/22
    • A mandrel suitable for use in the production of a rubber hose formed from a composition comprising:(i) at least one member selected from the group consisting of(A) an ethylene-alpha-olefin random copolymer having an ethylene content of 10 to 95 mol % and a degree of crystallinity, based on X-ray determination, of 0 to 20%,(B) a propylene - C.sub.4 to C.sub.10 alpha-olefin random copolymer having a propylene content of 50 to 80 mol % and a crystal fusion heat amount, determined by a differential scanning calorimeter, of 0 to 80 Joule/g, and(C) an oligomer having the general formula: ##STR1## wherein n and p are independently zero or an integer, m is zero or 1, and R is ##STR2## and (ii) 98% to 30% by weight of a 4-methyl-1-pentene polymer, wherein the weight ratio of the component (i) to the component (ii) is from 2:98 to 70:30.This mandrel has excellent dimensional stability, durability, heat resistance, and releasability.
    • 一种适于用于生产由组合物形成的橡胶软管的心轴,包括:(i)至少一种选自(A)乙烯含量为10至95的乙烯-α-烯烃无规共聚物 摩尔%和结晶度,基于X射线测定,为0〜20%,(B)丙烯含量为50〜80摩尔%的丙烯-C4〜C10α-烯烃无规共聚物和结晶熔融热 通过差示扫描量热计测定的量为0至80焦耳/克,(C)具有以下通式的低聚物:其中n和p独立地为0或整数,m为零或1 和(ii)98重量%至30重量%的4-甲基-1-戊烯聚合物,其中组分(i)与组分(ⅱ)的重量比为2:98 到70:30。 该心轴具有优异的尺寸稳定性,耐久性,耐热性和脱模性。
    • 6. 发明授权
    • IC socket
    • IC插座
    • US4887969A
    • 1989-12-19
    • US195840
    • 1988-05-19
    • Shunji Abe
    • Shunji Abe
    • H01R33/76G01R1/04G01R31/28H01L21/673H01L23/32H05K7/10
    • H05K7/1046G01R1/0433G01R31/2886H05K7/1038
    • An IC socket has a socket body having an IC package accommodating space therein; an IC mounting table disposed in the IC package accommodating space and adapted to support an IC package thereon; and a plurality of contacts planted in a socket body portion at the periphery of the mounting table; the plurality of contacts each having a resilient contact piece, IC terminals of the IC package, when the IC package is supported on the mounting table, being able to contact with the resilient contact pieces of the contacts, wherein the IC package mounting table is formed with a plurality of contact positioning grooves for receiving the resilient contact pieces therein, so that the resilient contact pieces are regulated by a wall for defining the positioning grooves.
    • IC插座具有插座本体,其中具有容纳空间的IC封装; IC安装台,设置在IC封装容纳空间中并适于在其上支撑IC封装; 以及植入在所述安装台的周边的插座主体部分中的多个触点; 所述多个触点各自具有弹性接触片,IC封装的IC端子,当IC封装被支撑在安装台上时,能够与触点的弹性接触片接触,其中形成IC封装安装台 具有用于接收其中的弹性接触片的多个接触定位槽,使得弹性接触片由用于限定定位槽的壁限制。
    • 7. 发明授权
    • IC pressing rotating lever mechanism IC socket
    • IC按压旋转杆机构IC插座
    • US5823794A
    • 1998-10-20
    • US826807
    • 1997-03-25
    • Shunji Abe
    • Shunji Abe
    • H01R13/629H01L23/32H01R13/193H01R33/76H01R33/97H05K7/10H01R9/09
    • H01R13/193H05K7/1023
    • An IC pressing mechanism in an IC socket comprises a cover mounted in such a way to be able to move upwardly and downwardly with respect to a socket body, an IC pressing lever movable between a pressing position and a releasing position with respect to an IC package in accordance with upward and downward movement of the cover, such that, in the pressing position, the IC pressing lever urges an IC lead against a contact on a socket body, and a transmission lever for linking the cover and the IC pressing lever together. The transmission lever is connected at an upper end side thereof to the cover through a pin and rotatable inwardly and is outwardly about the pin. A lower end side of the transmission lever and an outer end side of the IC pressing lever are connected together through a pin. When the transmission lever are lowered in accordance with lowering of the cover, the pin connection portion between the lower end side of the transmission lever and the outer end side of the IC pressing lever is restricted in such a way to be caused to move downwardly and outwardly at the same time, and a pressing portion on an inner end of the IC pressing lever is caused to move upwardly and outwardly at the same time by the downward and outward movement of the pin connection portion.
    • IC插座中的IC按压机构包括以相对于插座主体向上和向下移动的方式安装的盖,IC按压杆可在相对于IC封装的按压位置和释放位置之间移动 根据盖的向上和向下运动,使得在按压位置,IC按压杆将IC引线推向插座体上的接触,以及用于将盖和IC按压杆连接在一起的传动杆。 传动杆在其上端侧通过销连接到盖上并可向内旋转并且围绕销向外延伸。 传动杆的下端侧和IC按压杆的外端侧通过销连接在一起。 当传动杆根据盖的下降而降低时,传动杆的下端侧和IC按压杆的外端侧之间的销连接部分受到限制,使其向下移动, 同时向外,并且通过销连接部的向下和向外的运动,使IC按压杆的内端上的按压部分同时向上和向外移动。