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1. 发明授权

US08007897B2 Insulating sheet and method for producing it, and power module comprising the insulating sheet 有权
标题翻译：绝缘片及其制造方法以及包含该绝缘片的功率模块
公开(公告)号：US08007897B2
公开(公告)日：2011-08-30
申请号：US12834073
申请日：2010-07-12
申请人： Hiromi Ito , Naoshi Yamada , Kei Yamamoto , Hirofumi Fujioka , Takumi Kikuchi , Osamu Yashiro
发明人： Hiromi Ito , Naoshi Yamada , Kei Yamamoto , Hirofumi Fujioka , Takumi Kikuchi , Osamu Yashiro
IPC分类号： B32B5/16 , H05K7/20
CPC分类号： H01L23/3737 , H01L24/29 , H01L2224/29011 , H01L2224/29076 , H01L2224/291 , H01L2224/2929 , H01L2224/29386 , H01L2224/29499 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48464 , H01L2224/49109 , H01L2924/15747 , H01L2924/181 , H01L2924/19107 , Y10T156/10 , Y10T428/24372 , Y10T428/249924 , Y10T428/24994 , Y10T428/28 , H01L2924/00014 , H01L2924/05432 , H01L2924/049 , H01L2924/045 , H01L2924/00 , H01L2924/00012
摘要： An insulating sheet includes an adhesive component of a thermosetting resin and containing a filler member. Heat conductivity of an adhesive face region of the insulating sheet is smaller than heat conductivity of an inner region of the insulating sheet.
摘要翻译：绝缘片包括热固性树脂的粘合剂组分并且包含填充构件。绝缘片的粘合面区域的导热率小于绝缘片的内部区域的导热率。

2. 发明申请

US20100277872A1 INSULATING SHEET AND METHOD FOR PRODUCING IT, AND POWER MODULE COMPRISING THE INSULATING SHEET 有权
标题翻译：绝缘片及其制造方法以及包含绝缘片的电源模块
公开(公告)号：US20100277872A1
公开(公告)日：2010-11-04
申请号：US12834073
申请日：2010-07-12
申请人： Hiromi Ito , Naoshi Yamada , Kei Yamamoto , Hirofumi Fujioka , Takumi Kikuchi , Osamu Yashiro
发明人： Hiromi Ito , Naoshi Yamada , Kei Yamamoto , Hirofumi Fujioka , Takumi Kikuchi , Osamu Yashiro
IPC分类号： H05K7/20 , B32B37/02 , B32B27/04
CPC分类号： H01L23/3737 , H01L24/29 , H01L2224/29011 , H01L2224/29076 , H01L2224/291 , H01L2224/2929 , H01L2224/29386 , H01L2224/29499 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48464 , H01L2224/49109 , H01L2924/15747 , H01L2924/181 , H01L2924/19107 , Y10T156/10 , Y10T428/24372 , Y10T428/249924 , Y10T428/24994 , Y10T428/28 , H01L2924/00014 , H01L2924/05432 , H01L2924/049 , H01L2924/045 , H01L2924/00 , H01L2924/00012
摘要： An insulating sheet includes an adhesive component of a thermosetting resin and containing a filler member. Heat conductivity of an adhesive face region of the insulating sheet is smaller than heat conductivity of an inner region of the insulating sheet.
摘要翻译：绝缘片包括热固性树脂的粘合剂组分并且包含填充构件。绝缘片的粘合面区域的导热率小于绝缘片的内部区域的导热率。

3. 发明申请

US20060165978A1 Insulating sheet and method for producing it, and power module comprising the insulating sheet 审中-公开
标题翻译：绝缘片及其制造方法以及包含该绝缘片的功率模块
公开(公告)号：US20060165978A1
公开(公告)日：2006-07-27
申请号：US11340867
申请日：2006-01-27
申请人： Hiromi Ito , Naoshi Yamada , Kei Yamamoto , Hirofumi Fujioka , Takumi Kikuchi , Osamu Yashiro
发明人： Hiromi Ito , Naoshi Yamada , Kei Yamamoto , Hirofumi Fujioka , Takumi Kikuchi , Osamu Yashiro
IPC分类号： B31B1/60 , D04H13/00
CPC分类号： H01L23/3737 , H01L24/29 , H01L2224/29011 , H01L2224/29076 , H01L2224/291 , H01L2224/2929 , H01L2224/29386 , H01L2224/29499 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48464 , H01L2224/49109 , H01L2924/15747 , H01L2924/181 , H01L2924/19107 , Y10T156/10 , Y10T428/24372 , Y10T428/249924 , Y10T428/24994 , Y10T428/28 , H01L2924/00014 , H01L2924/05432 , H01L2924/049 , H01L2924/045 , H01L2924/00 , H01L2924/00012
摘要： An insulating sheet includes an adhesive component of essentially a thermosetting resin and a filler member infiltrated into the component. Heat conductivity of an adhesive face region of the insulating sheet is smaller than heat conductivity of an inner region, other than the adhesive face region of the insulating sheet.
摘要翻译：绝缘片包括基本上是热固性树脂的粘合剂组分和渗透到组分中的填料构件。除了绝缘片的粘合面区域之外，绝缘片的粘合面区域的导热率小于内部区域的导热率。

4. 发明授权

US5939472A Epoxy resin composition for molding having improved mechanical properties and crack resistance 失效
标题翻译：用于模塑的环氧树脂组合物具有改进的机械性能和抗裂性
公开(公告)号：US5939472A
公开(公告)日：1999-08-17
申请号：US841312
申请日：1997-04-30
申请人： Hiromi Ito , Takumi Kikuchi , Hirofumi Fujioka , Hirozoh Kanegae , Yoshifumi Itabashi , Fumio Nogami
发明人： Hiromi Ito , Takumi Kikuchi , Hirofumi Fujioka , Hirozoh Kanegae , Yoshifumi Itabashi , Fumio Nogami
IPC分类号： B29C39/10 , B29K63/00 , B29L31/34 , C08G59/20 , C08G59/22 , C08G59/24 , C08G59/26 , C08G59/30 , C08G59/40 , C08G59/42 , C08K3/22 , C08K3/36 , C08K5/5415 , C08K5/56 , C08L63/00 , H01B3/40 , C08L63/02
CPC分类号： H01B3/40 , C08G59/226 , C08G59/245 , C08G59/26 , C08G59/30 , C08G59/42 , C08L63/00
摘要： Epoxy resin composition for molding comprising epoxy resin (A), acid anhydride (B), curing accelerator (C), coupling agent (D) and filler (E), process for preparing molded product used for apparatus for high voltage made of the epoxy resin composition for molding and molded product produced by the process for preparing the molded product. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and high toughness and excellent thermal resistance, the process for preparing the molded product can provide molded product made of the epoxy resin composition, and the produced molded product has excellent crack resistance and high reliability.
摘要翻译：环氧树脂（A），酸酐（B），固化促进剂（C），偶联剂（D）和填料（E））的模塑用环氧树脂组合物，用于制备由环氧树脂用于模塑的树脂组合物和通过制备模制产品的方法制备的模塑产品。环氧树脂组合物具有机械强度高，韧性高，耐热性优异的机械性能优异，制备成型体的方法可以提供由环氧树脂组合物制成的模制品，并且生产的模制产品具有优异的抗裂性和高可靠性。

5. 发明授权

US5880179A Molded products for high voltage apparatus comprising brominated epoxy resins 失效
标题翻译：包含溴化环氧树脂的高压设备的成型产品
公开(公告)号：US5880179A
公开(公告)日：1999-03-09
申请号：US774068
申请日：1996-12-23
申请人： Hiromi Ito , Takumi Kikuchi , Hirofumi Fujioka , Hirozoh Kanegae , Yoshifumi Itabashi , Fumio Nogami
发明人： Hiromi Ito , Takumi Kikuchi , Hirofumi Fujioka , Hirozoh Kanegae , Yoshifumi Itabashi , Fumio Nogami
IPC分类号： B29C39/10 , B29K63/00 , B29L31/34 , C08G59/20 , C08G59/22 , C08G59/24 , C08G59/26 , C08G59/30 , C08G59/40 , C08G59/42 , C08K3/22 , C08K3/36 , C08K5/5415 , C08K5/56 , C08L63/00 , H01B3/40 , C08L63/02 , H01F27/30 , H02K1/04
CPC分类号： H01B3/40 , C08G59/226 , C08G59/245 , C08G59/26 , C08G59/30 , C08G59/42 , C08L63/00
摘要： "Molded products for high voltage apparatus comprising an" epoxy resin composition for molding comprising an epoxy resin (A), an acid anhydride (B), a curing accelerator (C), at least one coupling agent (D) and a filler (E). The epoxy resin (A) is a bifunctional brominated bisphenol A or a brominated bisphenol F, "epoxy resin and at least one bisphenol A, bisphenol F or bisphenol epoxy resin". The coupling agent (D) is selected from the group consisting of epoxysilane type coupling agents, phenylaminosilane type coupling agents, mercaptosilane type coupling agents and titanate type coupling agents, which has an average particle diameter of not more than 60 .mu.m and in which the content of particles having a diameter of not more than 5 .mu.m is not less than 5% by weight. The filler (E) comprises at least one of silica fillers or alumina fillers. The ratio of the number of acid anhydride groups of the acid anhydride (B) to the number of epoxy groups of the epoxy resin (A) is 0.5 to 1.5; the amount of the curing accelerator (C) is 0.5 to 10 parts by weight based on 100 parts by weight of the epoxy resin (A); the amount of the coupling agent (D) is 0.05 to 5 parts by weight based on 100 parts by weight of the filler (E); and the content of the filler (E) is 35 to 95% by weight of the resin composition. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and toughness, and excellent thermal resistance.
摘要翻译： “包含环氧树脂（A），酸酐（B），固化促进剂（C），至少一种偶联剂（D）和填料（E））的成型用环氧树脂组合物的高压设备用成型体）。环氧树脂（A）是双官能溴化双酚A或溴化双酚F“环氧树脂和至少一种双酚A，双酚F或双酚环氧树脂”。偶联剂（D）选自环氧硅烷型偶联剂，苯基氨基硅烷型偶联剂，巯基硅烷型偶联剂和钛酸酯型偶联剂，其平均粒径不大于60μm，其中直径不大于5μm的颗粒的含量不小于5重量％。填料（E）包括二氧化硅填料或氧化铝填料中的至少一种。酸酐（B）的酸酐基与环氧树脂（A）的环氧基数的比例为0.5〜1.5; 相对于100重量份的环氧树脂（A），固化促进剂（C）的使用量为0.5〜10重量份。相对于100重量份的填料（E），偶联剂（D）的量为0.05〜5重量份。填料（E）的含量为树脂组合物的35〜95重量％。环氧树脂组合物具有优异的机械强度和韧性等机械性能，耐热性优异。

6. 发明申请

US20060188727A1 Thermally conductive resin sheet and power module using the same 有权
标题翻译：导热树脂片和使用其的电源模块
公开(公告)号：US20060188727A1
公开(公告)日：2006-08-24
申请号：US11408025
申请日：2006-04-21
申请人： Hiromi Ito , Osamu Yashiro
发明人： Hiromi Ito , Osamu Yashiro
IPC分类号： B32B27/38 , C08L63/00 , B32B37/00
CPC分类号： H01L23/3733 , C08K7/00 , C08K2201/014 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/48137 , H01L2224/48237 , H01L2224/48257 , H01L2924/00014 , H01L2924/01019 , H01L2924/181 , Y10T428/24917 , Y10T428/31511 , Y10T428/31515 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A thermally conductive resin sheet includes a thermosetting resin, and a thermally conductive and electrically insulating inorganic filler. The inorganic filler is a mixture of a flat inorganic filler and a granular inorganic filler. The ratio of the volume content, VL, of the flat inorganic filler to volume content, VR, of the granular inorganic filler in the mixture is from 30/70 to 80/20, in terms of VL/VR.
摘要翻译：导热树脂片包括热固性树脂和导热和电绝缘的无机填料。无机填料是扁平无机填料和粒状无机填料的混合物。平均无机填料的体积含量V L L与混合物中颗粒状无机填料的体积含量V R R的比例为30/70至 80/20，就V L / V R R而言。

7. 发明授权

US07602051B2 Thermally conductive resin sheet and power module using the same 有权
标题翻译：导热树脂片和使用其的电源模块
公开(公告)号：US07602051B2
公开(公告)日：2009-10-13
申请号：US11408025
申请日：2006-04-21
申请人： Hiromi Ito , Osamu Yashiro
发明人： Hiromi Ito , Osamu Yashiro
IPC分类号： H01L23/495
CPC分类号： H01L23/3733 , C08K7/00 , C08K2201/014 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/48137 , H01L2224/48237 , H01L2224/48257 , H01L2924/00014 , H01L2924/01019 , H01L2924/181 , Y10T428/24917 , Y10T428/31511 , Y10T428/31515 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A thermally conductive resin sheet includes a thermosetting resin, and a thermally conductive and electrically insulating inorganic filler. The inorganic filler is a mixture of a flat inorganic filler and a granular inorganic filler. The ratio of the volume content, VL, of the flat inorganic filler to volume content, VR, of the granular inorganic filler in the mixture is from 30/70 to 80/20, in terms of VL/VR.
摘要翻译：导热树脂片包括热固性树脂和导热和电绝缘的无机填料。无机填料是扁平无机填料和粒状无机填料的混合物。平均无机填料的体积含量V L与混合物中粒状无机填料的体积含量VR的比例为VL / VR为30/70至80/20。

8. 发明授权

US5723813A Insulating spacer with shield electrodes having a graded resistance 失效
标题翻译：绝缘垫片与屏蔽电极具有分级电阻
公开(公告)号：US5723813A
公开(公告)日：1998-03-03
申请号：US663733
申请日：1996-06-14
申请人： Hiromi Ito , Kenji Mimura , Hirofumi Fujioka , Etsuro Tomonaga , Hiroshi Aoki , Hiroyuki Hama
发明人： Hiromi Ito , Kenji Mimura , Hirofumi Fujioka , Etsuro Tomonaga , Hiroshi Aoki , Hiroyuki Hama
IPC分类号： H02G5/06 , H01B7/00
CPC分类号： H02G5/068 , Y10T29/49227
摘要： The present invention provides an insulating spacer for a high-voltage conductor constructed with a plastic made of an epoxy resin composition so that the volumetric specific resistance of the shield electrode increases toward the median point between a container and the conductor and a method for manufacturing shield electrode used therein. The insulating spacer according to the present invention can lessen the concentration of electric fields in the boundary areas between the shield electrode and the insulating member with the result that reliability is improved and service life is lengthened.
摘要翻译：本发明提供一种用由环氧树脂组合物制成的塑料构成的高压导体的绝缘间隔件，使得屏蔽电极的体积电阻率朝向容器和导体之间的中点增加，并且制造屏蔽的方法电极。根据本发明的绝缘间隔物可以减小屏蔽电极和绝缘构件之间的边界区域中的电场浓度，从而提高可靠性并延长使用寿命。

9. 发明授权

US06342547B1 Epoxy resin composition for SF6 gas insulating device and SF6 gas insulating device 失效
标题翻译： SF6气体绝缘装置和SF6气体绝缘装置用环氧树脂组合物
公开(公告)号：US06342547B1
公开(公告)日：2002-01-29
申请号：US09497215
申请日：2000-02-03
申请人： Kenji Mimura , Hiromi Ito , Hiroyuki Nishimura , Kazuharu Kato , Hirofumi Fujioka , Yukio Ozaki , Hiroyuki Hama
发明人： Kenji Mimura , Hiromi Ito , Hiroyuki Nishimura , Kazuharu Kato , Hirofumi Fujioka , Yukio Ozaki , Hiroyuki Hama
IPC分类号： C08K334
CPC分类号： H01B3/40
摘要： There is provided an epoxy resin composition, which has superior resistant property to SF6 gas, mechanical strength and cracking resistance in a well balanced manner and which can provide an insulating molded article having a low dielectric constant. The epoxy resin composition for an SF6-gas insulating device of the present invention is obtained by adding a silicate compound powder to an epoxy resin.
摘要翻译：提供一种环氧树脂组合物，其以良好平衡的方式具有优良的耐SF6气体的耐受性，机械强度和抗裂性，并且可以提供具有低介电常数的绝缘模制品。本发明的SF6气体绝缘装置用环氧树脂组合物是通过向环氧树脂中添加硅酸盐化合物粉末而得到的。

10. 发明授权

US07514782B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US07514782B2
公开(公告)日：2009-04-07
申请号：US11697094
申请日：2007-04-05
申请人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Hiromi Ito
发明人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Hiromi Ito
IPC分类号： H01L23/373
CPC分类号： H01L23/3735 , H01L23/3677 , H01L23/3731 , H01L25/0655 , H01L2023/4081 , H01L2224/48247 , H01L2224/49111 , H01L2224/49175 , H01L2924/09701 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012
摘要： An objective is to provide a reliability-improved semiconductor device in which heat radiation characteristics are superior, and warpage of the semiconductor device occurring due to heat generation of a semiconductor chip or to varying of the usage environment is also suppressed. The semiconductor device is provided that includes a thermal-conductive sheet 3 formed on a base board 4, including thermal-conductive resin 6, a heat sink 2 provided on the base board 4 through the thermal-conductive sheet 3, a semiconductor chip 1 mounted on the heat sink 2, and a ceramic-embedded region 31 selectively provided in a region of the thermal-conductive sheet 3 under the semiconductor chip 1, including a ceramic component 5. In this semiconductor device, superior thermal conductivity can be ensured, and warpage and peeling in the semiconductor device occurring due to heat generation of the semiconductor chip or to varying of the usage environment can also be reduced.
摘要翻译：目的是提供一种可靠性改善的半导体器件，其中散热特性优异，并且还抑制了由于半导体芯片的发热而产生的半导体器件的翘曲或者使用环境的变化。该半导体装置具备：包括导热性树脂6的基板4上形成的导热片3，通过导热片3设置在基板4上的散热片2，安装有半导体芯片1 并且在包含陶瓷部件5的半导体芯片1的下方的热传导片3的区域中选择性地设置陶瓷嵌入区域31.在该半导体装置中，可以确保优良的导热性，也可以减少由于半导体芯片的发热而发生的半导体器件的翘曲和剥离或使用环境的变化。

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