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1. 发明授权

US5917246A Semiconductor package with pocket for sealing material 失效
标题翻译：半导体封装带口袋密封材料
公开(公告)号：US5917246A
公开(公告)日：1999-06-29
申请号：US620580
申请日：1996-03-22
申请人： Hirokazu Kasuya , Kouji Numazaki , Takahisa Koyasu , Mitsuhiro Saitou
发明人： Hirokazu Kasuya , Kouji Numazaki , Takahisa Koyasu , Mitsuhiro Saitou
IPC分类号： H01L23/28 , H01L21/56 , H01L23/24 , H01L23/29 , H01L23/31 , H05K3/28 , H05K3/34
CPC分类号： H01L23/24 , H01L21/56 , H01L2224/45144 , H01L2224/48091 , H05K3/284 , H05K3/3405
摘要： A semiconductor package, which secures the protection of circuit elements from the external environment, is disclosed. A single in-line package (SIP) is constructed by fixingly sealing a hybrid integrated circuit component within a casing with epoxy resin. A sleeve is bonded on the surface of a ceramic substrate. The sleeve is formed with silicon rubber into a pocket shape so as to cover respective circuit elements of the hybrid integrated circuit component. In the sleeve is made an opening part. Silicon gel is poured into the sleeve as a fixingly sealing material and cured to seal the respective circuit elements. Terminals downwardly extends in parallel with each other from an end part of the ceramic substrate through an opening part of the casing.
摘要翻译：公开了一种确保电路元件与外部环境的保护的半导体封装。单个在线封装（SIP）是通过将环形树脂固定密封在壳体内的混合集成电路部件构成的。套筒结合在陶瓷基板的表面上。套筒由硅橡胶形成为袋形，以覆盖混合集成电路部件的各个电路元件。在袖子里打开了一部分。将硅胶作为固定密封材料倒入套筒中并固化以密封各个电路元件。端子从陶瓷基板的端部通过壳体的开口部向下平行地延伸。

2. 发明授权

US5554881A Constitution of an electrode arrangement in a semiconductor element 失效
标题翻译：半导体元件中的电极布置的结构
公开(公告)号：US5554881A
公开(公告)日：1996-09-10
申请号：US357492
申请日：1994-12-15
申请人： Takahisa Koyasu , Kouji Numazaki , Hirokazu Kasuya , Mitsuhiro Saitou , Kazuhisa Ikeda
发明人： Takahisa Koyasu , Kouji Numazaki , Hirokazu Kasuya , Mitsuhiro Saitou , Kazuhisa Ikeda
IPC分类号： H01L23/485 , H01L29/70
CPC分类号： H01L24/05 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/45124 , H01L2224/45144 , H01L2224/4823 , H01L2224/4912 , H01L2224/49171 , H01L24/45 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01021 , H01L2924/01023 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10158 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/19043
摘要： At least four electrodes are provided on the same surface of a discrete transistor. Among these electrodes, one electrode is set as a base electrode, an electrode neighboring the base electrode in the up-and-down direction is set as an emitter electrode and an electrode neighboring the base electrode in the right-and-left direction is set as a collector electrode. On the same surface, a base electrode is provided at a position which is neither in the up-and-down direction nor in the right-and-left direction with respect to the base electrode. When the discrete transistor having this type of electrode arrangement is mounted on a substrate, one of the base electrodes formed on the substrate is connected to a first wiring, the collector electrode is connected to a second wiring, and the emitter electrode is connected to a third wiring.
摘要翻译：在分立晶体管的同一表面上设置至少四个电极。在这些电极中，将一个电极设置为基极，将与上下方向的基极相邻的电极设定为发射电极，并且设定与左右方向的基极相邻的电极作为集电极。在相同的表面上，基极相对于基极设置在既不在上下方向也不在左右方向上的位置。当具有这种类型的电极布置的分立晶体管安装在基板上时，形成在基板上的一个基极连接到第一布线，集电极连接到第二布线，并且发射极连接到第三线。

3. 发明授权

US5483217A Electronic circuit device 失效
标题翻译：电子电路装置
公开(公告)号：US5483217A
公开(公告)日：1996-01-09
申请号：US91718
申请日：1993-07-15
申请人： Takashi Nagasaka , Mitsuhiro Saitou , Takahisa Koyasu , Hiroyuki Ban , Yuji Otani , Kengo Oka , Kyoko Nagaoka
发明人： Takashi Nagasaka , Mitsuhiro Saitou , Takahisa Koyasu , Hiroyuki Ban , Yuji Otani , Kengo Oka , Kyoko Nagaoka
IPC分类号： H05K1/02 , H05K1/09 , H05K1/14 , H05K1/16 , H05K3/28 , H01C1/02
CPC分类号： H05K3/284 , H05K1/167 , H05K1/0271 , H05K1/095 , H05K1/141 , H05K2201/0317 , H05K2201/09236 , H05K2201/10386 , H05K2201/10545
摘要： An electronic circuit device decreases dispersion in the output of the circuit caused by changes in the resistance of the resistors resulting from stress. Resistor positions are selected on the circuit board so that a change in the circuit output caused by a change in resistance of a first resistor group becomes equal to a change caused by a change in resistance caused by a second resistor group, these changes being in opposite directions so as to cancel each other. Alternately, a plurality of resistors are connected to form a composite resistor such that the effect upon resistance of the composite resistor caused by the resistor having decreased resistance is cancelled by the effect upon resistance of the composite resistor caused by a resistor having an increased resistance.
摘要翻译：电子电路装置减少由于应力引起的电阻电阻变化引起的电路输出中的色散。在电路板上选择电阻器位置，使得由第一电阻器组的电阻变化引起的电路输出的变化等于由第二电阻器组造成的电阻变化引起的变化，这些变化是相反的方向相互抵消。或者，连接多个电阻器以形成复合电阻器，使得由具有降低的电阻的电阻器引起的复合电阻器的电阻的影响由于由具有增加的电阻的电阻器引起的复合电阻器的电阻的影响而被抵消。

4. 发明授权

US5629702A Analog to digital converter 失效
标题翻译：模数转换器
公开(公告)号：US5629702A
公开(公告)日：1997-05-13
申请号：US318546
申请日：1994-10-05
申请人： Takahisa Koyasu , Mitsuhiro Saitou
发明人： Takahisa Koyasu , Mitsuhiro Saitou
IPC分类号： H03M1/14 , H03M1/36 , H03M1/42 , H03M1/66
CPC分类号： H03M1/42
摘要： An analog to digital converter comprises: first to n.sup.th comparators, having a tandem structure, for comparing an input voltage signal with first to n.sup.th reference voltages and outputting first to n.sup.th bit outputs respectively, said n being a natural number more than one, said first comparator outputting a most significant bit of said first bit output; a first reference voltage generation circuit for generating said first reference voltage; second to n.sup.th reference voltage generation circuits for generating said second to n.sup.th reference voltages, p.sup.th reference voltages being generated in accordance with outputs of said first to (p-1).sup.th comparators, said p being a natural number and l
摘要翻译：一种模数转换器包括：具有串联结构的第一至第n比较器，用于将输入电压信号与第一至第n参考电压进行比较，并分别输出第一至第n位输出，所述n为多于一个的自然数，所述第一比较器输出所述第一位输出的最高有效位; 用于产生所述第一参考电压的第一参考电压产生电路; 用于产生所述第二至第n参考电压的第二至第n参考电压产生电路，根据所述第一至第（p-1）比较器的输出产生第p参考电压，所述p为自然数，l

5. 发明授权

US06034556A Sample-and-hold circuit including operational amplifier as an input circuit 失效
标题翻译：采样保持电路包括运算放大器作为输入电路
公开(公告)号：US06034556A
公开(公告)日：2000-03-07
申请号：US19363
申请日：1998-02-05
申请人： Takahisa Koyasu , Mitsuhiro Saitou , Hiroyuki Ban
发明人： Takahisa Koyasu , Mitsuhiro Saitou , Hiroyuki Ban
IPC分类号： G11C27/02 , H03F3/30 , H03F3/45
CPC分类号： H03F3/3071 , G11C27/026 , H03F3/45085 , H03F2203/45594 , H03F2203/45612 , H03F2203/45618 , H03F2203/45674 , H03F2203/45722
摘要： An operational amplifier charges a charge storage capacitor in response to an input signal supplied to a non-inverting input terminal. When a switching signal is low, NPN transistors disposed in an output open circuit are on. Therefore, output transistors disposed in a push-pull circuit are off and the output signal is cut off. Further, in this situation, the potential of a phase compensation capacitor is held because AC coupling of the phase compensation capacitor does not occur.
摘要翻译：响应于提供给非反相输入端的输入信号，运算放大器对电荷存储电容器充电。当开关信号为低电平时，设置在输出开路中的NPN晶体管导通。因此，设置在推挽电路中的输出晶体管截止，输出信号被切断。此外，在这种情况下，由于不发生相位补偿电容器的AC耦合，因此保持相位补偿电容器的电位。

6. 发明授权

US5739546A Semiconductor wafer 失效
标题翻译：半导体晶圆
公开(公告)号：US5739546A
公开(公告)日：1998-04-14
申请号：US666646
申请日：1996-06-18
申请人： Mitsuhiro Saitou , Kouji Numazaki , Hiroyuki Ban
发明人： Mitsuhiro Saitou , Kouji Numazaki , Hiroyuki Ban
IPC分类号： H01L21/66 , H01L21/822 , H01L23/528 , H01L23/58 , H01L27/02 , H01L27/04 , H01L27/10
CPC分类号： H01L22/32 , H01L23/5286 , H01L27/0218 , H01L2924/0002 , H01L2924/3011
摘要： A semiconductor wafer, having a relatively wide power supply line and ground line, and which can also prevent short-circuiting between these lines. Multiple integrated circuit formation regions, whereon integrated circuits have been formed, are disposed on a semiconductor wafer. A silicon oxide film is formed on a silicon substrate, and a ground line conductor is formed on the silicon oxide film. This ground line conductor is extended over scribe lines. A layer insulation film composed of silicon oxide film is deposited on the silicon oxide film with the ground line conductor interposed therebetween, and a power supply line conductor is formed on the layer insulation film to overlap the ground line conductor. The power supply line conductor is extended over scribe lines. In the integrated circuit formation regions, a power supply pad and the power supply line conductor are electrically connected. A ground pad and the ground line conductor are also electrically connected.
摘要翻译：具有相对宽的电源线和接地线的半导体晶片，并且还可以防止这些线之间的短路。多个集成电路形成区域已经形成集成电路，被布置在半导体晶片上。在硅衬底上形成氧化硅膜，在氧化硅膜上形成接地线导体。该接地线导体在划线上延伸。在氧化硅膜上沉积由氧化硅膜构成的层绝缘膜，其间插入有接地线导体，并且在该层绝缘膜上形成与该接地线导体重叠的电源线导体。电源线导体在划线上延伸。在集成电路形成区域中，电源焊盘和电源线导体电连接。接地焊盘和接地线导体也电连接。

7. 发明申请

US20050231925A1 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050231925A1
公开(公告)日：2005-10-20
申请号：US11105548
申请日：2005-04-14
申请人： Yutaka Fukuda , Mitsuhiro Saitou , Toshihiro Nagaya , Kan Kinouchi , Sadahiro Akama , Koji Numazaki , Norihisa Imaizumi , Hiromasa Hayashi , Akihiro Fukatsu , Hirokazu Kasuya , Nobumasa Ueda
发明人： Yutaka Fukuda , Mitsuhiro Saitou , Toshihiro Nagaya , Kan Kinouchi , Sadahiro Akama , Koji Numazaki , Norihisa Imaizumi , Hiromasa Hayashi , Akihiro Fukatsu , Hirokazu Kasuya , Nobumasa Ueda
IPC分类号： H01F7/18 , H01L21/56 , H01L23/36 , H01L23/433 , H01L23/488 , H01L23/495 , H01L25/04 , H05K1/02 , H05K1/03 , H05K1/14 , H05K3/28 , H05K7/02
CPC分类号： H05K1/142 , H01L21/565 , H01L23/4334 , H01L23/4952 , H01L23/49562 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/014 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/20752 , H01L2924/20753 , H01L2924/2076 , H01L2924/3011 , H01L2924/351 , H05K1/0263 , H05K1/0306 , H05K3/0061 , H05K3/284 , H05K2201/10924 , H05K2203/049 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board.
摘要翻译：电气装置包括：第一电气元件; 第二电气元件，其能够流过大电流，使得在所述第二电气元件中产生热量; 散热器以及设置在散热器的一侧的第一布线板和第二布线板。第二电元件中的大电流大于第一电元件中的大电流。第一布线板和第二布线板彼此分离。第一电气元件设置在第一布线板上，第二电气元件设置在第二布线板上。

8. 发明申请

US20050179463A1 Driving apparatus of H bridge circuit and protection method of the same 有权
标题翻译： H桥电路的驱动装置及其保护方法相同
公开(公告)号：US20050179463A1
公开(公告)日：2005-08-18
申请号：US11057786
申请日：2005-02-15
申请人： Hirokazu Kasuya , Koji Numazaki , Mitsuhiro Saitou , Yutaka Fukuda , Nobumasa Ueda
发明人： Hirokazu Kasuya , Koji Numazaki , Mitsuhiro Saitou , Yutaka Fukuda , Nobumasa Ueda
IPC分类号： H02P7/28 , H02H7/08 , H02P7/00 , H03K17/06 , H03K17/082 , H03K17/10 , H03K17/687 , H03K19/0175
CPC分类号： H03K17/14 , H02H7/0838 , H02P7/04 , H03K17/063 , H03K17/0822 , H03K17/102 , H03K17/6877
摘要： In order to protect semiconductor switching-devices employed in an H bridge circuit against an over-voltage without using a special protection circuit, a control circuit outputs a control signal to a driving circuit for driving the H bridge circuit in order to turn off FETs serving as the semiconductor switching-devices when an over-voltage detection circuit detects the over-voltage applied to the H bridge circuit.
摘要翻译：为了在不使用特殊保护电路的情况下保护H桥电路中使用的半导体开关器件免于过电压，控制电路将控制信号输出到用于驱动H桥电路的驱动电路，以便关断供电的FET 作为半导体开关器件，当过电压检测电路检测到施加到H桥电路的过电压时。

9. 发明授权

US07212036B2 Driving apparatus of H bridge circuit and protection method of the same 有权
标题翻译： H桥电路的驱动装置及其保护方法相同
公开(公告)号：US07212036B2
公开(公告)日：2007-05-01
申请号：US11057786
申请日：2005-02-15
申请人： Hirokazu Kasuya , Koji Numazaki , Mitsuhiro Saitou , Yutaka Fukuda , Nobumasa Ueda
发明人： Hirokazu Kasuya , Koji Numazaki , Mitsuhiro Saitou , Yutaka Fukuda , Nobumasa Ueda
IPC分类号： H03K19/0175
CPC分类号： H03K17/14 , H02H7/0838 , H02P7/04 , H03K17/063 , H03K17/0822 , H03K17/102 , H03K17/6877
摘要： In order to protect semiconductor switching-devices employed in an H bridge circuit against an over-voltage without using a special protection circuit, a control circuit outputs a control signal to a driving circuit for driving the H bridge circuit in order to turn off FETs serving as the semiconductor switching-devices when an over-voltage detection circuit detects the over-voltage applied to the H bridge circuit.
摘要翻译：为了在不使用特殊保护电路的情况下保护H桥电路中使用的半导体开关器件免于过电压，控制电路将控制信号输出到用于驱动H桥电路的驱动电路，以便关断供电的FET 作为半导体开关器件，当过电压检测电路检测到施加到H桥电路的过电压时。

10. 发明申请

US20050274982A1 Electronic unit with a substrate where an electronic circuit is fabricated 有权
标题翻译：具有制造电子电路的基板的电子单元
公开(公告)号：US20050274982A1
公开(公告)日：2005-12-15
申请号：US11151660
申请日：2005-06-14
申请人： Nobumasa Ueda , Hirokazu Kasuya , Koji Numazaki , Yutaka Fukuda , Mitsuhiro Saitou
发明人： Nobumasa Ueda , Hirokazu Kasuya , Koji Numazaki , Yutaka Fukuda , Mitsuhiro Saitou
IPC分类号： H01L23/34 , H01L27/02 , H01L29/861
CPC分类号： H01L29/8611 , H01L2924/0002 , H01L2924/00
摘要： In an electronic unit with a substrate, a control circuit is mounted on the substrate and is configured to execute an operation related to a load. A package encapsulates the control circuit and the substrate. The package has sides around a periphery of the substrate. At least one input terminal for input of a signal externally sent to the electronic unit is disposed on at least one of the plurality of surfaces. At least one output terminal for output of a control signal for controlling the load is disposed on at least another one of the plurality of surfaces. At least one check terminal for input/output of a signal for checking at least the control circuit is disposed on at least another one of the plurality of surfaces.
摘要翻译：在具有基板的电子单元中，控制电路安装在基板上，并且被配置为执行与负载相关的操作。封装封装了控制电路和基板。该封装具有围绕基板周边的侧面。用于输入外部发送到电子单元的信号的至少一个输入端设置在多个表面中的至少一个表面上。用于输出用于控制负载的控制信号的至少一个输出端子设置在多个表面中的至少另一个表面上。至少一个用于输入/输出用于至少检查控制电路的信号的检查端子设置在多个表面中的至少另一个表面上。

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