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1. 发明申请

US20050237275A1 Plasma display apparatus 失效
标题翻译：等离子显示装置
公开(公告)号：US20050237275A1
公开(公告)日：2005-10-27
申请号：US11113175
申请日：2005-04-25
申请人： Hirokazu Inoue , Yukio Akiyama , Kiyoshi Watanuki , Michitaka Ohsawa
发明人： Hirokazu Inoue , Yukio Akiyama , Kiyoshi Watanuki , Michitaka Ohsawa
IPC分类号： G09G3/288 , G09F9/00 , G09G3/20 , G09G3/291 , G09G3/294 , G09G3/296 , H01J17/49 , H04N5/66 , G09G3/28
CPC分类号： G09G3/2965 , G09G2330/06
摘要： For a drive circuit of a sustaining discharge circuit of an AC plasma display panel, an idea of current flow parts arrangement is provided to reduce inductance. The configuration includes a plasma display panel on which electrodes are formed, an electric conductive conductor for fixing the panel, a pair of circuit boards fixed onto the conductor using a plurality of fixing members,.ground terminals and electric power supplies disposed respectively for the circuit boards, and a pair of connecting circuit boards connected to end portions respectively of the circuit boards and an end portion of the panel. The ground terminals are electrically connected via fixing members to a position near an end portion of the conductor.
摘要翻译：对于AC等离子体显示面板的维持放电电路的驱动电路，提供电流流动部件布置的思想以减小电感。该配置包括其上形成有电极的等离子体显示面板，用于固定面板的导电导体，使用多个固定构件固定到导体上的一对电路板，分别设置在电路中的接地端子和电源以及连接到电路板的端部和面板的端部的一对连接电路板。接地端子通过固定构件电连接到导体端部附近的位置。

2. 发明授权

US07557776B2 Plasma display apparatus 失效
标题翻译：等离子显示装置
公开(公告)号：US07557776B2
公开(公告)日：2009-07-07
申请号：US11113175
申请日：2005-04-25
申请人： Hirokazu Inoue , Yukio Akiyama , Kiyoshi Watanuki , Michitaka Ohsawa
发明人： Hirokazu Inoue , Yukio Akiyama , Kiyoshi Watanuki , Michitaka Ohsawa
IPC分类号： G09G3/28
CPC分类号： G09G3/2965 , G09G2330/06
摘要： For a drive circuit of a sustaining discharge circuit of an AC plasma display panel, an idea of current flow parts arrangement is provided to reduce inductance. The configuration includes a plasma display panel on which electrodes are formed, an electric conductive conductor for fixing the panel, a pair of circuit boards fixed onto the conductor using a plurality of fixing members, ground terminals and electric power supplies disposed respectively for the circuit boards, and a pair of connecting circuit boards connected to end portions respectively of the circuit boards and an end portion of the panel. The ground terminals are electrically connected via fixing members to a position near an end portion of the conductor.
摘要翻译：对于AC等离子体显示面板的维持放电电路的驱动电路，提供电流流动部件布置的思想以减小电感。该配置包括其上形成有电极的等离子体显示面板，用于固定面板的导电导体，使用多个固定构件固定到导体上的一对电路板，分别设置用于电路板的接地端子和电源以及连接到电路板的端部和面板的端部的一对连接电路板。接地端子通过固定构件电连接到导体端部附近的位置。

3. 发明授权

US06677664B2 Display driver integrated circuit and flexible wiring board using a flat panel display metal chassis 失效
标题翻译：显示驱动器集成电路和柔性线路板采用平板显示金属机箱
公开(公告)号：US06677664B2
公开(公告)日：2004-01-13
申请号：US09826930
申请日：2001-04-06
申请人： Hirokazu Inoue , Toyoshi Kawada , Yuji Sano , Michitaka Ohsawa , Osamu Hirohashi
发明人： Hirokazu Inoue , Toyoshi Kawada , Yuji Sano , Michitaka Ohsawa , Osamu Hirohashi
IPC分类号： H01L23495
CPC分类号： H05K7/20963 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A low-cost display driver module that shortens the process for connecting an integrated circuit chip and a wiring pattern on a flexible wiring board and uses a metal chassis on a display panel as a radiator. In this display driver module, an integrated circuit chip with bump electrodes on it is joined with pressure applied by the use of an anisotropic conductive film, an anisotropic conductive paste, a non-conductive resin paste, or a non-conductive resin film and the back of the integrated circuit chip is adhered to a metal chassis on a display panel by the use of an integrated-circuit chip adhesive. As a result, the metal chassis can be used as a radiator for the integrated circuit chip. Batch bonding will enable to shorten time for the connection process and to cut down the cost of installations. Furthermore, a radiator is unnecessary, resulting in a low-cost display driver module.
摘要翻译：一种低成本显示驱动器模块，其缩短了在柔性布线板上连接集成电路芯片和布线图案的过程，并将显示面板上的金属底盘用作散热器。在该显示驱动器模块中，在其上具有凸起电极的集成电路芯片通过使用各向异性导电膜，各向异性导电膏，非导电树脂糊或非导电树脂膜施加压力而接合，并且通过使用集成电路芯片粘合剂将集成电路芯片的背面粘附到显示面板上的金属底板。结果，金属底盘可以用作集成电路芯片的散热器。批量绑定将缩短连接过程的时间并降低安装成本。此外，不需要散热器，导致低成本的显示驱动器模块。

4. 发明申请

US20140126259A1 GRID-CONNECTED INVERTER APPARATUS AND CONTROL METHOD THEREFOR 有权
标题翻译：网格连接的逆变器装置及其控制方法
公开(公告)号：US20140126259A1
公开(公告)日：2014-05-08
申请号：US14129882
申请日：2012-06-28
申请人： Hirokazu Inoue
发明人： Hirokazu Inoue
IPC分类号： H02M7/5387
CPC分类号： H02M7/5387 , G01R31/3275 , H02J3/381 , H02J3/383 , H02J3/386 , H02J3/387 , H02M1/32 , H02M7/48 , Y02E10/563 , Y02E10/763
摘要： A grid-connected inverter apparatus includes: an inverter 50 for converting a DC output based on power generated from a power generation equipment 100 into an AC; a DC voltage measuring unit 40 for measuring a DC voltage on a DC input side of the inverter 50; a grid interconnection switch 70 having two independent relay switches 71, 72 each corresponding to phases of a grid power system 110 to which the inverter 50 is connected; and a control unit 90 for controlling the two relay switches 71, 72, such that the control unit 90, after opening the two relay switches 71, 72, changes the relay switch 71 such that the opening control is changes to closing control and, based on a change in the DC voltage measured by the DC voltage measuring unit 40 before and after the changing control, determines whether the relay switch 72 is faulty.
摘要翻译：并网逆变器装置包括：反相器50，用于将基于从发电设备100产生的电力的直流输出转换为交流电; 用于测量逆变器50的直流输入侧的直流电压的直流电压测量单元40; 电网互连开关70具有两个独立的继电器开关71,72，每个独立的继电器开关71,72对应于逆变器50连接到的电力系统110的相位; 以及用于控制两个继电器开关71,72的控制单元90，使得控制单元90在打开两个继电器开关71,72之后改变继电器开关71，使得开启控制变为关闭控制，并且基于在改变控制之前和之后由直流电压测量单元40测量的直流电压的变化确定继电器开关72是否故障。

5. 发明申请

US20090245324A1 COMPOUND SENSOR 审中-公开
标题翻译：化合物传感器
公开(公告)号：US20090245324A1
公开(公告)日：2009-10-01
申请号：US12310389
申请日：2008-03-13
申请人： Hideki Sunaga , Hirokazu Inoue , Yutaka Nakamura , Katsuyuki Urayama , Shuji Hojo
发明人： Hideki Sunaga , Hirokazu Inoue , Yutaka Nakamura , Katsuyuki Urayama , Shuji Hojo
IPC分类号： G01K13/00 , G01N7/00 , G01N33/497 , G01J5/00 , G01J1/44
CPC分类号： G01K1/14 , B60H1/00792 , G01J1/02 , G01J1/0204 , G01J1/0271 , G01J1/4228 , G01J5/0022 , G01J5/0025 , G01J5/0846 , G01J2001/4266 , G01K1/08 , G01K2201/02
摘要： A compound sensor which can improve the space for installing sensors and an operation for installing sensors by organizing various types of sensors, are provided. A compound sensor according to the present invention includes a light-shielding plate (3A) having one face onto which sunlight is irradiated and the other face located on a side opposite to the one face, which shields the sunlight from the one face side toward the other face side, a solar sensor (8A-8C) provided in the one face of the light-shielding plate (3A), and a temperature sensor provided in the other face side of the light-shielding plate (3A).
摘要翻译：提供了一种复合传感器，其可以改善用于安装传感器的空间和通过组织各种类型的传感器来安装传感器的操作。根据本发明的复合传感器包括一个遮光板（3A），该遮光板（3A）具有一个被照射的阳光的面，另一个面位于与一个面相反的一侧，该遮光板将阳光从一个面侧遮挡设置在遮光板（3A）的一个面上的太阳能传感器（8A-8C）和设在遮光板（3A）的另一面侧的温度传感器。

6. 发明授权

US06867528B2 Dynamoelectric machine and method for mounting a brush assembly to a brush holder 有权
标题翻译：电动机和用于将电刷组件安装到电刷架上的方法
公开(公告)号：US06867528B2
公开(公告)日：2005-03-15
申请号：US10459509
申请日：2003-06-12
申请人： Hirokazu Inoue , Hidehiko Kitahara , Hideyuki Hayashi , Tomoki Takahashi
发明人： Hirokazu Inoue , Hidehiko Kitahara , Hideyuki Hayashi , Tomoki Takahashi
IPC分类号： H01R39/40 , H02K13/00 , H02K15/02 , H02K19/00
CPC分类号： H01R39/40
摘要： A brush assembly is constructed such that a brush and a brush terminal are linked by means of a pigtail, a brush spring is disposed under compression between the brush and the brush terminal, and a cylindrical guide is disposed near the brush terminal inside the brush spring.
摘要翻译：电刷组件被构造成使得电刷和电刷端子通过引线连接，刷子弹簧设置在电刷和电刷端子之间的压缩下，并且圆柱形引导件设置在电刷端子的刷子弹簧内部。

7. 发明授权

US06703702B2 IC chip mounting structure and display device 失效
标题翻译： IC芯片安装结构和显示装置
公开(公告)号：US06703702B2
公开(公告)日：2004-03-09
申请号：US10202831
申请日：2002-07-26
申请人： Hirokazu Inoue , Toyoshi Kawada , Yuji Sano
发明人： Hirokazu Inoue , Toyoshi Kawada , Yuji Sano
IPC分类号： H01L2306
CPC分类号： H01L23/552 , G02F1/13452 , H01L23/057 , H01L23/36 , H01L23/5387 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/16152 , H01L2924/3011 , H05K1/147 , H05K1/189 , H01L2924/00
摘要： IC CHIP MOUNTING STRUCTURE has IC chips having protruding electrodes, a flexible printed circuit board having conductors connected to the protruding electrodes of the IC chips, and a protective plate attached to the flexible printed circuit board. The protective plate has openings to accommodate the driver IC chips. A resin member having a high heat conductivity is arranged in the opening in contact with the surface of the IC chip. The IC chip mounting structure can be attached to a chassis of a plasma display device so that heat generated by the driver IC chip is transferred to the chassis via the heat conductive resin member.
摘要翻译： IC芯片安装结构具有具有突出电极的IC芯片，具有连接到IC芯片的突出电极的导体的柔性印刷电路板以及附接到柔性印刷电路板的保护板。保护板具有容纳驱动器IC芯片的开口。具有高导热性的树脂构件布置在与IC芯片的表面接触的开口中。 IC芯片安装结构可以安装到等离子体显示装置的底盘上，使得由驱动IC芯片产生的热量经由导热树脂部件传送到底架。

8. 发明授权

US5423931A Method and apparatus for removing an electronic component from a board 失效
标题翻译：从电路板上去除电子部件的方法和装置
公开(公告)号：US5423931A
公开(公告)日：1995-06-13
申请号：US109067
申请日：1993-08-19
申请人： Hirokazu Inoue , Masahiro Takasaka , Koichi Watanabe , Takashi Hosokawa , Mamoru Sawahata
发明人： Hirokazu Inoue , Masahiro Takasaka , Koichi Watanabe , Takashi Hosokawa , Mamoru Sawahata
IPC分类号： H01L21/52 , H01L21/58 , H01L21/60 , H05K3/22 , H05K13/04 , B32B35/00
CPC分类号： H01L24/98 , B23K26/402 , H01L24/799 , H05K13/0486 , B23K2203/42 , H01L2224/16225 , H01L2224/2919 , H01L2224/45144 , H01L2224/83192 , H01L2224/8385 , H01L24/83 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01054 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/19043 , H05K3/225 , Y10S156/922 , Y10T156/11 , Y10T29/49721 , Y10T29/53274
摘要： In a method of removing a component from a wiring board to which the component is attached by heat-softenable resin, the improvement is provided of, after softening of the resin by heat and removal of the component, removing residual resin remaining on the board at the location of the component by application of ultraviolet laser radiation having an intensity sufficient to decompose and disperse said residual resin. This can be done without damaging the wiring on the board so that the wiring is re-usable to attach a further electronic component at the same location. Excessive heating of the board can be avoided by measures such as applying a pre-load to the component during softening so that it moves when sufficiently softened, and monitoring the softening.
摘要翻译：在通过可热软化树脂从组件附着的布线板除去组分的方法中，通过加热和除去组分使树脂软化之后，除去残留在板上的剩余树脂，通过施加具有足以分解和分散所述残留树脂的强度的紫外线激光辐射的部件的位置。这可以在不损坏电路板上的布线的情况下完成，使得布线可再利用以将另外的电子部件附接在同一位置。可以通过诸如在软化期间对组分施加预加载以使其在充分软化时移动并监测软化的措施来避免板的过度加热。

9. 发明授权

US5350886A Mounting substrate 失效
标题翻译：安装基板
公开(公告)号：US5350886A
公开(公告)日：1994-09-27
申请号：US659672
申请日：1991-02-25
申请人： Kunio Miyazaki , Yutaka Sugita , Akio Mukoh , Tadahiko Miyoshi , Osamu Miura , Akio Takahashi , Shunichi Numata , Satoru Ogihara , Kazuji Yamada , Hirokazu Inoue , Fumiyuki Kobayashi
发明人： Kunio Miyazaki , Yutaka Sugita , Akio Mukoh , Tadahiko Miyoshi , Osamu Miura , Akio Takahashi , Shunichi Numata , Satoru Ogihara , Kazuji Yamada , Hirokazu Inoue , Fumiyuki Kobayashi
IPC分类号： H01L23/538 , H05K1/03 , H05K3/46 , H05K1/00
CPC分类号： H01L23/5385 , H05K3/462 , H05K3/4629 , H01L2924/0002 , H05K1/0306 , H05K2201/0379 , H05K2203/061
摘要： An LSI mounting substrate having a multilayered thin film wiring portion, with the thin film wiring portion being divided into wiring units each composed of a plurality of wiring layers, with the wirings between the units being electrically connected through connecting pads defined in the same surface as that of a surface conductive layer of the unit.
摘要翻译：一种具有多层薄膜布线部分的LSI安装基板，薄膜布线部分被分成多个布线层的布线单元，各单元之间的布线通过与该单元的表面导电层的那个。

10. 发明授权

US4415385A Diffusion of impurities into semiconductor using semi-closed inner diffusion vessel 失效
标题翻译：使用半封闭内扩散容器将杂质扩散到半导体中
公开(公告)号：US4415385A
公开(公告)日：1983-11-15
申请号：US291042
申请日：1981-08-07
申请人： Osamu Saito , Hideo Homma , Hirokazu Inoue , Naohiro Momma
发明人： Osamu Saito , Hideo Homma , Hirokazu Inoue , Naohiro Momma
IPC分类号： C30B31/10 , H01L21/223
CPC分类号： C30B31/10 , H01L21/223
摘要： A dual-enclosure semi-closed diffusion wherein an outer enclosure is evacuatable and an inner enclosure has a limited aperture, the inner enclosure includes a diffusion vessel having an aperture and a baffle for partially blocking the aperture to leave the limited aperture.The outer enclosure is not directly exposed to impurity vapor and sustains a pressure difference, while the inner enclosure is not subjected to a substantial pressure difference.
摘要翻译：双外壳半封闭扩散，其中外壳是可抽空的并且内壳具有有限的孔，所述内壳包括扩散容器，所述扩散容器具有孔和挡板，用于部分地阻挡孔以离开有限的孔。外壳不会直接暴露于杂质蒸气并保持压力差，而内壳不会受到显着的压差。

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