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1. 发明授权

US5350886A Mounting substrate 失效
标题翻译：安装基板
公开(公告)号：US5350886A
公开(公告)日：1994-09-27
申请号：US659672
申请日：1991-02-25
申请人： Kunio Miyazaki , Yutaka Sugita , Akio Mukoh , Tadahiko Miyoshi , Osamu Miura , Akio Takahashi , Shunichi Numata , Satoru Ogihara , Kazuji Yamada , Hirokazu Inoue , Fumiyuki Kobayashi
发明人： Kunio Miyazaki , Yutaka Sugita , Akio Mukoh , Tadahiko Miyoshi , Osamu Miura , Akio Takahashi , Shunichi Numata , Satoru Ogihara , Kazuji Yamada , Hirokazu Inoue , Fumiyuki Kobayashi
IPC分类号： H01L23/538 , H05K1/03 , H05K3/46 , H05K1/00
CPC分类号： H01L23/5385 , H05K3/462 , H05K3/4629 , H01L2924/0002 , H05K1/0306 , H05K2201/0379 , H05K2203/061
摘要： An LSI mounting substrate having a multilayered thin film wiring portion, with the thin film wiring portion being divided into wiring units each composed of a plurality of wiring layers, with the wirings between the units being electrically connected through connecting pads defined in the same surface as that of a surface conductive layer of the unit.
摘要翻译：一种具有多层薄膜布线部分的LSI安装基板，薄膜布线部分被分成多个布线层的布线单元，各单元之间的布线通过与该单元的表面导电层的那个。

2. 发明授权

US5095359A Semiconductor package and computer using the package 失效
标题翻译：使用封装的半导体封装和计算机
公开(公告)号：US5095359A
公开(公告)日：1992-03-10
申请号：US413622
申请日：1989-09-28
申请人： Akira Tanaka , Hirokazu Inoue , Kazuji Yamada , Kunio Miyazaki , Osamu Miura , Hideo Arakawa , Hiroshi Yokoyama , Yoshio Naganuma , Atsushi Morihara , Katsunori Ouchi
发明人： Akira Tanaka , Hirokazu Inoue , Kazuji Yamada , Kunio Miyazaki , Osamu Miura , Hideo Arakawa , Hiroshi Yokoyama , Yoshio Naganuma , Atsushi Morihara , Katsunori Ouchi
IPC分类号： G06F1/18 , H01L21/60 , H01L23/057 , H01L23/467 , H01L23/498 , H01L23/50 , H01L25/065
CPC分类号： H01L23/467 , H01L23/057 , H01L23/49822 , H01L23/50 , H01L24/32 , H01L25/0655 , H01L2224/16225 , H01L2224/32188 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/49109 , H01L2224/73253 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2924/01004 , H01L2924/01019 , H01L2924/01025 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/15174 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/19041 , H01L2924/30107
摘要： A semiconductor package for use in computers includes a insulating substrate onto which a semiconductor device is mounted, an insulating cap which shuts out outside air and seals said semiconductor device, power-source lines which provide power to the semiconductor device, and signal lines which transmit output signals from the semiconductor device to external circuits. The signal lines are arranged perpendicularly to the insulating substrate so that they are prevented from the dielectric constant of the insulating substrate, while the power-source lines are formed within the insulating substrate and connected through conductive layers parallel to the surface onto which the semiconductor is mounted to external leads.

3. 发明授权

US5045922A Installation structure of integrated circuit devices 失效
标题翻译：集成电路器件的安装结构
公开(公告)号：US5045922A
公开(公告)日：1991-09-03
申请号：US583144
申请日：1990-09-17
申请人： Hironori Kodama , Satoru Ogihara , Hideo Arakawa , Hirokazu Inoue , Yoshiyuki Yasutomi , Tadahiko Miyoshi
发明人： Hironori Kodama , Satoru Ogihara , Hideo Arakawa , Hirokazu Inoue , Yoshiyuki Yasutomi , Tadahiko Miyoshi
IPC分类号： H01L25/18 , H01L23/538 , H01L25/04 , H01L25/065 , H01L25/10 , H05K1/02 , H05K1/03 , H05K1/14 , H05K1/18
CPC分类号： H05K1/0271 , H01L23/5383 , H01L23/5385 , H01L25/0655 , H01L25/105 , H05K1/0206 , H01L2224/16 , H01L2224/16225 , H01L2224/73253 , H01L2225/1005 , H01L2924/01014 , H01L2924/01019 , H01L2924/01079 , H01L2924/09701 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , H05K1/0201 , H05K1/0306 , H05K1/141 , H05K1/181 , H05K2201/068 , H05K2201/10522 , H05K2201/10704 , H05K2201/10734
摘要： An installation structure of integrated circuit devices, in which two or more types of integrated circuit devices of different base materials are installed onto the same installation substrate. Since the installation structure has a construction according to different characteristics such as a thermal conductivity, heat generation amount, thermal expansion coefficient and the like of the integrated circuit devices made of different materials, the reliability of each device and its connection and the reduction of the costs required for the cooling method can be presented.
摘要翻译：集成电路装置的安装结构，其中不同基材的两种或更多种集成电路装置安装在同一安装基板上。由于安装结构具有根据由不同材料制成的集成电路器件的热导率，发热量，热膨胀系数等不同特性的结构，因此每个器件的可靠性及其连接以及减少可以呈现冷却方法所需的成本。

4. 发明授权

US5097318A Semiconductor package and computer using it 失效
标题翻译：半导体封装和使用它的计算机
公开(公告)号：US5097318A
公开(公告)日：1992-03-17
申请号：US331802
申请日：1989-04-03
申请人： Akira Tanaka , Kazuji Yamada , Hirokazu Inoue , Hideo Arakawa , Masahide Okamoto
发明人： Akira Tanaka , Kazuji Yamada , Hirokazu Inoue , Hideo Arakawa , Masahide Okamoto
IPC分类号： H01L23/538 , H01L23/04 , H01L23/057 , H01L23/12 , H01L23/467 , H01L23/498 , H01L23/50
CPC分类号： H01L23/49822 , H01L23/057 , H01L23/467 , H01L23/49838 , H01L2224/32225 , H01L2224/451 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/01004 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15312 , H01L2924/1532 , H01L2924/16152 , H01L2924/16195 , H01L2924/19041 , H01L2924/30107
摘要： A cavity-down type package for a semiconductor device comprises an insulating base substrate on which the semiconductor device and another insulating cap substrate with plural outer connection terminals on its outer surface and with electrodes provided on conductive layers for electric conduction on its inner surface. The electrodes on the insulating base substrate and those on the insulating cap substrate are connected with each other by using conductive material such as bumps.
摘要翻译：一种用于半导体器件的降空型封装，包括其上安装有半导体器件（1）的绝缘基底（6）和在其外表面上具有多个外连接端子（5）的另一绝缘帽衬底（8）其中电极（11）设置在导电层（4）上，用于在其内表面上导电。绝缘基底基板上的电极和绝缘帽基板（8）上的电极通过诸如凸块的导电材料相互连接。

5. 发明授权

US06353258B1 Semiconductor module 失效
标题翻译：半导体模块
公开(公告)号：US06353258B1
公开(公告)日：2002-03-05
申请号：US09603966
申请日：2000-06-26
申请人： Hirokazu Inoue , Ryuichi Saito , Mutsuhiro Mori , Yasutoshi Kurihara , Jin Onuki , Shin Kimura , Satoshi Shimada , Kazuhiro Suzuki , Yukio Kamita , Isao Kobayashi , Kazuji Yamada , Naohiro Momma
发明人： Hirokazu Inoue , Ryuichi Saito , Mutsuhiro Mori , Yasutoshi Kurihara , Jin Onuki , Shin Kimura , Satoshi Shimada , Kazuhiro Suzuki , Yukio Kamita , Isao Kobayashi , Kazuji Yamada , Naohiro Momma
IPC分类号： H01L2334
CPC分类号： H01L23/5386 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/072 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48699 , H01L2224/48747 , H01L2224/49111 , H01L2224/49113 , H01L2224/73265 , H01L2224/85447 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/1301 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/16151 , H01L2924/16315 , H01L2924/181 , H01L2924/2076 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor module has a plurality of power semiconductor devices mounted on a substrate, and a metal foil for wiring is mounted on the substrate so that an asymmetric unit arrangement of the semiconductor devices is formed. In the device, all of the units are arranged in the same direction on the substrate, and all of the units are electrically connected with electrode terminal feet, and the electrode terminal feet are electrically connected with linkage terminal foot. The electrode terminal feet are disposed with a certain interval.
摘要翻译：半导体模块具有安装在基板上的多个功率半导体器件，并且用于布线的金属箔安装在基板上，从而形成半导体器件的不对称单元布置。在该装置中，所有单元在基板上沿相同的方向排列，并且所有单元与电极端子脚电连接，并且电极端子脚与联动端子脚电连接。电极端子脚以一定间隔设置。

6. 发明授权

US5177670A Capacitor-carrying semiconductor module 失效
标题翻译：电容式半导体模块
公开(公告)号：US5177670A
公开(公告)日：1993-01-05
申请号：US832332
申请日：1992-02-07
申请人： Hiroichi Shinohara , Hirokazu Inoue , Yoichi Abe , Akira Kato , Hideo Suzuki , Kazuji Yamada , Masaaki Takahashi , Keiichirou Nakanishi
发明人： Hiroichi Shinohara , Hirokazu Inoue , Yoichi Abe , Akira Kato , Hideo Suzuki , Kazuji Yamada , Masaaki Takahashi , Keiichirou Nakanishi
IPC分类号： H01L23/36 , H01L23/467 , H01L23/48 , H01L23/498 , H01L23/64
CPC分类号： H01L24/73 , H01L23/36 , H01L23/467 , H01L23/481 , H01L23/49822 , H01L23/642 , H01L2224/16 , H01L2224/16235 , H01L2224/48227 , H01L2224/73253 , H01L2224/73257 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01056 , H01L2924/0106 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , Y10S257/924
摘要： Noise generated at high frequencies at the time of simultaneous switchings of logical circuits is reduced by lowering an inductance from LSI to a capacitor formed on a substrate. The capacitor is formed to ensure that an inductance from a bonding pad for the LSI loaded on the substrate to an electrode of the capacitor is 0.05 nanohenry. The lower inductance from the LSI to the capacitor allows a reduction in the amount of the noise at high frequencies among those generated in power supply system, whereby the rising time of signals is made shorter, and the speed of arithmetic operation can be increased.
摘要翻译：通过降低从LSI到形成在基板上的电容器的电感，可以降低在同时切换逻辑电路时在高频时产生的噪声。形成电容器以确保来自负载在基板上的LSI的焊盘与电容器的电极的电感为0.05纳秒。从LSI到电容器的较低的电感允许在电源系统中产生的那些电路中的高频噪声量的减少，从而使信号的上升时间更短，并且可以提高算术运算速度。

7. 发明授权

US06452261B1 Flat semiconductor device and power converter employing the same 失效
标题翻译：平板半导体器件和采用该半导体器件的功率转换器
公开(公告)号：US06452261B1
公开(公告)日：2002-09-17
申请号：US09380645
申请日：1999-09-07
申请人： Hironori Kodama , Masahiro Nagasu , Hirokazu Inoue , Yasuo Osone , Shigeta Ueda , Kazuji Yamada
发明人： Hironori Kodama , Masahiro Nagasu , Hirokazu Inoue , Yasuo Osone , Shigeta Ueda , Kazuji Yamada
IPC分类号： H01L2348
CPC分类号： H01L25/112 , H01L25/072 , H01L2924/0002 , H01L2924/00
摘要： Control electrode wirings which are led out from control electrodes over a number of chips built in a flat package and insulating members which are provided in order to insulate the control electrode wirings from main electrode wirings are also given function of positioning of the respective semiconductor chips in the flat package. Further, a one-piece control electrode wiring net is housed in the common electrodes of the package and the electrodes which are led out from the control electrodes of the respective semiconductor chips are connected to the net to simplify the processing of a large number of gate signal wirings.
摘要翻译：从控制电极引出的内置在平坦封装中的多个芯片的控制电极布线以及为了使控制电极布线与主电极布线绝缘而设置的绝缘构件也具有将各个半导体芯片定位在扁平包装。此外，一体式控制电极布线网被容纳在封装的公共电极中，并且从各个半导体芯片的控制电极引出的电极连接到网以简化大量栅极的处理信号线。

8. 发明申请

US20140126259A1 GRID-CONNECTED INVERTER APPARATUS AND CONTROL METHOD THEREFOR 有权
标题翻译：网格连接的逆变器装置及其控制方法
公开(公告)号：US20140126259A1
公开(公告)日：2014-05-08
申请号：US14129882
申请日：2012-06-28
申请人： Hirokazu Inoue
发明人： Hirokazu Inoue
IPC分类号： H02M7/5387
CPC分类号： H02M7/5387 , G01R31/3275 , H02J3/381 , H02J3/383 , H02J3/386 , H02J3/387 , H02M1/32 , H02M7/48 , Y02E10/563 , Y02E10/763
摘要： A grid-connected inverter apparatus includes: an inverter 50 for converting a DC output based on power generated from a power generation equipment 100 into an AC; a DC voltage measuring unit 40 for measuring a DC voltage on a DC input side of the inverter 50; a grid interconnection switch 70 having two independent relay switches 71, 72 each corresponding to phases of a grid power system 110 to which the inverter 50 is connected; and a control unit 90 for controlling the two relay switches 71, 72, such that the control unit 90, after opening the two relay switches 71, 72, changes the relay switch 71 such that the opening control is changes to closing control and, based on a change in the DC voltage measured by the DC voltage measuring unit 40 before and after the changing control, determines whether the relay switch 72 is faulty.
摘要翻译：并网逆变器装置包括：反相器50，用于将基于从发电设备100产生的电力的直流输出转换为交流电; 用于测量逆变器50的直流输入侧的直流电压的直流电压测量单元40; 电网互连开关70具有两个独立的继电器开关71,72，每个独立的继电器开关71,72对应于逆变器50连接到的电力系统110的相位; 以及用于控制两个继电器开关71,72的控制单元90，使得控制单元90在打开两个继电器开关71,72之后改变继电器开关71，使得开启控制变为关闭控制，并且基于在改变控制之前和之后由直流电压测量单元40测量的直流电压的变化确定继电器开关72是否故障。

9. 发明申请

US20090245324A1 COMPOUND SENSOR 审中-公开
标题翻译：化合物传感器
公开(公告)号：US20090245324A1
公开(公告)日：2009-10-01
申请号：US12310389
申请日：2008-03-13
申请人： Hideki Sunaga , Hirokazu Inoue , Yutaka Nakamura , Katsuyuki Urayama , Shuji Hojo
发明人： Hideki Sunaga , Hirokazu Inoue , Yutaka Nakamura , Katsuyuki Urayama , Shuji Hojo
IPC分类号： G01K13/00 , G01N7/00 , G01N33/497 , G01J5/00 , G01J1/44
CPC分类号： G01K1/14 , B60H1/00792 , G01J1/02 , G01J1/0204 , G01J1/0271 , G01J1/4228 , G01J5/0022 , G01J5/0025 , G01J5/0846 , G01J2001/4266 , G01K1/08 , G01K2201/02
摘要： A compound sensor which can improve the space for installing sensors and an operation for installing sensors by organizing various types of sensors, are provided. A compound sensor according to the present invention includes a light-shielding plate (3A) having one face onto which sunlight is irradiated and the other face located on a side opposite to the one face, which shields the sunlight from the one face side toward the other face side, a solar sensor (8A-8C) provided in the one face of the light-shielding plate (3A), and a temperature sensor provided in the other face side of the light-shielding plate (3A).
摘要翻译：提供了一种复合传感器，其可以改善用于安装传感器的空间和通过组织各种类型的传感器来安装传感器的操作。根据本发明的复合传感器包括一个遮光板（3A），该遮光板（3A）具有一个被照射的阳光的面，另一个面位于与一个面相反的一侧，该遮光板将阳光从一个面侧遮挡设置在遮光板（3A）的一个面上的太阳能传感器（8A-8C）和设在遮光板（3A）的另一面侧的温度传感器。

10. 发明授权

US06867528B2 Dynamoelectric machine and method for mounting a brush assembly to a brush holder 有权
标题翻译：电动机和用于将电刷组件安装到电刷架上的方法
公开(公告)号：US06867528B2
公开(公告)日：2005-03-15
申请号：US10459509
申请日：2003-06-12
申请人： Hirokazu Inoue , Hidehiko Kitahara , Hideyuki Hayashi , Tomoki Takahashi
发明人： Hirokazu Inoue , Hidehiko Kitahara , Hideyuki Hayashi , Tomoki Takahashi
IPC分类号： H01R39/40 , H02K13/00 , H02K15/02 , H02K19/00
CPC分类号： H01R39/40
摘要： A brush assembly is constructed such that a brush and a brush terminal are linked by means of a pigtail, a brush spring is disposed under compression between the brush and the brush terminal, and a cylindrical guide is disposed near the brush terminal inside the brush spring.
摘要翻译：电刷组件被构造成使得电刷和电刷端子通过引线连接，刷子弹簧设置在电刷和电刷端子之间的压缩下，并且圆柱形引导件设置在电刷端子的刷子弹簧内部。

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