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    • 1. 发明授权
    • Method of forming and removing resist pattern
    • 形成和去除抗蚀剂图案的方法
    • US5252433A
    • 1993-10-12
    • US667986
    • 1991-03-12
    • Hirofumi FujiokaYasuhiro YoshidaHiroyuki NakajimaHitoshi NagataShinji Kishimura
    • Hirofumi FujiokaYasuhiro YoshidaHiroyuki NakajimaHitoshi NagataShinji Kishimura
    • G03F7/038C08F30/00C08F30/04C08F30/10G03F7/039G03F7/26G03F7/42H01L21/027H01L21/30G03C5/00G03C5/16
    • G03F7/265G03F7/422
    • The present invention is directed to a method of forming and removing a resist pattern, used in a semiconductor manufacture. In a first mode of the present invention, an upper resist layer containing germanium is selectively formed on a bottom resist layer and a resist pattern is formed with the upper resist layer as a mask. In a second mode of the present invention, a resist layer formed on a substrate is selectively exposed to introduce a germanium compound into the exposed portions and the above described resist layer is subjected to an anisotropic dry etching to remove the nonexposed portions of the resist layer, whereby forming a resist pattern. Accordingly, the fine pattern can be formed on the substrate in high accuracy by the use of the above described resist pattern. In addition, in the first and the second modes of the present invention, the resist pattern is removed by the use of an acid having an oxidizing power, so that the resist pattern can be easily removed from the substrate.
    • 本发明涉及用于半导体制造中的形成和去除抗蚀剂图案的方法。 在本发明的第一模式中,在底部抗蚀剂层上选择性地形成含有锗的上抗蚀剂层,并且以上抗蚀剂层形成抗蚀剂图案作为掩模。 在本发明的第二方式中,选择性地暴露在基板上形成的抗蚀剂层,以将锗化合物引入到暴露部分中,并且对上述抗蚀剂层进行各向异性干法蚀刻以除去抗蚀剂层的未曝光部分 ,从而形成抗蚀剂图案。 因此,可以通过使用上述抗蚀剂图案以高精度在基板上形成精细图案。 此外,在本发明的第一和第二模式中,通过使用具有氧化能力的酸去除抗蚀剂图案,使得抗蚀剂图案可以容易地从基板去除。
    • 2. 发明授权
    • Method of forming and removing resist pattern
    • 形成和去除抗蚀剂图案的方法
    • US5426016A
    • 1995-06-20
    • US87100
    • 1993-07-07
    • Hirofumi FujiokaYasuhiro YoshidaHiroyuki NakajimaHitoshi NagataShinji Kishimura
    • Hirofumi FujiokaYasuhiro YoshidaHiroyuki NakajimaHitoshi NagataShinji Kishimura
    • G03F7/038C08F30/00C08F30/04C08F30/10G03F7/039G03F7/26G03F7/42H01L21/027H01L21/30G03C5/00
    • G03F7/265G03F7/422
    • The present invention is directed to a method of forming and removing a resist pattern, used in a semiconductor manufacture.In a first mode of the present invention, an upper resist layer containing germanium is selectively formed on a bottom resist layer and a resist pattern is formed with the upper resist layer as a mask. In a second mode of the present invention, a resist layer formed on a substrate is selectively exposed to introduce a germanium compound into the exposed portions and the above described resist layer is subjected to an anisotropic dry etching to remove the nonexposed portions of the resist layer, whereby forming a resist pattern. Accordingly, the fine pattern can be formed on the substrate in high accuracy by the use of the above described resist pattern. In addition, in the first and the second modes of the present invention, the resist pattern is removed by the use of an acid having an oxidizing power, so that the resist pattern can be easily removed from the substrate.
    • 本发明涉及用于半导体制造中的形成和去除抗蚀剂图案的方法。 在本发明的第一模式中,在底部抗蚀剂层上选择性地形成含有锗的上抗蚀剂层,并且以上抗蚀剂层形成抗蚀剂图案作为掩模。 在本发明的第二模式中,选择性地暴露形成在基板上的抗蚀剂层,以将锗化合物引入到暴露部分中,并且对上述抗蚀剂层进行各向异性干蚀刻以除去抗蚀剂层的未涂覆部分 ,从而形成抗蚀剂图案。 因此,可以通过使用上述抗蚀剂图案以高精度在基板上形成精细图案。 此外,在本发明的第一和第二模式中,通过使用具有氧化能力的酸去除抗蚀剂图案,使得抗蚀剂图案可以容易地从基板去除。
    • 6. 发明授权
    • Method for semiconductor device manufacturing to include multistage chemical vapor deposition of material oxide film
    • 半导体器件制造方法包括材料氧化膜的多级化学气相沉积
    • US06939760B2
    • 2005-09-06
    • US10609476
    • 2003-07-01
    • Hirofumi FujiokaKenichi KoyanagiHiroyuki Kitamura
    • Hirofumi FujiokaKenichi KoyanagiHiroyuki Kitamura
    • C23C16/44C23C16/40C23C16/455G11C7/00H01L21/02H01L21/205H01L21/316H01L21/8242H01L27/108
    • H01L21/0228C23C16/405C23C16/45553H01L21/02181H01L21/02183H01L21/02189H01L21/31637H01L27/10852H01L28/40
    • There is provided a method for manufacturing a semiconductor device including a capacitor having a lower electrode, an upper electrode and a capacitive insulating film between the lower electrode and the upper electrode on a semiconductor substrate, wherein the capacitive insulating film is formed on the lower electrode over the semiconductor substrate using a chemical vapor deposition method, the method including: a lower electrode forming step of forming the lower electrode on the semiconductor, a dual-stage deposition step including a first stage for introducing a material gas containing a specified metal into a reactor in which the semiconductor substrate is placed and a second stage for subsequently introducing an oxidizing gas into the reactor, and wherein a metal oxide film as an oxide of the specified metal is formed on the lower electrode over the semiconductor substrate, by repeating the dual-stage deposition step two or more times, thereby forming the capacitive insulating film; and an upper electrode forming step of forming the upper electrode on the capacitive insulating film. Thus, it is possible to obtain the capacitive insulating film having good step coverage and a good film quality, without reducing throughput.
    • 提供一种制造半导体器件的方法,该半导体器件包括在半导体衬底上的下电极和上电极之间具有下电极,上电极和电容绝缘膜的电容器,其中电容绝缘膜形成在下电极 在半导体基板上使用化学气相沉积法,该方法包括:在半导体上形成下电极的下电极形成步骤,包括用于将含有特定金属的材料气体引入到第一级的第一级的双级沉积步骤 其中放置半导体衬底的反应器和用于随后将氧化气体引入反应器的第二阶段,并且其中在半导体衬底上的下电极上形成作为特定金属的氧化物的金属氧化物膜, 阶段沉积步骤两次或更多次,从而形成电容绝缘f ; 以及在电容绝缘膜上形成上电极的上电极形成步骤。 因此,可以获得具有良好的台阶覆盖率和良好的膜质量的电容绝缘膜,而不降低生产量。