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    • 5. 发明授权
    • Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures
    • 临时平面电接触装置和使用垂直压缩的纳米管接触结构的方法
    • US07439731B2
    • 2008-10-21
    • US11426249
    • 2006-06-23
    • Douglas E. CraftsJyoti K. Bhardwaj
    • Douglas E. CraftsJyoti K. Bhardwaj
    • G01R31/28G01R31/02
    • G01R1/07357G01R1/073
    • A wafer-scale probe card for temporary electrical contact to a sample wafer or other device, for burn-in and test. The card includes a plurality of directly metallized single-walled or multi-walled nanotubes contacting a pre-arranged electrical contact pattern on the probe card substrate. The nanotubes are arranged into bundles for forming electrical contacts between areas of the device under test and the probe card. The bundles are compressible along their length to allow a compressive force to be used for contacting the probe card substrate to the device under test. A strengthening material may be disposed around and/or infiltrate the bundles. The nanotubes forming the bundles may be patterned to provide a pre-determined bundle profile. Tips of the bundles may be metallized with a conductive material to form a conformal coating on the bundles; or metallized with a conductive material to form a continuous, single contact surface.
    • 用于临时电接触样品晶片或其他器件的晶片级探针卡,用于老化和测试。 该卡包括多个直接金属化的单壁或多壁纳米管,其接触探针卡基底上的预先布置的电接触图案。 纳米管被布置成束,用于在被测试器件的区域和探针卡之间形成电触头。 束沿其长度可压缩,以允许使用压缩力将探针卡基片接触到被测器件。 加强材料可以围绕和/或渗透束布置。 形成束的纳米管可以被图案化以提供预定的束分布。 束的尖端可以用导电材料金属化以在束上形成保形涂层; 或用导电材料金属化以形成连续的单个接触表面。
    • 6. 发明授权
    • Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures
    • 临时平面电接触装置和使用垂直压缩的纳米管接触结构的方法
    • US07710106B2
    • 2010-05-04
    • US12211354
    • 2008-09-16
    • Douglas E. CraftsJyoti K. Bhardwaj
    • Douglas E. CraftsJyoti K. Bhardwaj
    • G01R31/02
    • G01R1/07357G01R1/073
    • A wafer-scale probe card for temporary electrical contact to a sample wafer or other device, for burn-in and test. The card includes a plurality of directly metallized single-walled or multi-walled nanotubes contacting a pre-arranged electrical contact pattern on the probe card substrate. The nanotubes are arranged into bundles for forming electrical contacts between areas of the device under test and the probe card. The bundles are compressible along their length to allow a compressive force to be used for contacting the probe card substrate to the device under test. A strengthening material may be disposed around and/or infiltrate the bundles. The nanotubes forming the bundles may be patterned to provide a pre-determined bundle profile. Tips of the bundles may be metallized with a conductive material to form a conformal coating on the bundles; or metallized with a conductive material to form a continuous, single contact surface.
    • 用于临时电接触样品晶片或其他器件的晶片级探针卡,用于老化和测试。 该卡包括多个直接金属化的单壁或多壁纳米管,其接触探针卡基底上的预先布置的电接触图案。 纳米管被布置成束,用于在被测试器件的区域和探针卡之间形成电触头。 束沿其长度可压缩,以允许使用压缩力将探针卡基片接触到被测器件。 加强材料可以围绕和/或渗透束布置。 形成束的纳米管可以被图案化以提供预定的束分布。 束的尖端可以用导电材料金属化以在束上形成保形涂层; 或用导电材料金属化以形成连续的单个接触表面。
    • 7. 发明授权
    • Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures
    • 临时平面电接触装置和使用垂直压缩的纳米管接触结构的方法
    • US08638113B2
    • 2014-01-28
    • US12773117
    • 2010-05-04
    • Douglas E. CraftsJyoti K. Bhardwaj
    • Douglas E. CraftsJyoti K. Bhardwaj
    • G01R31/20
    • G01R1/07357G01R1/073
    • A wafer-scale probe card for temporary electrical contact to a sample wafer or other device, for burn-in and test. The card includes a plurality of directly metallized single-walled or multi-walled nanotubes contacting a pre-arranged electrical contact pattern on the probe card substrate. The nanotubes are arranged into bundles for forming electrical contacts between areas of the device under test and the probe card. The bundles are compressible along their length to allow a compressive force to be used for contacting the probe card substrate to the device under test. A strengthening material may be disposed around and/or infiltrate the bundles. The nanotubes forming the bundles may be patterned to provide a pre-determined bundle profile. Tips of the bundles may be metallized with a conductive material to form a conformal coating on the bundles; or metallized with a conductive material to form a continuous, single contact surface.
    • 用于临时电接触样品晶片或其他器件的晶片级探针卡,用于老化和测试。 该卡包括多个直接金属化的单壁或多壁纳米管,其接触探针卡基底上的预先布置的电接触图案。 纳米管被布置成束,用于在被测试器件的区域和探针卡之间形成电触头。 束沿其长度可压缩,以允许使用压缩力将探针卡基片接触到被测器件。 加强材料可以围绕和/或渗透束布置。 形成束的纳米管可以被图案化以提供预定的束分布。 束的尖端可以用导电材料金属化以在束上形成保形涂层; 或用导电材料金属化以形成连续的单个接触表面。