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    • 5. 发明授权
    • Substrate inspection system including a visual inspection device for inspection by image processing
    • 基板检查系统,包括通过图像处理检查的目视检查装置
    • US07672501B2
    • 2010-03-02
    • US11517651
    • 2006-09-08
    • Taku MinakataYoshiki Fujii
    • Taku MinakataYoshiki Fujii
    • G06K9/00G01N21/00
    • G06T7/0004G06T2207/30141
    • A substrate inspection system is formed with an inspection device associated with a reflow process at the end of a series of production processes for substrates, image collectors each associated with a different one of the production processes upstream to the reflow process and an image display device for receiving images from the inspection device and the image collector and displaying the received images. The inspection device inspects a specified number of substrates to obtain measured values and calculates a margin for each component with respect to a specified reference value and transmits to the image collectors and the image display device the component code of the component with a small margin value. The image collectors save the image corresponding to the component code from the inspection device. The image display device receives images of the component corresponding to the component code from the inspection device and the image collectors and display images of the same component and the same substrate at each process.
    • 基板检查系统在基板的一系列生产过程结束时形成有与回流工艺相关联的检查装置,每个与回流处理上游的不同的生产工艺相关联的图像收集器和图像显示装置, 从检查装置和图像采集器接收图像并显示接收到的图像。 检查装置检查指定数量的基板以获得测量值,并且针对指定的参考值计算每个部件的余量,并向图像收集器和图像显示装置发送具有小裕度值的部件的部件代码。 图像采集器从检查装置保存与分量代码对应的图像。 图像显示装置在每个处理中从检查装置和图像收集器接收对应于分量代码的分量的图像并显示相同分量和相同基底的图像。
    • 6. 发明授权
    • Method for processing dynamic pressure groove of fluid dynamic bearing
    • 流体动力轴承动压槽加工方法
    • US06532662B2
    • 2003-03-18
    • US09803672
    • 2001-03-12
    • Yasuhiro KobayashiYoshiki FujiiTakeshi Takahashi
    • Yasuhiro KobayashiYoshiki FujiiTakeshi Takahashi
    • B21K110
    • F16C33/107B23H9/00B23H2200/10Y10T29/49639
    • According to this dynamic pressure groove processing method, dynamic pressure grooves are formed in specified regions by electrochemical machining with the electrode of an electrode tool put close to a workpiece in the initial stage. Through this electrochemical machining, corners of land portions adjacent to the dynamic pressure grooves can be curved and smoothed. Next, by subjecting the workpiece to electrochemical machining with the electrode of the electrode tool put away from the workpiece, the land portions are to undergo weak electrochemical machining. Surface roughness of surfaces of the land portions can be reduced, and the curved corners of the land portions can be made smoother at the same time. Therefore, the abrasion resistance characteristic of the dynamic pressure grooves can be improved further than that achieved by the conventional electrochemical machining, allowing the abrasion resistance characteristic and reliability to be sufficiently improved.
    • 根据该动态压槽加工方法,通过电化学加工在特定区域形成动压槽,其中初始阶段将电极工具的电极靠近工件放置。 通过这种电化学加工,与动态压力槽相邻的陆部的角部可以是弯曲和平滑的。 接下来,通过将电极工具的电极放置在远离工件的状态下对工件进行电化学加工,焊盘部分将进行弱电化学加工。 可以减少陆部的表面的表面粗糙度,同时可以使陆部的弯曲角变得更平滑。 因此,与现有的电化学加工相比,能够进一步提高动压槽的耐磨耗特性,能够充分提高耐磨特性和可靠性。
    • 9. 发明申请
    • Mounting-error inspecting method and substrate inspecting apparatus using the method
    • 使用该方法的安装误差检测方法和基板检查装置
    • US20050190956A1
    • 2005-09-01
    • US10786605
    • 2004-02-26
    • Yoshiki FujiiHiroshi Yamazaki
    • Yoshiki FujiiHiroshi Yamazaki
    • G01N21/88G06K9/00H01L21/00H05K13/08
    • G01N21/8851H01L21/67253H01L21/67294H05K13/08
    • When a component is replaced or replenished in a predetermined feeder, mounters 3A and 3B refer to mount data in accordance with the feeder number for the feeder and read out the mounting position of the replaced or replenished component. The mounting position data is transmitted to a substrate inspecting apparatus 5 together with the substrate identification code of a substrate first processed after reel replacement. When the substrate corresponding to the substrate identification code is supplied, the substrate inspecting apparatus 5 refers to substrate inspection data in accordance with the mounting position data, specifies a component to be inspected, and executes the mounting error inspection according to character-string recognition for the specified component. When a mounting error is detected in this inspection, the substrate inspecting apparatus 5 transmits no-good determination to the mounters 3A and 3B receiving information.
    • 当在预定的进料器中更换或补充组件时,安装器3 A和3 B根据进料器的进料器编号来指定安装数据,并读出更换或补充的部件的安装位置。 安装位置数据连同在卷轴更换之后首先处理的基板的基板识别码一起传送到基板检查装置5。 当提供与基板识别码相对应的基板时,基板检查装置5根据安装位置数据参考基板检查数据,指定要检查的部件,并且根据字符串识别执行安装错误检查 指定的组件。 当在该检查中检测到安装错误时,基板检查装置5向接收器3A和3B接收信息发送不良判定。