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    • 1. 发明申请
    • Thermal-reaction type flame-retardant pressure-sensitive adhesive tape and process for producing the same
    • 热反应型阻燃性粘合带及其制造方法
    • US20050227065A1
    • 2005-10-13
    • US10344276
    • 2002-08-19
    • Hiroaki NishimuraTakahiro SakaiKazuo Nate
    • Hiroaki NishimuraTakahiro SakaiKazuo Nate
    • C08L33/00C09J4/00C09J7/02C09J11/04B32B27/06B32B31/00
    • C09J11/04C08L33/00C09J4/00C09J7/385Y10T428/2852
    • A thermo-reactive flame-retardant adhesive tape having high flame-retardancy and a method for producing the same are disclosed. The adhesive tape comprises a substrate and a solvent-less type photo-curing pressure-sensitive adhesive applied onto the substrate, the solvent-less type photo-curing pressure-sensitive adhesive comprising a photo-curing pressure-sensitive adhesive, as well as a dripping inhibitor and a flame retardant both added into the photo-curing pressure-sensitive adhesive, the photo-curing pressure-sensitive adhesive containing as main components at least a (metha)acrylic acid alkyl ester monomer, a polar group-containing monomer, and a photo-polymerization initiator. Based on 100 parts by weight of the photo-curing pressure-sensitive adhesive, 5-50 parts by weight of a hydroxyl-containing monomer having a photo-active functional group, as well as 5-100 parts by weight of phosphazene and 10-200 parts by weight of hydrated alumina, are added as the dripping inhibitor and the flame retardant, respectively, to the photo-curing pressure-sensitive adhesive.
    • 公开了一种具有高阻燃性的热反应性阻燃性粘合带及其制造方法。 粘合带包括施加到基材上的基材和无溶剂型光固化压敏粘合剂,包含光固化压敏粘合剂的无溶剂型光固化压敏粘合剂以及 滴加抑制剂和阻燃剂都加入到光固化压敏粘合剂中,光固化压敏粘合剂含有至少一种(甲基)丙烯酸烷基酯单体,含极性基团的单体和 光聚合引发剂。 基于100重量份光固化压敏粘合剂,将5-50重量份具有光活性官能团的含羟基单体以及5-100重量份磷腈和10- 将200重量份水合氧化铝分别作为滴加抑制剂和阻燃剂加入到光固化压敏粘合剂中。
    • 6. 发明授权
    • Process for forming an organic thin film
    • 用于形成有机薄膜的方法
    • US4604294A
    • 1986-08-05
    • US660230
    • 1984-10-12
    • Masahiro TanakaKazufumi AzumaKazuo NateMitsuo Nakatani
    • Masahiro TanakaKazufumi AzumaKazuo NateMitsuo Nakatani
    • G03C1/76B05D3/06B05D7/24
    • B05D1/60B05D3/06
    • An organic thin film consisting essentially of an organic compound is formed on a substrate surface by vacuum vapor deposition by exposing the organic compound as a vapor source to a laser beam having an energy level corresponding to that of the chemical bond of the organic compound, thereby sputtering the organic compound onto a substrate surface in vacuum and forming the organic thin film thereon. When a light or radiation-sensitive organic compound is used as the vapor source, a light or radiation-sensitive resist film is formed. The thin film thus formed retains the original chemical structure of the vapor source, and has a good flatness. Resolvability of resist film is improved owing to the absence of pin holes and particulate matters. A resist film having a higher sensitivity and a better contrast is formed by heating the substrate during the vapor deposition.
    • 通过将有机化合物作为蒸汽源暴露于具有与有机化合物的化学键的能级对应的能级的激光束,通过真空汽相沉积在基板表面上形成基本上由有机化合物构成的有机薄膜,由此 在真空中将有机化合物溅射到基板表面上并在其上形成有机薄膜。 当使用光或辐射敏感的有机化合物作为蒸气源时,形成光或辐射敏感的抗蚀剂膜。 由此形成的薄膜保持蒸气源的原始化学结构,并且具有良好的平坦度。 由于没有针孔和颗粒物质,抗蚀剂膜的可分离性得到改善。 通过在气相沉积期间加热基底来形成具有更高灵敏度和更好对比度的抗蚀剂膜。