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    • 3. 发明申请
    • ELECTRO-OPTIC DEVICE AND PROJECTION-TYPE DISPLAY APPARATUS
    • 电光装置和投影型显示装置
    • US20120120357A1
    • 2012-05-17
    • US13232479
    • 2011-09-14
    • Hiroaki Jiroku
    • Hiroaki Jiroku
    • G02F1/1337G02F1/1333
    • G02F1/136227G02F2201/50
    • An electro-optic device is provided with an substrate, in which a stress relieving film formed of a doped silicon oxide film is formed between a third interlayer insulating film formed of a non-doped silicon oxide film and a pixel electrode formed of an aluminum film or the like. The stress relieving film is formed of the doped silicon oxide film, has a thermal expansion coefficient different from that of the third interlayer insulating film, comes in contact with the third interlayer insulating film, has a thermal expansion coefficient different from that of the pixel electrode, and comes in contact with the pixel electrode. The thermal expansion coefficients are in the following relation of Third Interlayer Insulating Film
    • 电光装置设置有基板,其中由掺杂氧化硅膜形成的应力消除膜形成在由非掺杂氧化硅膜形成的第三层间绝缘膜和由铝膜形成的像素电极之间 或类似物。 应力消除膜由掺杂的氧化硅膜形成,其热膨胀系数与第三层间绝缘膜的热膨胀系数不同,与第三层间绝缘膜接触,具有与像素电极不同的热膨胀系数 并与像素电极接触。 热膨胀系数与第三层间绝缘膜<应力消除膜<像素电极的关系如下。
    • 8. 发明授权
    • Electro-optic device and projection-type display apparatus
    • 电光装置和投影型显示装置
    • US08994904B2
    • 2015-03-31
    • US13232479
    • 2011-09-14
    • Hiroaki Jiroku
    • Hiroaki Jiroku
    • G02F1/1333G02F1/1362
    • G02F1/136227G02F2201/50
    • An electro-optic device is provided with an substrate, in which a stress relieving film formed of a doped silicon oxide film is formed between a third interlayer insulating film formed of a non-doped silicon oxide film and a pixel electrode formed of an aluminum film or the like. The stress relieving film is formed of the doped silicon oxide film, has a thermal expansion coefficient different from that of the third interlayer insulating film, comes in contact with the third interlayer insulating film, has a thermal expansion coefficient different from that of the pixel electrode, and comes in contact with the pixel electrode. The thermal expansion coefficients are in the following relation of Third Interlayer Insulating Film
    • 电光装置设置有基板,其中由掺杂氧化硅膜形成的应力消除膜形成在由非掺杂氧化硅膜形成的第三层间绝缘膜和由铝膜形成的像素电极之间 或类似物。 应力消除膜由掺杂的氧化硅膜形成,其热膨胀系数与第三层间绝缘膜的热膨胀系数不同,与第三层间绝缘膜接触,具有与像素电极不同的热膨胀系数 并与像素电极接触。 热膨胀系数与第三层间绝缘膜<应力消除膜<像素电极的关系如下。
    • 10. 发明授权
    • Semiconductor device comprising planarized light-shielding island films for thin-film transistors
    • 半导体器件包括用于薄膜晶体管的平坦化屏蔽岛膜
    • US07804096B2
    • 2010-09-28
    • US11296386
    • 2005-12-08
    • Hiroaki Jiroku
    • Hiroaki Jiroku
    • G02F1/1335H01L29/786
    • H01L29/78633H01L29/66757
    • A semiconductor device includes: a substrate; a plurality of island-shaped light shielding films formed on the substrate; a first insulating film formed between the plurality of light shielding films; a second insulating film formed on the first insulating film and the plurality of light shielding films; and semiconductor elements each having a semiconductor film. The step difference is not generated between an interface between the first insulating film and the second insulating film and an interface between each of the plurality of light shielding films and the second insulating film. Each of the plurality of light shielding films is disposed between each of the semiconductor films and the substrate.
    • 半导体器件包括:衬底; 形成在所述基板上的多个岛状遮光膜; 形成在所述多个遮光膜之间的第一绝缘膜; 形成在所述第一绝缘膜和所述多个遮光膜上的第二绝缘膜; 以及各自具有半导体膜的半导体元件。 在第一绝缘膜和第二绝缘膜之间的界面与多个遮光膜和第二绝缘膜之间的界面之间不产生阶梯差。 多个遮光膜中的每一个设置在每个半导体膜和基板之间。