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1. 发明授权

US08963672B2 Wiring board 有权
标题翻译：接线板
公开(公告)号：US08963672B2
公开(公告)日：2015-02-24
申请号：US14129148
申请日：2012-06-21
申请人： Hiroaki Asano , Yasuhiro Koike , Kiminori Ozaki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
发明人： Hiroaki Asano , Yasuhiro Koike , Kiminori Ozaki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
IPC分类号： H01F27/29 , H01F27/28 , H05K1/11 , H05K3/20 , H05K1/16 , H05K1/02
CPC分类号： H05K1/115 , H01F27/2804 , H05K1/0265 , H05K1/0268 , H05K1/0298 , H05K1/118 , H05K1/165 , H05K3/20 , H05K2201/0305 , H05K2201/0391 , H05K2201/09036 , H05K2201/0969 , H05K2201/09736 , H05K2201/09745
摘要： This wiring board is provided with an insulating core substrate, a first conductor pattern, a second conductor pattern, and a conductive material. The first conductor pattern and the second conductor pattern are adhered to the insulating core substrate. The second conductor pattern has a first surface and a second surface. The second conductor pattern has a concavity and a through-hole. The opening of the concavity that opens to the first surface and the opening of the through hole that opens to the first surface are interconnected to each other. The first conductor pattern is positioned at the opening of the concavity. The first conductor pattern and the second conductor pattern are electrically connected by means of the conductive material, which fills from the opening of the through hole that opens to the second surface.
摘要翻译：该布线板设置有绝缘芯基板，第一导体图案，第二导体图案和导电材料。第一导体图案和第二导体图案粘附到绝缘芯基板。第二导体图案具有第一表面和第二表面。第二导体图案具有凹部和通孔。通向第一表面的凹部的开口和通向第一表面的通孔的开口相互连接。第一导体图案位于凹部的开口处。第一导体图案和第二导体图案通过导电材料电连接，导电材料从通孔的开口填充到第二表面。

2. 发明申请

US20140251659A1 CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRCUIT BOARD 审中-公开
标题翻译：电路板和电路板的制造方法
公开(公告)号：US20140251659A1
公开(公告)日：2014-09-11
申请号：US14129408
申请日：2012-07-02
申请人： Hiroaki Asano , Yasuhiro Koike , Kiminori Ozaki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
发明人： Hiroaki Asano , Yasuhiro Koike , Kiminori Ozaki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
IPC分类号： H05K1/11 , H05K3/30 , H05K1/09 , H05K3/00 , H05K1/02 , H05K1/18
CPC分类号： H05K1/115 , H05K1/0201 , H05K1/0272 , H05K1/09 , H05K1/185 , H05K3/0058 , H05K3/0061 , H05K3/30 , H05K3/341 , H05K3/38 , H05K3/4038 , H05K2201/0305 , H05K2201/09063 , H05K2201/0969 , H05K2203/1178 , Y10T29/4913
摘要： A circuit board, onto which an electronic component is to be mounted, is provided with insulating core substrates and patterned metal plates. The metal plates are bonded to at least one side of the insulating core substrates. The insulating core substrates and the metal plates form a laminated body, in which a gas-vent hole is provided. The gas-vent hole is formed so that when the electronic component is mounted, the gas present between the insulating core substrates and the metal plates expands and is released to a side open to the atmosphere via the gas-vent hole.
摘要翻译：安装有电子部件的电路板设置有绝缘芯基板和图案化的金属板。金属板结合到绝缘芯基板的至少一侧。绝缘芯基板和金属板形成层压体，其中设有排气孔。排气孔形成为使得当安装电子部件时，存在于绝缘芯基板和金属板之间的气体膨胀并且经由排气孔被释放到大气开放的一侧。

3. 发明授权

US09332638B2 Wiring board and method for manufacturing wiring board 有权
标题翻译：接线板及制造接线板的方法
公开(公告)号：US09332638B2
公开(公告)日：2016-05-03
申请号：US14118636
申请日：2012-05-23
申请人： Kiminori Ozaki , Yasuhiro Koike , Hiroaki Asano , Harumitsu Sato , Hiroki Watanabe , Tadayoshi Kachi , Takahiro Suzuki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
发明人： Kiminori Ozaki , Yasuhiro Koike , Hiroaki Asano , Harumitsu Sato , Hiroki Watanabe , Tadayoshi Kachi , Takahiro Suzuki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
IPC分类号： H05K1/11 , H05K3/00 , H05K3/40 , H05K1/02
CPC分类号： H05K1/11 , H05K1/0263 , H05K1/115 , H05K3/0094 , H05K3/4038 , H05K3/4046 , H05K3/4084 , H05K2201/0305 , H05K2201/09509 , H05K2201/0969 , H05K2203/033 , H05K2203/1178 , Y10T29/49165
摘要： An electrically conductive path is configured from a first copper plate, a second copper plate, and solder. The first copper plate has a first bent section extended from a first joining section joined to an electrically insulative board and bent toward the rear surface of the electrically insulative board. The second copper plate has a second bent section which is extended from a second joining section joined to the electrically insulative board, is bent toward the front surface of the electrically insulative board, and is disposed so as to cover, together with the first bent section, the inner wall surface of a base-material through-hole. Through-holes are provided in the portions of the second copper plate which face the inside of the base-material through-hole. Solder is filled between the first bent section and the second bent section.
摘要翻译：导电路径由第一铜板，第二铜板和焊料构成。第一铜板具有从接合到电绝缘板的第一接合部延伸并朝向电绝缘板的后表面弯曲的第一弯曲部。第二铜板具有从连接到电绝缘板的第二接合部延伸的第二弯曲部，朝向电绝缘板的前表面弯曲，并且与第一弯曲部一起覆盖，基材通孔的内壁表面。在第二铜板的与基材通孔的内侧相对的部分设有通孔。焊料填充在第一弯曲部分和第二弯曲部分之间。

4. 发明申请

US20140139310A1 WIRING BOARD 有权
标题翻译：接线板
公开(公告)号：US20140139310A1
公开(公告)日：2014-05-22
申请号：US14129148
申请日：2012-06-21
申请人： Hiroaki Asano , Yasuhiro Koike , Kiminori Ozaki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
发明人： Hiroaki Asano , Yasuhiro Koike , Kiminori Ozaki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
IPC分类号： H05K1/11 , H01F27/28 , H05K1/02
CPC分类号： H05K1/115 , H01F27/2804 , H05K1/0265 , H05K1/0268 , H05K1/0298 , H05K1/118 , H05K1/165 , H05K3/20 , H05K2201/0305 , H05K2201/0391 , H05K2201/09036 , H05K2201/0969 , H05K2201/09736 , H05K2201/09745
摘要： This wiring board is provided with an insulating core substrate, a first conductor pattern, a second conductor pattern, and a conductive material. The first conductor pattern and the second conductor pattern are adhered to the insulating core substrate. The second conductor pattern has a first surface and a second surface. The second conductor pattern has a concavity and a through-hole. The opening of the concavity that opens to the first surface and the opening of the through hole that opens to the first surface are interconnected to each other. The first conductor pattern is positioned at the opening of the concavity. The first conductor pattern and the second conductor pattern are electrically connected by means of the conductive material, which fills from the opening of the through hole that opens to the second surface.
摘要翻译：该布线板设置有绝缘芯基板，第一导体图案，第二导体图案和导电材料。第一导体图案和第二导体图案粘附到绝缘芯基板。第二导体图案具有第一表面和第二表面。第二导体图案具有凹部和通孔。通向第一表面的凹部的开口和通向第一表面的通孔的开口相互连接。第一导体图案位于凹部的开口处。第一导体图案和第二导体图案通过导电材料电连接，导电材料从通孔的开口填充到第二表面。

5. 发明授权

US08686823B2 Electronic unit 有权
标题翻译：电子单位
公开(公告)号：US08686823B2
公开(公告)日：2014-04-01
申请号：US13355818
申请日：2012-01-23
申请人： Hiroaki Asano , Sadanori Suzuki , Kiminori Ozaki , Yasuhiro Koike , Hitoshi Shimadu , Tetsuya Furata , Tomoaki Asai , Takahiro Hayakawa , Ryou Yamauchi , Masao Miyake
发明人： Hiroaki Asano , Sadanori Suzuki , Kiminori Ozaki , Yasuhiro Koike , Hitoshi Shimadu , Tetsuya Furata , Tomoaki Asai , Takahiro Hayakawa , Ryou Yamauchi , Masao Miyake
IPC分类号： H01F5/00 , H05K7/20
CPC分类号： H01F27/2804 , H01F27/22 , H01F2027/2819
摘要： An electronic unit includes a double-sided substrate having an insulation substrate, a patterned first metal plate bonded on one side of the insulation substrate, and a patterned second metal plate bonded on the other side of the insulation substrate, and also includes a heat radiation member for releasing heat from the double-sided substrate. The heat radiation member is disposed adjacent to one of the first metal plate and the second metal plate generating a larger amount of heat than the other of the first metal plate and the second metal plate.
摘要翻译：电子单元包括具有绝缘基板的双面基板，与绝缘基板的一侧结合的图案化的第一金属板以及结合在绝缘基板的另一侧上的图案化的第二金属板，还包括散热用于从双面基板释放热量的构件。散热构件与第一金属板和第二金属板中的一个相邻地布置，产生比第一金属板和第二金属板中的另一个更大的热量。

6. 发明申请

US20140027170A1 WIRING SUBSTRATE 审中-公开
标题翻译：接线基板
公开(公告)号：US20140027170A1
公开(公告)日：2014-01-30
申请号：US14009856
申请日：2012-01-06
申请人： Hitoshi Shimadu , Takehiko Sawada , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
发明人： Hitoshi Shimadu , Takehiko Sawada , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
IPC分类号： H05K1/02
CPC分类号： H05K1/02 , H05K1/144 , H05K3/368 , H05K3/4092 , H05K2201/0397 , H05K2201/042 , H05K2201/09063 , H05K2201/09745 , H05K2201/1031 , H05K2203/0195 , H05K2203/0323 , Y02P70/611
摘要： A wiring substrate (10, 40, 60, 80) includes a wiring pattern (13, 21, 41, 43, 65, 83a, 83b, 83c) and an insulating layer (11, 26, 48, 81) to which the wiring pattern is fixed. The insulating layer includes an edge. The wiring pattern (13, 21, 41, 43, 65, 83a, 83b, 83c) includes a joint portion (14, 44, 66) connected with the insulating layer (11, 26, 48, 81) and an extended portion (45, 45, 67, 85) that extends from the joint portion (14, 44, 66) and protrudes from the edge of the insulating layer (11, 26, 48, 81). The insulating layer (11, 26, 48, 81) or the joint portion (14, 44, 66) includes an outermost surface. A connection terminal (T, T1) is provided by bending the extended portion (45, 45, 67, 85) so that a part of the extended portion (45, 45, 67, 85) is protruded from the outermost surface of the insulating layer (11, 26, 48, 81) or the joint portion (14, 44, 66).
摘要翻译：布线基板（10,40,60,80）包括配线图案（13,21,41,43,65,83a，83b，83c）和绝缘层（11,26,48,81），布线基板图案是固定的。绝缘层包括边缘。布线图案（13,21,41,43,65,83a，83b，83c）包括与绝缘层（11,26,48,81）连接的接合部（14,44,66）和延伸部（14,44,66）延伸并且从绝缘层（11,26,48,81）的边缘突出。绝缘层（11,26,48,81）或接头部分（14,44,66）包括最外表面。连接端子（T，T1）通过弯曲延伸部分（45,45,67,85）而设置，使得延伸部分（45,45,67,85）的一部分从绝缘体的最外表面突出层（11,26,48,81）或接头部分（14,44,66）。

7. 发明授权

US09084371B2 Wiring substrate and manufacturing method for wiring substrate 有权
标题翻译：布线基板的布线基板和制造方法
公开(公告)号：US09084371B2
公开(公告)日：2015-07-14
申请号：US13386835
申请日：2010-07-27
申请人： Hitoshi Shimadu , Kazunori Kondou , Takehiko Sawada , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
发明人： Hitoshi Shimadu , Kazunori Kondou , Takehiko Sawada , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
IPC分类号： H05K1/16 , H05K1/18 , H05K1/02 , H05K3/20 , H01L23/367 , H01L23/498 , H05K1/11 , H05K3/34 , H05K3/38
CPC分类号： H05K3/202 , H01L23/3677 , H01L23/49827 , H01L23/49861 , H01L2924/0002 , H05K1/0201 , H05K1/0263 , H05K1/111 , H05K1/181 , H05K3/341 , H05K3/386 , H05K2201/09745 , H05K2203/167 , Y10T29/49155 , H01L2924/00
摘要： Disclosed is a wiring substrate that is provided with a wiring pattern formed from a metal plate, and an insulation layer as a base material to which the wiring pattern is to be fixed. The wiring pattern has a mounting pad for having electronic parts (11) surface-mounted. Electronic parts are mounted onto the surface of the wiring pattern, by pouring solder into the mounting pad of the wiring pattern.
摘要翻译：公开了一种布线基板，其具有由金属板形成的布线图案，以及作为要固定布线图案的基材的绝缘层。布线图案具有用于具有表面安装的电子部件（11）的安装垫。电子部件通过将焊料倒入配线图案的安装焊盘而安装在布线图案的表面上。

8. 发明申请

US20120119868A1 WIRING SUBSTRATE AND MANUFACTURING METHOD FOR WIRING SUBSTRATE 有权
标题翻译：接线基板接线及制造方法
公开(公告)号：US20120119868A1
公开(公告)日：2012-05-17
申请号：US13386835
申请日：2010-07-27
申请人： Hitoshi Shimadu , Kazunori Kondou , Takehiko Sawada , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
发明人： Hitoshi Shimadu , Kazunori Kondou , Takehiko Sawada , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
IPC分类号： H01F5/00 , H05K3/10 , H05K1/11
CPC分类号： H05K3/202 , H01L23/3677 , H01L23/49827 , H01L23/49861 , H01L2924/0002 , H05K1/0201 , H05K1/0263 , H05K1/111 , H05K1/181 , H05K3/341 , H05K3/386 , H05K2201/09745 , H05K2203/167 , Y10T29/49155 , H01L2924/00
摘要： Disclosed is a wiring substrate that is provided with a wiring pattern formed from a metal plate, and an insulation layer as a base material to which the wiring pattern is to be fixed. The wiring pattern has a mounting pad for having electronic parts (11) surface-mounted. Electronic parts are mounted onto the surface of the wiring pattern, by pouring solder into the mounting pad of the wiring pattern.
摘要翻译：公开了一种布线基板，其具有由金属板形成的布线图案，以及作为要固定布线图案的基材的绝缘层。布线图案具有用于具有表面安装的电子部件（11）的安装垫。电子部件通过将焊料倒入配线图案的安装焊盘而安装在布线图案的表面上。

9. 发明授权

US08917495B2 Circuit board production method and circuit board 有权
标题翻译：电路板生产方法和电路板
公开(公告)号：US08917495B2
公开(公告)日：2014-12-23
申请号：US13393392
申请日：2010-09-01
申请人： Hitoshi Shimadu , Takehiko Sawada , Tomoaki Asai , Ryou Yamauchi
发明人： Hitoshi Shimadu , Takehiko Sawada , Tomoaki Asai , Ryou Yamauchi
IPC分类号： H02B1/20 , H05K3/02 , H05K1/16 , H05K3/20 , H01F27/28 , H01F27/30
CPC分类号： H05K1/165 , H01F27/2847 , H01F27/306 , H05K3/202 , H05K2201/09672 , H05K2201/10409 , H05K2203/175 , Y10T29/49155 , Y10T29/49156
摘要： Provided is a circuit board manufacturing method capable of securing circuit patterns on a plate-like insulator while keeping the relative position between the circuit patterns, and also provided is a circuit board in which the relative position between a plurality of circuit patterns is kept. A first coil (30) having one turn is formed in a planar shape from a metal plate. Next, a second coil (40) having four turns is formed in a planar shape from a metal plate, wherein both of the ends (41, 42) of the coil are linked to other adjacent regions via linking portions (43, 44). A pair of the first coil (30) and the second coil (40) are then overlapped so as to face each other through a plastic plate (50) in which a plurality of prepregs are stacked, after which the links by the linking portions (43, 44) are disconnected.
摘要翻译：提供一种电路板制造方法，其能够在保持电路图案之间的相对位置的同时确保板状绝缘体上的电路图案，并且还提供了保持多个电路图案之间的相对位置的电路板。具有一匝的第一线圈（30）从金属板形成为平面形状。接下来，具有四个匝的第二线圈（40）从金属板形成为平面形状，其中线圈的两个端部（41,42）通过连接部分（43,44）连接到其它相邻区域。然后，一对第一线圈（30）和第二线圈（40）通过堆叠多个预浸料的塑料板（50）相互重叠，之后由连接部分 43,44）断开连接。

10. 发明申请

US20120160553A1 CIRCUIT BOARD PRODUCTION METHOD AND CIRCUIT BOARD 有权
标题翻译：电路板生产方法和电路板
公开(公告)号：US20120160553A1
公开(公告)日：2012-06-28
申请号：US13393392
申请日：2010-09-01
申请人： Hitoshi Shimadu , Takehiko Sawada , Tomoaki Asai , Ryou Yamauchi
发明人： Hitoshi Shimadu , Takehiko Sawada , Tomoaki Asai , Ryou Yamauchi
IPC分类号： H05K1/11 , H05K3/10
CPC分类号： H05K1/165 , H01F27/2847 , H01F27/306 , H05K3/202 , H05K2201/09672 , H05K2201/10409 , H05K2203/175 , Y10T29/49155 , Y10T29/49156
摘要： [Object]To provide a method for producing a circuit board structurally characterized in that circuit patterns can be secured to an insulating member having a plate shape with relative positions thereof unchanged, and a circuit board where relative positions of a plurality of circuit patterns remain unchanged.[Solving means]A first coil 30 having the winding number of 1 is formed in a planar shape from a metal plate. Then, a second coil 40 having the winding number of 4 is formed in a planar shape from a metal plate in a manner that end portions 41 and 42 of the second coil 40 on both sides thereof are coupled with other portions adjacent thereto by coupling sections 43 and 44. A pair of the first coil 30 and the second coil 40 is mounted so as to face each other with a resin plate 50, where a plurality of prepregs are stacked in layers, interposed therebetween, and the coupling by the coupling section 43 and the coupling by the coupling section 44 are thereafter released.
摘要翻译：本发明提供一种电路板的制造方法，其结构特征在于，可以将电路图形固定在具有相对位置不变的板状的绝缘构件上，以及电路板，其中多个电路图案的相对位置保持不变。 [解决方案]卷绕数为1的第一线圈30从金属板形成为平面形状。然后，绕组数为4的第二线圈40以金属板的平面形状形成，其两侧的第二线圈40的端部41和42与与其相邻的其它部分与耦合部分一对第一线圈30和第二线圈40被安装成彼此面对的树脂板50，其中多个预浸料层叠在其间，并且由耦合部分耦合然后释放由耦合部分44耦合的耦合。

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