专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20050075317A1 Aminodiphosphonate apolipoprotein e modulators 失效
标题翻译：氨基二膦酸酯载脂蛋白e调节剂
公开(公告)号：US20050075317A1
公开(公告)日：2005-04-07
申请号：US10504744
申请日：2003-02-14
申请人： Hieu Phan , Lan Nguyen , Raymond Azoulay , Vinh Diep , Eric Niesor , Craig Bentzen , Yves Gellin , Anne Perez , Jean-Luc Thulliard
发明人： Hieu Phan , Lan Nguyen , Raymond Azoulay , Vinh Diep , Eric Niesor , Craig Bentzen , Yves Gellin , Anne Perez , Jean-Luc Thulliard
IPC分类号： A61K31/663 , A61K31/675 , C07F9/58 , C07F9/60 , C07F9/6509 , C07F9/6541 , A61K31/66
CPC分类号： C07F9/60 , A61K31/663 , A61K31/675 , C07F9/58 , C07F9/650952 , C07F9/6541
摘要： The present invention relates to methods of use of aminodiphosphonate to modulate apolipoprotein E levels and the use of such compounds in therapy, including cardiovascular and neurological disease states.
摘要翻译：本发明涉及使用氨基二膦酸盐调节载脂蛋白E水平的方法以及这些化合物在治疗中的应用，包括心血管和神经疾病状态。

2. 发明申请

US20050124581A1 Alpha-substituted heteroarylalkyl phosphonate derivatives 审中-公开
标题翻译： α-取代的杂芳基烷基膦酸酯衍生物
公开(公告)号：US20050124581A1
公开(公告)日：2005-06-09
申请号：US10504081
申请日：2003-02-03
申请人： Hieu Phan , Lan Nguyen , Raymond Azoulay , Vinh Diep , Eric Niesor , Craig Bentzen , Robert Ife
发明人： Hieu Phan , Lan Nguyen , Raymond Azoulay , Vinh Diep , Eric Niesor , Craig Bentzen , Robert Ife
IPC分类号： A61K45/00 , A61K31/22 , A61K31/366 , A61K31/40 , A61K31/405 , A61K31/44 , A61K31/4418 , A61K31/66 , A61K31/662 , A61P3/06 , A61P7/02 , A61P9/10 , C07F9/40 , C07F9/58 , C07F9/6509 , C07F9/6539 , A61K31/675
CPC分类号： C07F9/6539 , A61K31/22 , A61K31/366 , A61K31/40 , A61K31/405 , A61K31/44 , A61K31/66 , C07F9/58 , C07F9/650952 , A61K2300/00
摘要： The present invention relates to novel α-substituted heteroarylalkylphosphonate derivatives and their uses for lowering plasma levels of apo (a), Lp(a), apo B, apo B associated lipoproteins (low density lipoproteins and very low density lipoproteins) and for lowering plasma levels of total cholesterol.
摘要翻译：本发明涉及新型α-取代的杂芳基烷基膦酸酯衍生物及其用于降低apo（a），Lp（a），载脂蛋白B，载脂蛋白B相关脂蛋白（低密度脂蛋白和极低密度脂蛋白）的血浆水平和降低血浆中的血浆水平的用途总胆固醇水平。

3. 发明申请

US20050124586A1 Alpha-substituted arylalkyl phosphonate derivatives 审中-公开
标题翻译： α-取代芳基烷基膦酸酯衍生物
公开(公告)号：US20050124586A1
公开(公告)日：2005-06-09
申请号：US10503989
申请日：2003-02-03
申请人： Hieu Phan , Lan Nguyen , Raymond Azoulay , Vinh Diep , Harald Eschenhof , Eric Niesor , Craig Bentzen , Robert Ife
发明人： Hieu Phan , Lan Nguyen , Raymond Azoulay , Vinh Diep , Harald Eschenhof , Eric Niesor , Craig Bentzen , Robert Ife
IPC分类号： A61K31/675 , A61P3/06 , A61P7/00 , A61P7/02 , A61P9/00 , A61P9/08 , A61P9/10 , A61P43/00 , C07F9/58 , C07F9/6509 , C07F9/653 , C07F9/6539 , A61K31/401 , A61K31/366
CPC分类号： C07F9/6539 , C07F9/58 , C07F9/650952 , C07F9/653
摘要： The present invention relates to novel α-substituted arylalkylphosphonate derivatives and their uses for lowering plasma levels of apo (a), Lp(a), apo B, apo B associated lipoproteins (low density lipoproteins and very low density lipoproteins) and for lowering plasma levels of total cholesterol.
摘要翻译：本发明涉及新型α-取代芳基烷基膦酸酯衍生物及其用于降低apo（a），Lp（a），载脂蛋白B，载脂蛋白B相关脂蛋白（低密度脂蛋白和极低密度脂蛋白）血浆水平和降低血浆中血浆浓度的用途总胆固醇水平。

4. 发明申请

US20060205692A1 1,1-and 1,2-Bisphosphonates as apoliprotein e modulators 审中-公开
标题翻译： 1,1和1,2-二膦酸酯作为载脂蛋白e调节剂
公开(公告)号：US20060205692A1
公开(公告)日：2006-09-14
申请号：US10513552
申请日：2003-05-09
申请人： Imber Montes , Hieu Pham , Lan Nguyen , Vinh Diep , Emanuele Burattini , Carlo Severi , Eric Neisor , Anne Perez , Jean-Luc Thuillard , Yves Guyon-Gellin , Craig Bentzen
发明人： Imber Montes , Hieu Pham , Lan Nguyen , Vinh Diep , Emanuele Burattini , Carlo Severi , Eric Neisor , Anne Perez , Jean-Luc Thuillard , Yves Guyon-Gellin , Craig Bentzen
IPC分类号： A61K31/675 , A61K31/663 , C07F9/58 , C07F9/572 , C07F9/28
CPC分类号： C07F9/404 , C07F9/4025 , C07F9/572 , C07F9/5728 , C07F9/5765 , C07F9/58 , C07F9/59 , C07F9/6533
摘要： The present invention relates to methods of use 1,1- and 1,2-bisphosphonate compounds to modulate apolipoprotein E levels and use of such compounds in therapy, including cardiovascular and neurological disease states.
摘要翻译：本发明涉及使用1,1-和1,2-二膦酸盐化合物调节载脂蛋白E水平和在治疗中使用这些化合物的方法，包括心血管和神经疾病状态。

5. 发明授权

US08672126B2 Foldable case for use with an electronic device 有权
标题翻译：与电子设备一起使用的可折叠外壳
公开(公告)号：US08672126B2
公开(公告)日：2014-03-18
申请号：US12683328
申请日：2010-01-06
申请人： Matthew D. Rohrbach , Vinh Diep
发明人： Matthew D. Rohrbach , Vinh Diep
IPC分类号： B65D85/00
CPC分类号： G06F1/1633 , A45C3/02 , A45C7/00 , A45C9/00 , A45C11/00 , A45C13/02 , A45C2011/003 , A45C2013/025 , A45C2200/15 , G06F1/1628 , G06F2200/1633 , Y10T29/49826
摘要： This is directed to a case for securing and protecting an electronic device. The case can include a cover connected to a pouch by a hinge such that the cover can be overlaid over a device interface (e.g., a device display). The case can be constructed by layering and combining several types of materials, including for example materials having resistant outer surfaces, materials limiting the deformation of the case, materials providing a soft surface to be placed in contact with the device, and rigid materials for defining a structure of the case. In some embodiments, the case can include a tab that allows a user to fold open the cover of the case to form a triangular prism. The prism can be placed on any of its surfaces such that the device can be oriented towards a user at particular angles (e.g., a typing-specific orientation and a media playback orientation).
摘要翻译：这是针对用于固定和保护电子设备的情况。壳体可以包括通过铰链连接到袋的盖，使得盖可以覆盖在设备接口（例如，设备显示器）上。这种情况可以通过层叠和组合几种类型的材料来构造，例如包括具有耐磨性外表面的材料，限制壳体变形的材料，提供要与设备接触的柔软表面的材料，以及用于限定案例结构。在一些实施例中，该情况可以包括允许用户折叠打开外壳的盖以形成三角形棱镜的突片。棱镜可以放置在其任何表面上，使得该装置可以以特定角度朝向用户（例如，打字专门定向和媒体播放方向）定向。

6. 发明申请

US20130050945A1 Electronic Device Enclosures with Engagement Features 审中-公开
标题翻译：带有参与功能的电子设备外壳
公开(公告)号：US20130050945A1
公开(公告)日：2013-02-28
申请号：US13223030
申请日：2011-08-31
申请人： Vinh Diep , Dominic Dolci , Chiew-Siang Goh , Alexander Michael Kwan , Cesar Lozano Villarreal
发明人： Vinh Diep , Dominic Dolci , Chiew-Siang Goh , Alexander Michael Kwan , Cesar Lozano Villarreal
IPC分类号： H05K5/00 , H05K5/02 , A47B87/00 , H05K7/20
CPC分类号： H05K5/0013 , G06F1/181
摘要： An electronic device may have electronic device housing structures in which electronic components such as integrated circuits and connectors may be mounted. The electronic device housing structures may include an upper housing having a planar upper surface member and four perpendicular housing sidewall structures. The housing sidewall structures of the upper housing may have edges that form a rectangular opening with curved corners. A lower housing may have structures forming a rectangular lip that is configured to be received within the rectangular opening in the upper housing. Engagement structures such as inwardly protruding hook structures on the upper housing and snap structures on the rectangular lip may be used in attaching the upper and lower housings. The snap structures may each have a rectangular main opening and lateral extension portions that extend the width of the main opening along the edge of the lip.
摘要翻译：电子设备可以具有其中可以安装诸如集成电路和连接器的电子部件的电子设备外壳结构。电子设备外壳结构可以包括具有平面上表面构件和四个垂直外壳侧壁结构的上壳体。上壳体的壳体侧壁结构可以具有形成具有弯曲角的矩形开口的边缘。下壳体可以具有构造成被容纳在上壳体中的矩形开口内的矩形唇缘的结构。诸如在上壳体上的向内突出的钩结构和矩形唇缘上的卡扣结构的接合结构可以用于附接上壳体和下壳体。卡扣结构可以各自具有矩形主开口和横向延伸部分，其沿着唇缘的边缘延伸主开口的宽度。

7. 发明申请

US20130050943A1 ELECTRONIC DEVICE ENCLOSURES AND HEATSINK STRUCTURES WITH THERMAL MANAGEMENT FEATURES 有权
标题翻译：具有热管理功能的电子器件封装和散热器结构
公开(公告)号：US20130050943A1
公开(公告)日：2013-02-28
申请号：US13221796
申请日：2011-08-30
申请人： Vinh Diep , Chiew-Siang Goh , Doug Heirich , Alexander Michael Kwan
发明人： Vinh Diep , Chiew-Siang Goh , Doug Heirich , Alexander Michael Kwan
IPC分类号： H05K7/20
CPC分类号： H05K7/20436 , H05K13/00 , Y10T29/49002
摘要： An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.
摘要翻译：电子设备可以具有其中安装电子部件的壳体。电子部件可以安装到诸如印刷电路板的基板上。散热器结构可以散发由电子部件产生的热量。壳体可以具有通过气隙与散热器结构分离的壳体壁。外壳壁可以具有整体的支撑结构。每个支撑结构可以具有突出穿过散热器结构中的对应开口的向内突出的部分。突出部分可以各自具有纵向轴线和位于纵向轴线的圆柱形空腔。每个支撑结构可以具有从纵向轴线径向向外延伸的翅片。

8. 发明申请

US20110281044A1 COMPOSITE STRUCTURES WITH UNIDIRECTIONAL FIBERS 审中-公开
标题翻译：具有单向纤维的复合结构
公开(公告)号：US20110281044A1
公开(公告)日：2011-11-17
申请号：US12781761
申请日：2010-05-17
申请人： Spyros Michail , Kevin Kenney , Tommy Tang , Vinh Diep , Shannon Hsueh , Dan Hong
发明人： Spyros Michail , Kevin Kenney , Tommy Tang , Vinh Diep , Shannon Hsueh , Dan Hong
IPC分类号： B32B5/26 , B32B5/28 , B32B17/04 , B65H81/00
CPC分类号： B29C70/20 , B29C70/32 , B29C70/46 , B32B17/04 , Y10T428/1314 , Y10T428/1372
摘要： Composite structures may be formed using sheets of unidirectional fiber prepreg. Each of the prepreg sheets may include unidirectional fibers such as glass fibers and a binder such as plastic. The prepreg sheets may be wrapped around the outer surface of a drum. Ring-shaped sections of the wrapped sheets may be cut from the drum to form rings of prepreg layers. The prepreg rings may be placed into a mold cavity of a desired shape. While contained in stack of molds, prepreg rings may be cured by applying heat and pressure. Finished composite structures such as ring-shaped composite structures may be released from the molds following curing. The composite structures may be planar structures that have planar upper and lower surfaces and inner and outer edges. The fibers in the finished composite structures may run parallel to the upper and lower surfaces and parallel to the inner and outer edges.
摘要翻译：可以使用单向纤维预浸料片形成复合结构。每个预浸料片材可以包括单向纤维，例如玻璃纤维和诸如塑料的粘合剂。预浸片可以卷绕在滚筒的外表面上。包裹的片材的环形部分可以从滚筒上切割以形成预浸料层的环。预浸料环可以放置在所需形状的模腔中。当包含在模具堆中时，预浸料环可以通过施加热和压力而固化。成品复合结构如环形复合结构可在固化后从模具中释放出来。复合结构可以是具有平面的上表面和下表面以及内边缘和外边缘的平面结构。成品复合结构中的纤维可以平行于上表面和下表面平行，并且平行于内边缘和外边缘。

9. 发明授权

US08760868B2 Electronic device enclosures and heatsink structures with thermal management features 有权
标题翻译：具有热管理功能的电子设备外壳和散热器结构
公开(公告)号：US08760868B2
公开(公告)日：2014-06-24
申请号：US13221796
申请日：2011-08-30
申请人： Vinh Diep , Chiew-Siang Goh , Doug Heirich , Alexander Michael Kwan , Cesar Lozano Villarreal
发明人： Vinh Diep , Chiew-Siang Goh , Doug Heirich , Alexander Michael Kwan , Cesar Lozano Villarreal
IPC分类号： H05K7/20
CPC分类号： H05K7/20436 , H05K13/00 , Y10T29/49002
摘要： An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.
摘要翻译：电子设备可以具有其中安装电子部件的壳体。电子部件可以安装到诸如印刷电路板的基板上。散热器结构可以散发由电子部件产生的热量。壳体可以具有通过气隙与散热器结构分离的壳体壁。外壳壁可以具有整体的支撑结构。每个支撑结构可以具有突出穿过散热器结构中的对应开口的向内突出的部分。突出部分可以各自具有纵向轴线和位于纵向轴线的圆柱形空腔。每个支撑结构可以具有从纵向轴线径向向外延伸的翅片。

10. 发明授权

US07539015B2 Riser card housing 失效
标题翻译：提升卡外壳
公开(公告)号：US07539015B2
公开(公告)日：2009-05-26
申请号：US11831214
申请日：2007-07-31
申请人： Gregory Springer , Vinh Diep , Ricardo Mariano , Douglas L. Heirich , Peter Russell-Clarke , Daniele De luliis
发明人： Gregory Springer , Vinh Diep , Ricardo Mariano , Douglas L. Heirich , Peter Russell-Clarke , Daniele De luliis
IPC分类号： H05K7/20
CPC分类号： G06F1/185 , G06F1/20
摘要： A housing for accommodating one or more riser cards is disclosed. The one or more riser cards include a first riser card. The first riser card may be configured to carry at least a first component. The housing may include a first inlet side configured to allow first air to flow into the housing for cooling the first component. The housing may also include an outlet side configured to allow at least a first portion of the first air to flow away from the housing. The housing may be configured to be disposed inside an enclosure of an electronic device. At least one of the first inlet side and the outlet side may include a first guiding structure configured to guide movement of the first riser card relative to the housing.
摘要翻译：公开了一种用于容纳一个或多个转接卡的外壳。一个或多个转接卡包括第一转接卡。第一转接卡可以被配置为承载至少第一组件。壳体可以包括构造成允许第一空气流入壳体中以冷却第一部件的第一入口侧。壳体还可以包括出口侧，其被配置为允许第一空气的至少第一部分从壳体流出。壳体可以被配置为设置在电子设备的外壳内。第一入口侧和出口侧中的至少一个可以包括构造成引导第一转接卡相对于壳体的运动的第一引导结构。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式