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1. 发明申请

US20050252884A1 Method and system for predicting process performance using material processing tool and sensor data 审中-公开
标题翻译：使用材料加工工具和传感器数据预测工艺性能的方法和系统
公开(公告)号：US20050252884A1
公开(公告)日：2005-11-17
申请号：US10517762
申请日：2003-06-27
申请人： Hieu Lam , Hongyu Yue , John Shriner
发明人： Hieu Lam , Hongyu Yue , John Shriner
IPC分类号： H01L21/3065 , C23F1/00 , G05B19/418 , G05B23/02 , H01L21/66
CPC分类号： H01L22/20 , G05B19/41875 , G05B23/0254 , G05B2219/31357 , G05B2219/32179 , G05B2219/32194 , G05B2219/45028 , G05B2219/45031 , H01J37/32935 , Y02P90/14 , Y02P90/22
摘要： A material processing system including a process tool and a process performance prediction system. The performance prediction system includes sensors coupled to the tool to measure tool data and a controller coupled to the sensors to receive tool data, where the controller is configured to predict the process performance for the tool using the tool data. A method for detecting a fault in a material processing system using a process performance prediction model is also provided. The method includes preparing the tool, initiating a process in the tool, and recording tool data to form to a tool data matrix. The method also includes performing a matrix multiplication of the tool data matrix and a correlation matrix to form predicted process performance data, where the correlation matrix includes the performance prediction model, comparing the predicted data with target data, and determining a fault condition of the processing system from the comparing step.
摘要翻译：一种材料处理系统，包括处理工具和过程性能预测系统。性能预测系统包括耦合到工具以测量工具数据的传感器和耦合到传感器以接收工具数据的控制器，其中控制器被配置为使用工具数据预测工具的过程性能。还提供了使用过程性能预测模型来检测材料处理系统中的故障的方法。该方法包括准备工具，启动工具中的过程，以及记录工具数据以形成工具数据矩阵。该方法还包括执行刀具数据矩阵和相关矩阵的矩阵乘法以形成预测过程性能数据，其中相关矩阵包括性能预测模型，将预测数据与目标数据进行比较，以及确定处理的故障状况系统从比较步骤。

2. 发明申请

US20050283321A1 Method and apparatus for using a pressure control system to monitor a plasma processing system 有权
标题翻译：用于使用压力控制系统监测等离子体处理系统的方法和装置
公开(公告)号：US20050283321A1
公开(公告)日：2005-12-22
申请号：US10868346
申请日：2004-06-16
申请人： Hongyu Yue , Hieu Lam
发明人： Hongyu Yue , Hieu Lam
IPC分类号： H01J37/32 , G01N31/00 , G06F19/00
CPC分类号： H01J37/32623 , H01J37/32935
摘要： A method and apparatus is presented for using a pressure control system to monitor a plasma processing system. By monitoring variations in the state of the pressure control system, a fault condition, an erroneous fault condition, or a service condition can be detected. For example, the service condition can include monitoring the accumulation of residue between successive preventative maintenance events.
摘要翻译：提出了一种使用压力控制系统监测等离子体处理系统的方法和装置。通过监视压力控制系统的状态的变化，可以检测故障状况，错误故障状况或服务条件。例如，服务条件可以包括在连续的预防性维护事件之间监视残留物的累积。

3. 发明申请

US20060048891A1 Method and apparatus for determining an etch property using an endpoint signal 有权
标题翻译：使用端点信号确定蚀刻性质的方法和装置
公开(公告)号：US20060048891A1
公开(公告)日：2006-03-09
申请号：US10531469
申请日：2003-10-31
申请人： Hongyu Yue , Hieu Lam
发明人： Hongyu Yue , Hieu Lam
IPC分类号： C23F1/00 , G01L21/30
CPC分类号： H01J37/32935 , H01J37/32963
摘要： The present invention presents a plasma processing system for etching a layer on a substrate comprising a process chamber, a diagnostic system coupled to the process chamber and configured to measure at least one endpoint signal, and a controller coupled to the diagnostic system and configured to determine in-situ at least one of an etch rate and an etch rate uniformity of the etching from the endpoint signal. Furthermore, an in-situ method of determining an etch property for etching a layer on a substrate in a plasma processing system is presented comprising the steps: providing a thickness of the layer; etching the layer on the substrate; measuring at least one endpoint signal using a diagnostic system coupled to the plasma processing system, wherein the endpoint signal comprises an endpoint transition; and determining the etch rate from a ratio of the thickness to a difference between a time during the endpoint transition and a starting time of the etching.
摘要翻译：本发明提出了一种用于蚀刻衬底上的层的等离子体处理系统，包括处理室，耦合到处理室并被配置为测量至少一个端点信号的诊断系统，以及耦合到诊断系统的控制器，并且被配置为确定从端点信号原位蚀刻速率和蚀刻速度均匀性中的至少一个。此外，提出了确定用于蚀刻等离子体处理系统中的衬底上的层的蚀刻性质的原位方法，包括以下步骤：提供该层的厚度; 蚀刻衬底上的层; 使用耦合到所述等离子体处理系统的诊断系统来测量至少一个端点信号，其中所述端点信号包括端点转换; 以及从所述厚度与所述端点转变期间的时间与所述蚀刻的开始时间之间的差的比率确定所述蚀刻速率。

4. 发明申请

US20050015176A1 Method for automatic configuration of processing system 有权
标题翻译：自动配置处理系统的方法
公开(公告)号：US20050015176A1
公开(公告)日：2005-01-20
申请号：US10776452
申请日：2004-02-12
申请人： Satoshi Harada , Edward Hume , James Willis , Kevin Chamness , Hieu Lam , Hongyu Yue , David Fatke
发明人： Satoshi Harada , Edward Hume , James Willis , Kevin Chamness , Hieu Lam , Hongyu Yue , David Fatke
IPC分类号： G05B19/418 , G06F19/00
CPC分类号： G05B19/41865 , G05B19/41845 , G05B2219/31334 , G05B2219/32191 , G05B2219/45031 , Y02P90/16 , Y02P90/185 , Y02P90/20 , Y02P90/22 , Y02P90/86
摘要： A method of automatically configuring an Advanced Process Control (APC) system for a semiconductor manufacturing environment in which an auto-configuration script is generated for executing an auto-configuration program. The auto-configuration script activates default values for input to the auto-configuration program. The auto-configuration script is executed to generate an enabled parameter file output from the auto-configuration program. The enabled parameter file identifies parameters for statistical process control (SPC) chart generation.
摘要翻译：一种自动配置用于半导体制造环境的高级过程控制（APC）系统的方法，其中生成用于执行自动配置程序的自动配置脚本。自动配置脚本激活自动配置程序输入的默认值。执行自动配置脚本以生成从自动配置程序输出的启用参数文件。启用的参数文件识别统计过程控制（SPC）图生成的参数。

5. 发明申请

US20050211669A1 Method and system of discriminating substrate type 有权
标题翻译：识别基板类型的方法和系统
公开(公告)号：US20050211669A1
公开(公告)日：2005-09-29
申请号：US10809474
申请日：2004-03-26
申请人： Hieu Lam , Hongyu Yue
发明人： Hieu Lam , Hongyu Yue
IPC分类号： G01L21/30 , G01N21/68
CPC分类号： G01N21/68
摘要： A method and system for determining a substrate type during a seasoning process is presented. An optical signal is acquired from a process in a plasma processing system, and the optical signal is compared to a pre-determined threshold value. Depending upon the comparison, the substrate type is determined to be of a correct type, or an incorrect type.
摘要翻译：提出了一种在调味过程中确定底物类型的方法和系统。从等离子体处理系统中的处理获取光信号，将光信号与预定阈值进行比较。根据比较，基板类型被确定为正确的类型或不正确的类型。

6. 发明申请

US20050234574A1 Controlling a material processing tool and performance data 有权
标题翻译：控制材料加工工具和性能数据
公开(公告)号：US20050234574A1
公开(公告)日：2005-10-20
申请号：US10512863
申请日：2003-06-27
申请人： Hieu Lam , Hongyu Yue
发明人： Hieu Lam , Hongyu Yue
IPC分类号： H01L21/3065 , G05B19/418 , G06F19/00 , H01L21/205
CPC分类号： G05B19/41865 , G05B2219/31443 , G05B2219/32366 , G05B2219/45031 , Y02P90/20 , Y02P90/26
摘要： According to an embodiment of the present invention, a material processing systeme (1) including a process tool (10) and a process performance control system (100). The process performance control system (100) includes a process performance controller (55) coupled to the process tool (10), where the process performance controller (55) includes a process performance prediction model (110), a process recipe correction filter (120), a process controller (130), and process performance model correction algorithm (150). The process performance prediction model (110) is configured to receive tool data from a plurality of sensors coupled to process tool (10) and to predict process performance data. The process recipe correction filter (120) is coupled to the process performance prediction model (110) and configured to receive predicted process performance data and generate a process recipe correction for run-to-run process control. The process controller (130) is coupled to the process recipe correction filter (120) and is configured to update a process recipe according to the process recipe correction.
摘要翻译：根据本发明的实施例，一种包括处理工具（10）和过程执行控制系统（100）的材料处理系统（1）。过程性能控制系统（100）包括耦合到处理工具（10）的过程性能控制器（55），其中过程性能控制器（55）包括过程性能预测模型（110），过程配方校正过滤器（120）），过程控制器（130）和过程执行模型校正算法（150）。过程性能预测模型（110）被配置为从耦合到过程工具（10）的多个传感器接收工具数据并预测过程性能数据。过程配方校正滤波器（120）耦合到过程性能预测模型（110）并且被配置为接收预测的过程性能数据并且生成用于运行过程控制的过程配方校正。过程控制器（130）耦合到过程配方校正过滤器（120），并被配置为根据处理配方校正更新过程配方。

7. 发明申请

US20130001188A1 METHOD TO PROTECT MAGNETIC BITS DURING PLANARIZATION 审中-公开
标题翻译：在平面化过程中保护磁极的方法
公开(公告)号：US20130001188A1
公开(公告)日：2013-01-03
申请号：US13174321
申请日：2011-06-30
申请人： David Kuo , Michael R. Feldbaum , Paritosh Rajora , Hieu Lam
发明人： David Kuo , Michael R. Feldbaum , Paritosh Rajora , Hieu Lam
IPC分类号： G11B5/84 , B05C9/06 , B32B3/28 , B05D3/00 , C23F1/00 , C23F1/08 , B05D1/36
CPC分类号： H01L43/12 , Y10T428/24628
摘要： The embodiments disclose a method to protect magnetic bits during carbon field planarization, including depositing a stop layer upon magnetic bits and magnetic film of a patterned stack, depositing a carbon fill layer on the stop layer and using the stop layer during planarization and etch-back of the carbon field to protect the patterned stack magnetic bits during the carbon field planarization.
摘要翻译：这些实施例公开了一种在碳场平坦化期间保护磁头的方法，包括在图案化堆叠的磁头和磁性膜上沉积停止层，在停止层上沉积碳填充层并在平坦化和回蚀刻期间使用停止层的碳场以在碳场平坦化期间保护图案化的堆叠磁性位。

8. 发明授权

US07536777B2 Use of metal capped seed layers for the fabrication of perpendicular thin film heads 失效
标题翻译：使用金属盖种子层制造垂直薄膜头
公开(公告)号：US07536777B2
公开(公告)日：2009-05-26
申请号：US11595764
申请日：2006-11-10
申请人： Hieu Lam , Patrick Rush Webb , Yi Zheng
发明人： Hieu Lam , Patrick Rush Webb , Yi Zheng
IPC分类号： G11B5/127 , H04R31/00
CPC分类号： C25D5/022 , C23C28/021 , C23C28/023 , C23C28/04 , C23C28/343 , G11B5/112 , G11B5/1278 , G11B5/3146 , G11B5/315 , G11B5/3163 , Y10T29/49039 , Y10T29/49043 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： Methods and structures for the fabrication of perpendicular thin film heads are disclosed. Prior to the deposition of shield structures, capped seed layers having a dual layer structure are utilized, improving photo resist adhesion and plated shield adhesion, without the need to deposit, then remove, traditional inorganic anti-reflection coatings prior to shield plating.
摘要翻译：公开了用于制造垂直薄膜头的方法和结构。在沉积屏蔽结构之前，利用具有双层结构的封盖种子层，在屏蔽电镀之前，不需要沉积，然后去除传统的无机抗反射涂层，从而提高光致抗蚀剂粘附性和电镀屏蔽粘附性。

9. 发明申请

US20100107402A1 Methods Of Making Magnetic Write Heads With Use Of A Resist Channel Shrinking Solution Having Corrosion Inhibitors 失效
标题翻译：使用具有腐蚀抑制剂的抗蚀剂通道收缩溶液制造磁性写头的方法
公开(公告)号：US20100107402A1
公开(公告)日：2010-05-06
申请号：US12685455
申请日：2010-01-11
申请人： Christian Rene Bonhote , Jila Tabib , Dennis Richard Mckean , Daniel Wayne Bedell , Jyh-Shuey Lo , Hieu Lam , Kim Y. Lee
发明人： Christian Rene Bonhote , Jila Tabib , Dennis Richard Mckean , Daniel Wayne Bedell , Jyh-Shuey Lo , Hieu Lam , Kim Y. Lee
IPC分类号： G11B5/127 , B05D3/02
CPC分类号： G11B5/3116 , G11B5/3163 , Y10T29/49032 , Y10T29/49039 , Y10T29/49043 , Y10T29/49044 , Y10T29/49048 , Y10T29/49052
摘要： One preferred method for use in making a device structure with use of the resist channel shrinking solution includes the steps of forming a first pedestal portion within a channel of a patterned resist; applying a resist channel shrinking solution comprising a resist channel shrinking film and corrosion inhibitors within the channel of the patterned resist; baking the resist channel shrinking solution over the patterned resist to thereby reduce a width of the channel of the patterned resist; removing the resist channel shrinking solution; and forming a second pedestal portion within the reduced-width channel of the patterned resist. Advantageously, the oxide layer and the corrosion inhibitors of the resist channel shrinking solution reduce corrosion in the pedestal during the act of baking the resist channel shrinking solution.
摘要翻译：用于制造使用抗蚀剂通道收缩溶液的器件结构的一种优选方法包括在图案化抗蚀剂的通道内形成第一基座部分的步骤; 在图案化的抗蚀剂的通道内施加包含抗蚀剂通道收缩膜和腐蚀抑制剂的抗蚀剂通道收缩溶液; 在图案化的抗蚀剂上烘烤抗蚀剂通道收缩溶液，从而减小图案化抗蚀剂的通道的宽度; 去除抗蚀剂通道收缩溶液; 以及在所述图案化抗蚀剂的所述减小宽度的通道内形成第二基座部分。有利地，抗蚀剂通道收缩溶液的氧化物层和腐蚀抑制剂在烘烤抗蚀剂通道收缩溶液的作用下降低了基座中的腐蚀。

10. 发明授权

US07631417B2 Use of anti-reflective seed layers for the fabrication of perpendicular thin film heads 失效
标题翻译：使用防反光种子层制造垂直薄膜头
公开(公告)号：US07631417B2
公开(公告)日：2009-12-15
申请号：US11595765
申请日：2006-11-10
申请人： Hieu Lam , Patrick Rush Webb , Yi Zheng
发明人： Hieu Lam , Patrick Rush Webb , Yi Zheng
IPC分类号： G11B5/127 , H04R31/00
CPC分类号： G11B5/1278 , G11B5/3116 , G11B5/314 , G11B5/3163 , Y10T29/49043 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： Methods and structures for the fabrication of perpendicular thin film heads are disclosed. Prior to the deposition of shield structures, seed layers having anti-reflective properties are utilized, eliminating the need to deposit, then remove, traditional inorganic anti-reflection coatings prior to shield plating.
摘要翻译：公开了用于制造垂直薄膜头的方法和结构。在沉积屏蔽结构之前，利用具有抗反射特性的种子层，消除了在屏蔽电镀之前沉积，然后去除传统的无机抗反射涂层的需要。

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