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    • 1. 发明申请
    • GAS BARRIER LAMINATE FILM, AND METHOD FOR PRODUCING SAME
    • 气体阻隔层压薄膜及其制造方法
    • US20140014181A1
    • 2014-01-16
    • US14008279
    • 2012-03-29
    • Hidetaka AmanaiMakoto Miyazaki
    • Hidetaka AmanaiMakoto Miyazaki
    • B32B33/00
    • B32B33/00C23C14/0676C23C14/352Y10T428/265Y10T428/31504Y10T428/31678
    • The present invention provides a gas barrier laminate film containing a substrate film having on at least one surface thereof plural layers of an inorganic thin film layer, from a first layer to an n-th layer (wherein n represents an integer of 1 or more) of the inorganic thin film layer on a side of the substrate film being formed by a non-plasma film forming method, and an (n+1)-th layer formed thereon in contact therewith being formed by a facing target sputtering method, and a method for producing a gas barrier laminate film containing a substrate film having on at least one surface thereof one or plural layers of an inorganic thin film layer, the method containing: forming from a first layer to an n-th layer of the inorganic thin film layer on a side of the substrate film by a non-plasma film forming method; and forming an (n+1)-th layer thereon in contact therewith by a facing target sputtering method, and thus provides a gas barrier laminate film with high gas barrier property and excellent productivity having a dense inorganic thin film layer that inflicts less damage to a substrate film, particularly to a resin film, on which the inorganic thin film layer is formed, and a method for producing the same.
    • 本发明提供一种阻气性层压膜,其含有在第一层至第n层(其中n表示1以上的整数)的至少一个表面上具有多层无机薄膜层的基板膜, 通过非等离子体膜形成方法形成在基板膜侧的无机薄膜层,并且通过面对靶溅射方法形成与其形成的第(n + 1)层, 一种含有在至少一个表面上具有一层或多层无机薄膜层的基材膜的阻气性层压膜的方法,所述方法包括:从第一层到第n层的无机薄膜 通过非等离子体膜形成方法在衬底膜的一侧上形成层; 以及通过面对靶溅射法与其接触形成第(n + 1)层,从而提供具有高阻气性和优异的生产率的阻气性层压膜,其具有致密的无机薄膜层,对其造成较小的损伤 特别是形成有无机薄膜层的树脂膜的基材膜及其制造方法。