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1. 发明授权

US06210260B1 Carrier and CMP apparatus 有权
标题翻译：载体和CMP装置
公开(公告)号：US06210260B1
公开(公告)日：2001-04-03
申请号：US09260335
申请日：1999-03-01
申请人： Hideo Tanaka , Xu-Jin Wang , Misuo Sugiyama , Kei Tanaka , Makoto Ishida , Shunji Hakomori
发明人： Hideo Tanaka , Xu-Jin Wang , Misuo Sugiyama , Kei Tanaka , Makoto Ishida , Shunji Hakomori
IPC分类号： B24B500
CPC分类号： B24B37/30 , H01L21/6838
摘要： A carrier comprising a disk-shaped body portion having fluid circulation holes, a ring-shaped diaphragm portion expanding outward from the outer peripheral surface of the body portion and having pliability, a ring-shaped edge portion projecting at least downward from an outer edge portion of the diaphragm portion and having an inner diameter of at least an outer diameter of a work piece, a pliable sheet having an outer peripheral portion affixed air tightly to a bottom end portion of said edge portion, the back surface of the sheet defining a single pressure chamber communicating with the fluid circulation holes, and a ring-shaped member surrounding the work piece affixed to the bottom surface of the sheet.
摘要翻译：一种载体，包括具有流体循环孔的盘形主体部分，从主体部分的外周表面向外扩展并具有柔韧性的环形隔膜部分，从外边缘部分至少向下突出的环形边缘部分并且具有至少外径为工件的内径的柔性片，具有外周部分的气密紧固到所述边缘部分的底端部分的柔性片，所述片的背面限定单个与流体循环孔连通的压力室以及围绕固定在片材底面的工件的环状构件。

2. 发明授权

US06261160B1 Method and apparatus for specular-polishing of work edges 失效
标题翻译：用于工作边缘镜面抛光的方法和装置
公开(公告)号：US06261160B1
公开(公告)日：2001-07-17
申请号：US09148608
申请日：1998-09-04
申请人： Shunji Hakomori
发明人： Shunji Hakomori
IPC分类号： B24B908
CPC分类号： B23Q39/046 , B23Q7/04 , B24B9/065 , B24B27/0076 , B24B41/005 , B24B41/06
摘要： A polishing apparatus comprises a rotating table intermittently rotating through 120°0 increments; three polishing drums and three work-holding means 12 provided on the rotating table; a handling means for unloading a processed work from the work-holding means at a handling position and supplying an unprocessed work to the work-holding means at the same position; and a work-inverting means for inverting a work, the front-plane-side edge of which has been polished, at a front-plane edge polishing position.
摘要翻译：抛光装置包括间歇地旋转120°增量的旋转台; 三个抛光滚筒和设置在旋转台上的三个保持装置12; 处理装置，用于在处理位置从工作保持装置卸载加工的工件，并将未加工的工件供给到同一位置的工件保持装置; 以及工作反转装置，用于将正面边缘已经被抛光的工件在前平面边缘抛光位置

3. 发明授权

US06402596B1 Single-side polishing method for substrate edge, and apparatus therefor 失效
标题翻译：基板边缘的单面抛光方法及其装置
公开(公告)号：US06402596B1
公开(公告)日：2002-06-11
申请号：US09644995
申请日：2000-08-24
申请人： Shunji Hakomori , Toru Asai , Noriaki Mizuno
发明人： Shunji Hakomori , Toru Asai , Noriaki Mizuno
IPC分类号： B24B2112
CPC分类号： B24B9/065 , B24B21/002
摘要： A single-side polishing method, and an apparatus therefor, for the upper surface and the end face of a substrate edge with a polishing strip are provided. The apparatus comprises a substrate holding member rotatably holding the substrate and a supporting a member capable of coming into contact with and retreating from the substrate holding member; a moving section pressed by a force imparting member against a single side and an end face of the substrate edge via the polishing strip is arranged so that the polishing strip polishes the side and the end face of the substrate edge upon rotation of the substrate.
摘要翻译：提供了具有抛光带的基板边缘的上表面和端面的单面抛光方法及其设备。该装置包括可旋转地保持基板的基板保持构件和能够与基板保持构件接触和退回的构件的支撑件; 通过经由研磨带将力施加部件压靠在基板边缘的单侧和端面上的移动部分被布置成使得抛光条在基板转动时抛光基板边缘的侧面和端面。

4. 发明授权

US06290580B1 Polishing method for silicon wafers which uses a polishing compound which reduces stains 失效
标题翻译：使用减少污渍的抛光化合物的硅晶片的抛光方法
公开(公告)号：US06290580B1
公开(公告)日：2001-09-18
申请号：US09390772
申请日：1999-09-07
申请人： Hiroaki Tanaka , Akitoshi Yoshida , Yoshihisa Ogawa , Yusuke Inoue , Shunji Hakomori
发明人： Hiroaki Tanaka , Akitoshi Yoshida , Yoshihisa Ogawa , Yusuke Inoue , Shunji Hakomori
IPC分类号： B24B100
CPC分类号： B24B37/0056 , B24B9/065 , B24B37/044 , C09G1/02
摘要： The present invention provides a polishing compound which does not make stain grow on the surface of work-piece comprising, the dispersion containing 1-30 wt. % of metal oxide particles having 8-500 nm average diameter, acid or alkali and salt, and whose pH is 7-12. Desirably said polishing compound is the compound in which water soluble organic solvent is contained. Further, present invention provides edge polishing method and surface polishing method by use of said polishing compound.
摘要翻译：本发明提供了在工件表面上不会使污渍生长的抛光化合物，其包含：含有1-30wt。％的平均直径为8-500nm的金属氧化物颗粒，酸或碱和盐，其pH为7-12。理想地，所述抛光化合物是含有水溶性有机溶剂的化合物。此外，本发明通过使用所述研磨化合物提供边缘抛光方法和表面抛光方法。

5. 发明授权

US6159081A Method and apparatus for mirror-polishing of workpiece edges 失效
标题翻译：用于工件边缘镜面抛光的方法和装置
公开(公告)号：US6159081A
公开(公告)日：2000-12-12
申请号：US148609
申请日：1998-09-04
申请人： Shunji Hakomori
发明人： Shunji Hakomori
IPC分类号： B24B9/06 , B24B27/00 , B24B1/00
CPC分类号： B24B9/065 , B24B27/0023
摘要： Two cylindrical polishing drums 2 and 2, each having a polishing work surface 2a on their outer circumference, are disposed at an interval smaller than the diameter of a workpiece 7. The polishing drums 2 and 2 are rotated at a required speed, and a chamfered edge 7a of the outer circumference of the workpiece held by a workpiece holding means 3a is pressed against both polishing drums at the same time to mirror-polish the edge 7a at two different points.
摘要翻译：两个圆柱形抛光滚筒2和2在其外圆周上具有抛光工作表面2a以比工件7的直径小的间隔设置。抛光滚筒2和2以所需的速度旋转，并且被倒角由工件保持装置3a保持的工件的外周边缘7a同时被压在两个抛光滚筒上，以在两个不同的点处对边缘7a进行镜面抛光。

6. 发明授权

US06250995B1 Apparatus for polishing outer periphery of workpiece 失效
标题翻译：用于抛光工件外周的装置
公开(公告)号：US06250995B1
公开(公告)日：2001-06-26
申请号：US09403585
申请日：1999-12-16
申请人： Shunji Hakomori
发明人： Shunji Hakomori
IPC分类号： B24B906
CPC分类号： B24B9/065 , B24B41/061 , B24B49/16
摘要： To provide a small polishing means featuring high machining efficiency that is capable of efficiently and quickly mirror-polishing an outer periphery of a chamfered workpiece (5) by bringing the outer periphery into even contact with a plurality of polishing drums (2, 2) at the same time. In an apparatus for polishing an outer periphery by bringing an outer periphery of the workpiece (5) retained by workpiece retaining means (3a, 3b) into contact with two polishing drums (2, 2) simultaneously to perform mirror polishing, the workpiece retaining means (3a, 3b) are supported by a sliding mechanism (16) such that they may move in a direction in which the two polishing drums (2, 2) are arranged, thereby to form an aligning means. In addition, the workpiece retaining means (3a, 3b) are provided with loading means (30) for absorbing a force applied to the workpiece retaining means in an X direction, the force being generated due to contact between the rotating workpiece (5) and the polishing drums (2, 2).
摘要翻译：为了提供一种具有高加工效率的小型抛光装置，其能够通过使外周与多个研磨滚筒（2,2）均匀地接触而能够有效且快速地对斜面工件（5）的外周进行镜面抛光同一时间。在通过使由工件保持装置（3a，3b）保持的工件（5）的外周同时与两个抛光滚筒（2,2）同时进行抛光的外周抛光的装置中，进行镜面抛光，工件保持装置（3a，3b）由滑动机构（16）支撑，使得它们可以沿着布置两个抛光滚筒（2,2）的方向移动，从而形成对准装置。另外，工件保持装置（3a，3b）设置有用于吸收沿X方向施加到工件保持装置的力的装载装置（30），该力由于旋转工件（5）和抛光滚筒（2,2）。

7. 发明授权

US6139408A Surface grinding machine and carrier used therefor 失效
标题翻译：表面磨床及其用途
公开(公告)号：US6139408A
公开(公告)日：2000-10-31
申请号：US270364
申请日：1999-03-16
申请人： Shunji Hakomori
发明人： Shunji Hakomori
IPC分类号： B23Q7/04 , B24B7/22 , B24B37/04 , B24B37/27 , B24B37/28 , H01L21/304 , H01L21/68 , H01L21/683
CPC分类号： B23Q7/04 , B24B37/08 , B24B37/28 , B24B37/345
摘要： In order to take a ground work W out of a work-holding hole of a carrier by chucking the outer periphery of the work W, a surface grinding machine is provided with chucking means for chucking the outer periphery of the work W by a plurality of claw members and a plurality of cutouts into which the claw members of the chucking means can be inserted are made in the edge of the work-holding hole of the carrier, and the ground work W in the work-holding hole is taken out at the position of the cutouts.
摘要翻译：为了通过夹紧工件W的外周将载体W从工件保持孔中取出，表面研磨机设置有用于通过多个工件W夹持工件W的外周的夹紧装置爪部件和夹持装置的爪部件能够插入的多个切口形成在承载件的工作保持孔的边缘中，并且工件保持孔中的接地工件W在切口的位置。

8. 发明授权

US06773335B2 Apparatus for polishing periphery of device wafer and polishing method 失效
标题翻译：用于抛光装置晶片周边的装置和抛光方法
公开(公告)号：US06773335B2
公开(公告)日：2004-08-10
申请号：US10116327
申请日：2002-04-04
申请人： Shunji Hakomori
发明人： Shunji Hakomori
IPC分类号： B24B719
CPC分类号： B24B37/042 , B24B9/065
摘要： When a device wafer is chucked and is rotated about an axis thereof, arc-shaped work faces of first and second inclined-face-polishing members are brought into line-contact with inclined faces disposed at front and rear faces, respectively, of the device wafer, the arc-shaped work face of a peripheral-face-polishing member is brought into line-contact with a peripheral face of the device wafer, and a disc-shaped work face of a peripheral-edge-polishing member is brought into planar contact with the front face of the device wafer at a peripheral edge thereof, whereby the inclined faces, the peripheral face, and the peripheral edge are polished simultaneously by the respective polishing members. Thus, an unnecessary part of a metallic film is removed from the periphery of the device wafer.
摘要翻译：当装置晶片被夹紧并围绕其轴线旋转时，第一和第二倾斜面抛光构件的弧形工作面分别与设置在装置的前后表面上的倾斜面线接触圆周面抛光部件的圆弧状工作面与装置晶圆的周面线接触，将周边抛光部件的圆盘状工作面成为平面状在其周边与设备晶片的正面接触，由此各个抛光件同时抛光倾斜面，周面和周缘。因此，金属膜的不需要的部分从器件晶片的周边去除。

9. 发明授权

US06478660B2 Apparatus of and method for polishing the outer circumferential portions of a circular plate-shaped work 失效
标题翻译：用于抛光圆形板状工件的外圆周部分的装置和方法
公开(公告)号：US06478660B2
公开(公告)日：2002-11-12
申请号：US10053084
申请日：2001-11-07
申请人： Shunji Hakomori , Noriaki Mizuno , Hiroshi Nishi
发明人： Shunji Hakomori , Noriaki Mizuno , Hiroshi Nishi
IPC分类号： B24B719
CPC分类号： B24B9/065 , B24B27/0076
摘要： A pair of edge polishing members (13a, 13b) each having a recess arcked working surface (22) are located on both sides of a diameter direction of a circular plate-shaped work (1) which is held by a chuck means (12) and is rotatable therewith, with the axes of the respective polishing members being inclined with respect to the axis (L) of the work (1), in a manner such that the working surface (22) of one edge polishing member (13a) gets in contact with the edge portion (2a) on the front side of the work (1), while the working surface (22) of the other edge polishing member (13b) gets in contact with the edge portion (2b) on the back side of the work (1), thereby polishing the two edge portions (2a, 2b).
摘要翻译：每个具有凹陷工作表面（22）的一对边缘抛光构件（13a，13b）位于由卡盘装置（12）保持的圆板形工件（1）的直径方向的两侧上，并且能够以相对于工件（1）的轴线（L）倾斜的方式使各研磨部件的轴线以一边缘抛光部件（13a）的工作面（22）得到与工件（1）的前侧上的边缘部分（2a）接触，而另一边缘抛光构件（13b）的工作表面（22）与背面的边缘部分（2b）接触，的工件（1），从而抛光两个边缘部分（2a，2b）。

10. 发明授权

US6155908A Work-loading method and surface-grinding apparatus with work position deviation-adjusting mechanism 失效
标题翻译：工作装载方式和工作位置偏差调整机构的表面磨削装置
公开(公告)号：US6155908A
公开(公告)日：2000-12-05
申请号：US271944
申请日：1999-03-18
申请人： Shunji Hakomori
发明人： Shunji Hakomori
IPC分类号： B24B37/04 , B24B37/08 , B24B37/27 , B24B37/28 , H01L21/304 , B24B1/00 , B24B47/02
CPC分类号： B24B37/08 , B24B37/345
摘要： There are provided with a carrier having a work-holding hole in which a work is fitted and held, a surface plate for grinding the work held on the carrier, and exciter for exciting the carrier to adjust a position of the work deviated from the work-holding hole. Exciting the carrier by the exciter causes a position of the work, deviated from the work-holding hole, to be adjusted, thereby causing the work to be fitted in the work-holding hole.
摘要翻译：设置有具有安装工件的工作保持孔的承载件，用于研磨保持在承载件上的工件的表面板以及用于激励承载件的激励器以调整工作偏离工件的位置保持孔。通过励磁机激励载体，导致工件的偏离工作保持孔的位置被调节，从而使工件安装在工作保持孔中。

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